Preparation method of functional ceramic backplane
A technology of functional ceramics and ceramics, applied in electrical equipment shell/cabinet/drawer, cabinet/box/drawer parts, layered products, etc., can solve the problems of low strength, easy to be oxidized, increase cost, etc. Achieve the effect of reducing the probability of drop damage, excellent electrical conductivity, and good shock resistance
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[0039] The ceramic back plate prepared by the preparation method provided by the present invention can be applied to the back cover of electronic products such as mobile phones, tablet computers, and smart wearable devices.
[0040] figure 1 The flow chart of the preparation method of the functional ceramic backplane according to the present invention is shown.
[0041] Such as figure 1 As shown, the preparation method of the functional ceramic backboard provided by the present invention includes:
[0042] Step 100: putting the ceramic green body into a degreasing furnace for degreasing, and then putting the degreased ceramic green body into a sintering furnace for sintering to form a ceramic blank.
[0043] In the present invention, the ceramic green body is used to make ceramic sheets, and after the ceramic sheets are processed through a series of processes, each ceramic sheet is finally bonded together to form a ceramic back plate.
[0044] Making ceramic green body can ...
Embodiment 1
[0090] Step a: Take two zirconia green bodies with a thickness of 0.4mm and 1mm prepared by the tape casting method and put them into a degreasing furnace for degreasing, and then put the degreased two ceramic green bodies into a sintering furnace for sintering, Two ceramic blanks are formed.
[0091] The reason for the difference in the thickness of the two zirconia green bodies is that the zirconia green body with a thickness of 1 mm finally forms the appearance surface of the functional ceramic back plate to ensure the better strength of the functional ceramic back plate, while the 0.4 mm thick zirconia green body , to reduce the thickness inside the functional ceramic backplane, thereby reducing the overall thickness of the functional ceramic backplane.
[0092] The thicknesses of the ceramic blanks formed after the degreasing process and the sintering process are 0.2mm and 0.5mm respectively.
[0093] Step b: Perform plane grinding and polishing on the two ceramic blanks...
Embodiment 2
[0100] Step (1): Take three alumina ceramic green bodies with thicknesses of 0.25mm, 0.25mm and 0.70mm prepared by sol-gel process.
[0101] After the degreasing process and the sintering process, the thicknesses of the three ceramic blanks formed are 0.1 mm, 0.1 mm, and 0.3 mm, respectively.
[0102]Step (2): Three ceramic blanks are formed into three ceramic sheets through a plane grinding and polishing process.
[0103] Step (3): The circuit, the antenna assembly and the NFC module are respectively printed on the surfaces of the three ceramic sheets by screen printing, and the antenna and the NFC module are respectively connected to the inside of the product through the holes on the respective ceramic sheets.
[0104] The circuit, antenna assembly and NFC module are all made of copper paste.
[0105] Step (4): three ceramic sheets of printed functional circuits are placed in an atmosphere furnace for sintering.
[0106] The sintering process is as follows: first heat the ...
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Abstract
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