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A kind of copper-tin-titanium solder and preparation method thereof

A technology of titanium brazing filler metal and brazing filler metal, which is applied in the preparation of copper-tin-titanium filler metal, and in the field of copper-tin-titanium filler metal, can solve the problems of copper-tin-titanium filler metal performance deterioration, Ti element segregation, uneven structure, etc., and achieve a breakthrough The effect of technical bottleneck, high processing efficiency and simple operation

Active Publication Date: 2019-03-08
NORTH CHINA UNIV OF WATER RESOURCES & ELECTRIC POWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the arc smelting method, due to the small arc heating range, the copper-tin-titanium solder prepared each time is less than 1000g, which cannot be industrialized. At the same time, the copper-tin-titanium solder prepared by this method is prone to uneven structure, Ti Partial segregation of elements degrades the performance of copper-tin-titanium solder, making it difficult to use normally
The vacuum smelting method has certain advantages when preparing powdered copper-tin-titanium solder, but when preparing copper-tin-titanium foil strip solder, due to the existence of CuSn brittle phase, the plasticity of the solder is poor and difficult to form. It is easy to bring in impurity elements Fe, C, etc. during the process, which reduces the mechanical properties of copper-tin-titanium solder and cannot meet the actual performance index requirements of the project.
Therefore, arc melting and vacuum melting methods have certain limitations in the preparation of copper-tin-titanium foil strip solder

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A copper-tin-titanium brazing filler metal, comprising a CuSn matrix brazing filler metal and a metal titanium electroplating layer coated outside the CuSn matrix brazing filler metal, between the matrix brazing filler metal and the metal titanium electroplating layer is a solid solution in the CuSn matrix brazing filler metal and metal titanium electroplating The transition layer formed by the diffusion reaction of the CuSn base solder, the transition layer and the titanium electroplating layer are respectively: the base solder 65.0~92.0%, the transition layer 7.5~33.5%, and the metal layer 0.5~1.5%; The thickness of the copper-tin-titanium solder is 15-85 μm; further, the CuSn matrix solder contains not only 55-65% Cu, 34-44.5% Sn, but also 0.4-1.2% Ni by mass. Adding Ni can prevent CuSn matrix solder from forming CuSn brittle compounds, and lay a foundation for the forming of matrix solder.

[0024] The preparation method of copper-tin-titanium solder as mentioned ab...

Embodiment 2

[0033] A CuSnTi brazing filler metal is composed of a base solder BCu60Sn (containing 0.8% Ni) and a metal titanium electroplating layer coated on the outside of the BCu60Sn base solder, and the transition layer is composed of a CuTi compound phase and a SnTiNi compound phase. The thickness percentages of the base solder, the transition layer and the electroplating layer are as follows, the base solder: 92.0%, the transition layer: 7.5%, and the electroplating layer: 0.5%.

[0034] The preparation method of copper-tin-titanium solder as mentioned above comprises the following steps:

[0035] First, 600 g of copper, 392 g of tin, and 8 g of nickel were put into a melting furnace, and formed by casting, annealing, extrusion, and rolling, and prefabricated into a strip-shaped matrix solder BCu60Sn with a thickness of 80 μm; BCu60Sn matrix solder was electroplated with titanium on the front and back (thickness of one side was 15 μm); after the electroplating process was completed,...

Embodiment 3

[0039] A CuSnTi solder is composed of a base solder BCu55Sn (containing Ni 1.0%) and a metal titanium electroplating layer coated outside the BCu55Snu base solder, and the transition layer is composed of a CuTi compound phase and a SnTiNi compound phase. The thickness percentages of base solder, transition layer, and electroplating layer are as follows, base solder: 85.0%, transition layer: 14.0%, and electroplating layer: 1.0%.

[0040] The preparation method of copper-tin-titanium solder as mentioned above comprises the following steps:

[0041] Firstly, put 550 g of metal copper, 440 g of tin, and 10 g of nickel into the melting furnace. After casting, annealing, extrusion, and rolling, it is prefabricated into a strip-shaped matrix solder BCu55Sn with a thickness of 30 μm; BCu55Sn matrix solder was electroplated with titanium on the front and back (thickness on one side was 10 μm); after the electroplating process was completed, it was placed in a vacuum drying oven at 170...

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Abstract

A copper-tin-titanium brazing filler metal, comprising a CuSn matrix brazing filler metal and a metal titanium electroplating layer coated outside the CuSn matrix brazing filler metal, between the matrix brazing filler metal and the metal titanium electroplating layer is a solid solution in the CuSn matrix brazing filler metal and metal titanium electroplating The transition layer formed by the diffusion reaction of the layer. The CuSnTi foil strip brazing filler metal and its preparation method provided by the invention are simple and convenient to operate, break through the technical bottleneck of brazing filler metal preparation in traditional methods, and provide a new green manufacturing method for high-quality active brazing filler metal in a new form. For CuSnTi solder, the content of active element Ti in CuSnTi solder is increased, and the shortcomings of traditional CuSnTi solder that are difficult to form and molten salt system electroplating titanium are overcome. This method has the advantages of easy forming, high processing efficiency, and low cost. , to provide a new technical approach for the manufacture and production of copper-tin-titanium solder.

Description

technical field [0001] The invention relates to brazing materials, in particular to a copper-tin-titanium solder and a preparation method of the copper-tin-titanium solder. Background technique [0002] Copper-tin-titanium brazing filler metal is widely used in brazing of graphite, diamond, etc. problem. [0003] As a strategic light metal, titanium has the advantages of high specific strength and strong corrosion resistance. It is often used in submarines and aircraft, and plays a huge role in the fields of navigation and aviation. Electrodeposition of titanium on the metal surface can play a role in protection and corrosion resistance. Applied in marine, seawater corrosive environments, etc. [0004] The discharge potential of metal titanium is low, and it is difficult to realize the deposition of titanium. At the same time, the electroplating technology of titanium is not mature and perfect. At present, the commonly used methods are as follows: one is the arc ionizatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K35/40
CPCB23K35/302B23K35/40
Inventor 王星星彭进韦乐余崔大田孙国元王建升
Owner NORTH CHINA UNIV OF WATER RESOURCES & ELECTRIC POWER
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