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High temperature-resistant adhesive tape used for photovoltaic assembly battery piece positioning, and production method thereof

A technology for photovoltaic modules and cells, applied in photovoltaic power generation, circuits, adhesives, etc., can solve the problem of difficult to tear the tape, and achieve the effect of improving yellowing and good stability

Inactive Publication Date: 2017-04-26
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, it can solve the problem that the tape is difficult to tear off during the customer's use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] In this embodiment, the preparation of the high-temperature-resistant adhesive tape for positioning photovoltaic module cells includes the following steps:

[0032] S1: coating the f-coating layer on a substrate layer with a thickness of 25 μm, and the coating thickness is 5 μm;

[0033] Wherein the f coating includes organic resin, curing agent and inorganic filler; the weight percentage of organic resin is 10%, the weight percentage of curing agent is 20%, and the weight percentage of inorganic filler is 70%.

[0034] The organic resin in the f coating is a composition of polytetrafluoroethylene fluorocarbon resin and polydifluoroethylene fluorocarbon resin, and the weight of the two is 1:1.

[0035] The curing agent in the f coating is a combination of an isocyanate curing agent and an imidazole curing agent, and the weight of the two is 1:3.

[0036] The inorganic filler in the f coating is a mixture of titanium dioxide, aluminum dioxide and aluminum hydroxide, and...

Embodiment 2

[0041] In this embodiment, the preparation of the high-temperature-resistant adhesive tape for positioning photovoltaic module cells includes the following steps:

[0042] S1: coating the f-coating layer on a substrate layer with a thickness of 30 μm, and the coating thickness is 10 μm;

[0043]Wherein the f coating includes organic resin, curing agent and inorganic filler; the weight percentage of organic resin is 5%, the weight percentage of curing agent is 25%, and the weight percentage of inorganic filler is 70%.

[0044] The organic resin in the f coating is polytetrafluoroethylene fluorocarbon resin.

[0045] The curing agent in the f coating is a composition of a hydrazide curing agent, an amino resin curing agent, an amine curing agent and a dipolycyanamide curing agent, and the weight ratio of the four is 1:2:3 :1.

[0046] Preferably, the inorganic filler in the f coating is a mixture of talcum powder, silicon dioxide and calcium carbonate, and the weight ratio of ...

Embodiment 3

[0051] In this embodiment, the preparation of the high-temperature-resistant adhesive tape for positioning photovoltaic module cells includes the following steps:

[0052] S1: coating the f-coating layer on a substrate layer with a thickness of 50 μm, and the coating thickness is 5 μm;

[0053] Wherein the f coating includes organic resin, curing agent and inorganic filler; the weight percentage of organic resin is 15%, the weight percentage of curing agent is 15%, and the weight percentage of inorganic filler is 70%.

[0054] The organic resin in the f coating is polyvinyl difluoride fluorocarbon resin.

[0055] The curing agent in the f coating is a composition in an isocyanate curing agent, a hydrazide curing agent, an amino resin curing agent and a dipolycyanamide curing agent, and the weight ratio of the four is 2:2: 3:2.

[0056] Preferably, the inorganic filler in the f coating is carbon black.

[0057] The base layer is a polytetrafluoroethylene film.

[0058] S2: ...

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Abstract

The invention discloses a high temperature-resistant adhesive tape used for photovoltaic assembly battery piece positioning. The adhesive tape sequentially comprises an adhesive layer, a substrate layer and an f coating layer from top to bottom, wherein the f coating layer comprises organic resin, a curing agent and an inorganic filler, and the substrate layer is a fluoroplastic film or a polyester film. The invention also provides a production method of the adhesive tape. An acrylic acid adhesive is specially modified, that is, an antioxidant and an ultraviolet absorbent are introduced to an adhesive system in order to greatly improve the yellow stain performance of the adhesive tape. The back side of the substrate layer is coated with the transparent f coating layer, so the substrate layer does not yellow, and makes the stability of the bonding force between the f coating layer surface and the adhesive film good; and the f coating layer has a certain release effect, so the unsmooth operating phenomenon caused by large bonding force between the adhesive surface and the f coating layer surface in the adhesive tape use process of a user is avoided.

Description

technical field [0001] The invention relates to the technical field of adhesive tapes, in particular to a high-temperature-resistant adhesive tape for positioning photovoltaic module cells and a preparation method thereof. Background technique [0002] The core component of the solar module, the cell, will move the cell due to the fluidity of the adhesive film during hot pressing, so the high temperature resistant positioning tape will be used to fix the cell. At present, the high-temperature-resistant positioning tapes used in the market are based on PET and coated with acrylic pressure-sensitive adhesive. However, such products are hot-pressed at high temperatures, which usually leads to deformation, yellowing of the tape and adhesion to the film. Insufficient and other shortcomings. Moreover, since the adhesive surface and the PET substrate are directly rolled, the adhesive force between them will be strong, and it will be difficult for customers to tear off the adhesive...

Claims

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Application Information

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IPC IPC(8): C09J7/02C09J133/08C09J11/06C09J11/08H01L31/048
CPCC08L2201/08C09J7/203C09J7/22C09J7/245C09J11/06C09J11/08C09J133/08C09J2203/322C09J2427/005C09J2427/006H01L31/0481C08L57/02C08L93/04Y02E10/50
Inventor 周琪权陈洪野芋野昌三吴小平
Owner CYBRID TECHNOLOGIES INC
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