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Magnetic glue and inductor device using same

A technology of glue and devices, which is applied in transformer/inductor components, transformer/inductor coils/windings/connections, electrical components, etc., can solve the problems of inductance quality influence, low space utilization, product short circuit, etc., and achieve improvement Inductance, low cost, good effect of fixing on support

Inactive Publication Date: 2017-04-26
SHENZHEN SUNLORD ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The magnetic glue formula in the traditional technology is mostly epoxy resin plus NiZn ferrite, MnZn ferrite, the cost is high, and the ability to increase the inductance is poor
The main skeleton of the inductor in the prior art is nickel-zinc ferrite with a low saturation magnetic flux density, and the magnet structure is the metallization of the magnetic core on the bottom surface. During the bottom soldering process, the bottom is not flat, resulting in repeated soldering, which is likely to cause a short circuit of the product. affect the quality of its inductance
At the same time, the enameled wire adopts a round enameled wire with low space utilization rate, and it is difficult to maintain the corresponding inductance value in a smaller submission and at the same time withstand a larger current

Method used

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  • Magnetic glue and inductor device using same
  • Magnetic glue and inductor device using same
  • Magnetic glue and inductor device using same

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Embodiment Construction

[0027] Embodiments of the present invention will be described in detail below. It should be emphasized that the following description is only exemplary and not intended to limit the scope of the invention and its application.

[0028] In one embodiment, a kind of magnetic glue, is used for the magnetic glue layer of wirewound inductance device, is characterized in that, comprises the mixture of magnetic base material and bonding base material, and described magnetic base material is NiZn ferrite, A mixture of one or more of MnZn ferrite mixed with one or more of metal-based FeNi, carbonyl iron powder, FeSiCr, and FeSi.

[0029] In a preferred embodiment, the magnetic substrate is a mixture of carbonyl iron powder and MnZn ferrite in a mass ratio of 1:1-4:1. In a more preferred embodiment, the mass ratio of carbonyl iron powder to MnZn ferrite is 1:1, 2:1 or 4:1.

[0030] In a preferred embodiment, the bonding substrate comprises a mixture of epoxy resin, toughening agent and...

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Abstract

The invention discloses a magnetic glue which is used for a magnetic glue layer of a wire winding inductor device and contains a mixture of a magnetic substrate and an adhesion substrate; the magnetic substrate is a mixture of one or more of NiZn ferrite and MnZn ferrite and one or more of metal series FeNi, carbonyl iron powder, FeSiCr and FeSi. The invention discloses an inductor device which comprises a magnetic core and a coil winding on the magnetic core; and the magnetic glue is coated on the magnetic core, covers the coil winding and forms the magnetic glue layer which is tightly adhered to the magnetic core after being solidified. Compared with an ordinary inductance device, as for the inductor device adopting the magnetic glue, the mechanical shock resistance is stronger, magnetic flux leakage of a formed closed magnetic circuit structure can be reduced, and the electromagnetic interference resistance is strong.

Description

technical field [0001] The invention relates to a magnetic glue and an inductance device using the magnetic glue. Background technique [0002] In the prior art, the I-shaped winding glue-coated type power inductor with a high degree of automation is more and more widely used. The magnetic glue formula in the traditional technology is mostly epoxy resin plus NiZn ferrite, MnZn ferrite, the cost is high, and the ability to increase the inductance is poor. The main skeleton of the inductor in the prior art is nickel-zinc ferrite with a low saturation magnetic flux density, and the magnet structure is the metallization of the magnetic core on the bottom surface. During the bottom soldering process, the bottom is not flat, resulting in repeated soldering, which is likely to cause a short circuit of the product. The quality of its inductance is affected. At the same time, the enameled wire adopts a round enameled wire with a low space utilization rate, and it is difficult to wi...

Claims

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Application Information

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IPC IPC(8): C09D163/00C09D5/23C09D7/12H01F27/255H01F27/28H01F27/29H01F27/30H01F27/34H01F27/36
CPCC08K3/18C08K3/22C08K7/20C08K9/00C08K13/06C09D7/61C09D7/70C09D163/00H01F27/255H01F27/2847H01F27/29H01F27/306H01F27/346H01F27/36H01F2027/2857
Inventor 于四梅赵卫北
Owner SHENZHEN SUNLORD ELECTRONICS
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