Graphene organic silicon rubber composite material and preparation method thereof

Abstract

The invention discloses a graphene organic silicon rubber composite material. The graphene organic silicon rubber composite material comprises, by weight, 15-39 parts of high-phenyl silicone rubber, 1-40 parts of graphene, 55-98 parts of heat-conduction filler, 1-5 parts of silazane and 1-5 parts of catalyst. The invention further provides a preparation method of the graphene organic silicon rubber composite material. The preparation method includes: evenly mixing the graphene, the heat-conduction filler and the silazane, adding the high-phenyl silicone rubber, primarily mixing, adding the catalyst, evenly mixing, performing compression molding, and curing to obtain the graphene organic silicon rubber composite material. The graphene organic silicon rubber composite material and the preparation method thereof have the advantage that the graphene can be stably and evenly distributed in the high-phenyl silicone rubber and a heat-conduction filler interface to form a compact heat-conduction network so as to increase the heat conductivity of the composite material.

Description

technical field [0001] The invention relates to the technical field of thermal interface materials, in particular to a graphene silicone rubber composite material and a preparation method thereof. Background technique [0002] With the further improvement of the operating frequency of electronic devices, the increase of power capacity and the improvement of efficiency and reliability, especially the higher and higher integration level, the devices are required to be smaller and lighter, which will lead to new electronic systems. These changes will bring major challenges to the packaging and assembly of devices, as well as their reliability, heat dissipation and manufacturability. Although the thermal conductivity of various thermal interface materials on the market has increased to 7W / mk, they are still It cannot keep up with the requirements of the current high-speed development of the electronics industry, so it is very necessary to add a layer of thermal interface materia...

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Problems solved by technology

However, this patent is only suitable for use in the biological living environment covered by the atmosphere, and has certain limitations.

However, the use in special environments such as high temperature and high humidity, high radiation vacuum weightlessness, high radiation nuclear power, and high energy electromagnetic fields will be limited, and its thermal conductivity is poor.

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