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Encapsulating material of capacitor

A technology for potting materials and capacitors, applied in the field of capacitors, can solve the problems affecting the service life of capacitors, not cold-resistant, inelastic, etc., and achieve the effect of improving adhesion, increasing elasticity and recovery, and high expansion capacity

Inactive Publication Date: 2017-03-22
ANHUI FEIDA ELECTRICAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The potting materials of capacitors are mainly epoxy resin and oil. Epoxy resin is not cold-resistant, brittle, inelastic, and easy to crack after thermal expansion at high temperature.
Oil often contains a certain amount of water, which will gradually penetrate into the capacitor core, seriously affecting the service life of the capacitor

Method used

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  • Encapsulating material of capacitor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] A capacitor potting material, the preparation method of which is as follows:

[0011] (1) Take 3.0 parts of attapulgite and put it into a high-energy ball mill, and grind it into fine powder;

[0012] (2) Take ethylene glycol and cyanate, add them to the mechanical stirring tank in turn, stir at a constant speed, the stirring speed is 3000r / min, the temperature of the reaction tank is 65°C, after stirring for 30min, add attapulgite ground into powder, continue Stir for 1h, and the stirring temperature is 70~80°C to obtain modified polyurethane;

[0013] (3) Take 8.0 parts of modified polyurethane, put it in a reaction kettle, add 3.0 parts of silicone flame retardant, 1.0 parts of asphalt, 1.5 parts of silicone gel in sequence, stir for 30 minutes, the stirring speed is 1500r / min, and the temperature is 70℃ , that is, the potting material.

Embodiment 2

[0015] A capacitor potting material, the preparation method of which is as follows:

[0016] (1) Take 3.5 parts of attapulgite and put it into a high-energy ball mill, and grind it into fine powder;

[0017] (2) Take ethylene glycol and cyanate, add them to the mechanical stirring tank in turn, stir at a constant speed, the stirring speed is 3000r / min, the temperature of the reaction tank is 65°C, after stirring for 30min, add attapulgite ground into powder, continue Stir for 1h, and the stirring temperature is 70~80°C to obtain modified polyurethane;

[0018] (3) Take 9.0 parts of modified polyurethane, put it in the reaction kettle, add 3.5 parts of silicone flame retardant, 1.5 parts of asphalt, 2.0 parts of silicone gel, 3.2 parts of silicone flame retardant, stir for 30 minutes, and the stirring speed is 1500r / min, the temperature is 70°C, and the potting material is obtained.

Embodiment 3

[0020] A capacitor potting material, the preparation method of which is as follows:

[0021] (1) Take 4.5 parts of attapulgite and put it into a high-energy ball mill, and grind it into fine powder;

[0022] (2) Take ethylene glycol and cyanate, add them to the mechanical stirring tank in turn, stir at a constant speed, the stirring speed is 3000r / min, the temperature of the reaction tank is 65°C, after stirring for 30min, add attapulgite ground into powder, continue Stir for 1h, and the stirring temperature is 70~80°C to obtain modified polyurethane;

[0023] (3) Take 9.5 parts of modified polyurethane, put it in the reaction kettle, add 3.5 parts of silicone flame retardant, 1.8 parts of asphalt, 2.8 parts of silicone gel, 3.5 parts of silicone flame retardant, stir for 30 minutes, and the stirring speed is 1500r / min, the temperature is 70°C, and the potting material is obtained.

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Abstract

The invention provides an encapsulating material of a capacitor. The encapsulating material is prepared from raw materials by weight as follows: 3.0-6.0 parts of attapulgite, 8.0-10 parts of polyurethane and 3.0-4.0 parts of an organosilicon flame retardant. A preparation method of the encapsulating material comprises the steps of preparation of attapulgite modified polyurethane and preparation of the encapsulating material. The temperature of the encapsulating material can be changed with change of the temperature of the capacitor, and the temperature requirement in a wide range is met; besides, the material has good weather fastness and ageing-resistant performance and is long in service life, and the service property of the capacitor is greatly improved.

Description

technical field [0001] The invention relates to the field of capacitors, in particular to a capacitor potting material and a preparation method thereof. Background technique [0002] Potting is to properly arrange, assemble, bond, connect and isolate the various parts of the components according to the requirements, so as to protect the various parts of the components. Its function is to strengthen the integrity of the device and improve the ability of external impact, waterproof and corrosion resistance. The potting materials of capacitors are mainly epoxy resin and oil. Epoxy resin is not cold-resistant, brittle, inelastic, and easy to crack after thermal expansion at high temperature. Oil often contains a certain amount of water, which will gradually penetrate into the capacitor core, seriously affecting the service life of the capacitor. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, and provi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J11/04C09J11/08C09J11/06H01L33/56
CPCC08L2203/206C09J11/04C09J11/06C09J11/08C09J175/04H01L33/56C08L95/00C08K13/02C08K3/36C08K5/053C08K3/346C08K5/315
Inventor 胡忠胜华玲萍吴良军
Owner ANHUI FEIDA ELECTRICAL TECH CO LTD
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