Building sealing glue and preparation method thereof
A sealant and construction technology, applied in the field of building gap filling, can solve the problems of easy cracking, cracking, and building waterproofing problems of filling materials.
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preparation example 1
[0093] The preparation of modified curing agent I (a):
[0094] Add 30 parts by weight of E-51 epoxy resin (epoxy equivalent of 185-190g / eq) dropwise to 20 parts by weight of 650 polyamide within 1.5h, control the reaction temperature at 50°C, and react for 2h to obtain the improved Sexual curing agent I(a).
preparation example 2
[0096] The preparation of modified curing agent I (b):
[0097] Add 35 parts by weight of E-51 epoxy resin dropwise to 23 parts by weight of V115 type polyamide within 1.5 hours, control the reaction temperature at 50°C, and react for 2 hours to obtain modified curing agent I(b).
preparation example 3
[0099] The preparation of modified curing agent I (c):
[0100] Add 30 parts by weight of E-51 epoxy resin dropwise to 18 parts by weight of 203 type polyamide within 1.5 hours, control the reaction temperature at 50°C, and react for 2 hours to obtain modified curing agent I(c).
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