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Composite electronic element and preparation method therefor

A technology of electronic components and electrode layers, applied in fixed capacitor parts, multilayer capacitors, fixed capacitor dielectrics, etc., can solve the problems of low mounting efficiency, multiple circuit space, and unfavorable miniaturization of the whole machine.

Inactive Publication Date: 2017-02-15
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In many circuit applications, when it is necessary to use a circuit with a series structure of resistors and capacitors, discrete components are generally used, that is, resistors are mounted outside the capacitors, and the mounting efficiency is low, forming a single resistor and a single capacitor, which takes up more circuits. Space is not conducive to the miniaturization of the whole machine

Method used

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  • Composite electronic element and preparation method therefor
  • Composite electronic element and preparation method therefor
  • Composite electronic element and preparation method therefor

Examples

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preparation example Construction

[0073] The flowchart of the preparation method of the composite electronic component of one embodiment is as follows Figure 14 As shown, the following steps S110-S140 are included.

[0074] S110, providing a ceramic body.

[0075] Wherein, the ceramic body is a cuboid, and the ceramic body has a first main surface and a second main surface opposite to each other, a first side surface and a second side surface opposite to each other, and a first end surface and a second end surface opposite to each other. The inside of the ceramic body is filled with a ceramic medium, and a plurality of first electrode layers and a plurality of second electrode layers are interspersed in the ceramic medium, and the first electrode layers and the second electrode layers are alternately stacked, and the first electrode layers are on the second electrode layers The projection of has an overlapping portion with the second electrode layer. A ceramic medium is filled between the first electrode la...

Embodiment 1

[0120] Preparation of composite electronic components

[0121] 1) Preparation of a ceramic body: ceramic powder, a binder and an organic solvent are mixed to obtain a ceramic slurry, and a plurality of ceramic dielectric films are formed by casting the ceramic slurry as a raw material. Wherein, the ceramic slurry includes 10 parts of ceramic powder, 4 parts of binder and 5 parts of organic solvent in parts by mass. The ceramic powder is barium titanate ceramics, the binder is polyvinyl butyral, and the organic solvent is a mixed solvent of toluene and ethanol with a ratio of parts by mass of 1:1. The electrode paste is printed on a plurality of ceramic dielectric films to respectively obtain a ceramic dielectric film printed with a first electrode layer and a ceramic dielectric film printed with a second electrode layer. The screen pattern of the first electrode layer and the second electrode layer is as Figure 18 As shown, the shaded part indicates where the electrode past...

Embodiment 2

[0127] The preparation method of the composite electronic component of this embodiment is similar to that of Embodiment 1, the difference is that in the operation of forming the resistance layer on the ceramic body, the screen printing pattern of the resistance layer is as follows: Figure 16 As shown, the obtained resistive layer includes a first resistive part, a second resistive part and a third resistive part, and the first resistive part, the second resistive part and the third resistive part are connected to form a "T" shape.

[0128] The specific structure of the composite electronic component of this embodiment is as Figure 8 ~ Figure 12 As shown, the equivalent circuit is as Figure 13 shown.

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Abstract

The invention discloses a composite electronic element and a preparation method therefor. According to the composite electronic element, a resistive layer is attached to the first main surface of a ceramic body; a first end electrode is electrically connected with the resistive layer; the resistive layer is electrically connected with a side electrode; at least one place of first electrode layers in the ceramic body is exposed out of a first side surface or a second side surface; at least one place of second electrode layers is exposed out of a second end plane; and the first electrode layers are electrically connected with the side electrode while the second electrode layers are electrically connected with a second end electrode so as to form a capacitor and resistor series structure. Therefore, a condition that the capacitor and the resistor are integrated in a single element is realized; and a smaller size is achieved, so that the space of a complete machine circuit is reduced.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a composite electronic component and a preparation method thereof. Background technique [0002] Capacitors can be used for direct traffic isolation, filtering and energy storage, etc., and have a wide range of applications in power transmission, power distribution, and power consumption. In many circuit applications, when it is necessary to use a circuit with a series structure of resistors and capacitors, discrete components are generally used, that is, resistors are mounted outside the capacitors, and the mounting efficiency is low, forming a single resistor and a single capacitor, which takes up more circuits. Space is not conducive to the miniaturization of the whole machine. Contents of the invention [0003] Based on this, it is necessary to provide a composite electronic component with a smaller size and a preparation method thereof. [0004] A composite...

Claims

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Application Information

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IPC IPC(8): H01G4/30H01G4/40H01G4/12
CPCH01G4/30H01G4/12H01G4/1209H01G4/40
Inventor 陆亨李鸿刚李江竹卓金丽安可荣唐浩宋子峰杨晓东
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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