Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Implanted flexible neural microelectrode comb, and preparation method and implanting method thereof

A micro-electrode, implantable technology, applied in the field of neurobiomaterials and microelectronics science, can solve the problems of difficult implantation inside the brain, insufficient rigidity, etc.

Active Publication Date: 2017-05-17
BEIJING BCIFLEX MEDICAL TECH CO LTD
View PDF4 Cites 35 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Flexible microelectrodes are compatible with the brain due to their mechanical strength, but are not easily implanted into the brain due to insufficient rigidity. Therefore, it is necessary to study methods for implanting ultra-thin flexible neural electrodes into the deep part of the brain.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Implanted flexible neural microelectrode comb, and preparation method and implanting method thereof
  • Implanted flexible neural microelectrode comb, and preparation method and implanting method thereof
  • Implanted flexible neural microelectrode comb, and preparation method and implanting method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0117] The specific embodiment of the present invention provides a preparation method of the implantable flexible nerve microelectrode comb, such as Figure 4 As shown, the preparation method includes the following steps:

[0118] (1) Spin-coating positive photoresist on the carrier, pre-baking, photoetching the marking pattern, leaving the pad position with photoresist for protection, post-baking the film to remove the residual glue;

[0119] (2) Vapor-deposit or sputter a sacrificial layer on the carrier obtained after step (1), and peel off to form the sacrificial layer and marking patterns;

[0120] (3) In step (2), the side of the carrier where the aluminum sacrificial layer and the marking pattern are formed is spin-coated with a flexible substrate material, followed by pre-baking, exposure, post-baking, and developing treatments to form a flexible substrate layer. Hard film

[0121] (4) Spin-coating positive photoresist on the flexible substrate layer formed in step (3), and fo...

Embodiment 1

[0133] This embodiment provides an implantable flexible nerve microelectrode comb. The flexible nerve microelectrode comb is mainly composed of a flexible substrate layer 1, a flexible insulating layer 2, and a metal Au disposed between the flexible substrate layer 1 and the flexible insulating layer 2. The connecting wire layer 3 is composed of the flexible substrate layer 1 and the flexible insulating layer 2 are made of SU-8 photoresist, the thickness of the flexible substrate layer 1 and the flexible insulating layer 2 are both 5 μm, and the metal Au connecting wire layer 3 The thickness is 100nm.

[0134] The flexible nerve microelectrode comb includes a comb-tooth structure 4, a grid structure 5, a solid structure 6 and a pad 7 which are sequentially connected; the comb-tooth structure 4 is provided with electrode sites 8; and the pad 7 There are welding points on it.

[0135] The metal Au connecting wire layer 3 is composed of a metal Au connecting wire, the line width of t...

Embodiment 2

[0143] This embodiment provides a flexible nerve microelectrode comb, the flexible nerve microelectrode comb is mainly composed of a flexible substrate layer 1, a flexible insulating layer 2, and a metal platinum connecting wire arranged between the flexible substrate layer 1 and the flexible insulating layer 2. The layer 3 consists of the flexible substrate layer 1 and the flexible insulating layer 2 using SU-8, the thickness of the flexible substrate layer 1 and the flexible insulating layer 2 are both 5 μm, and the thickness of the metal platinum connecting wire layer 3 is 100 nm.

[0144] The flexible nerve microelectrode comb includes a comb-tooth structure 4, a grid structure 5, a solid structure 6 and a pad 7 which are sequentially connected; the comb-tooth structure 4 is provided with electrode sites 8; and the pad 7 There are welding points on it.

[0145] The metallic platinum connecting wire layer 3 is composed of metallic platinum connecting wires, the line width of the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides an implanted flexible neural microelectrode comb, and a preparation method and an implanting method thereof. The flexible neural microelectrode comb is mainly composed of a flexible substrate layer, a flexible insulation layer and a metal connection wire layer arranged between the flexible substrate layer and the flexible insulation layer; the flexible neural microelectrode comb comprises a comb-like structure, a grid structure, a solid structure and a welding pad connected in sequence; electrode sites are arranged on the comb-like structure; welding points are arranged on the welding pad; the metal connection wire layer is composed of metal connection wires connecting the electrode sites and the welding points; and the flexible insulation layer is arranged on the surfaces of the electrode sites and the welding points. The flexible neural microelectrode comb prepared according to the method provided by the invention has a wire-grid-plane gradual changing structure, and thus is improved in mechanical stability during a shape changing process. The mechanical property of the implanted flexible neural microelectrode comb is matched with a brain tissue, the implanting areas is small, an inflammatory response of the brain is avoided, and electroencephalogram signals can be stably tracked and measured in a multi-point manner for a long time.

Description

Technical field [0001] The invention belongs to the technical field of neurobiomaterials and microelectronics science and technology, and relates to a flexible nerve microelectrode comb, a preparation method and an implantation method thereof, and in particular to an implantable flexible nerve microelectrode comb, a preparation method and an implantation method thereof. Background technique [0002] Nerve microelectrodes are the key components connecting nerve tissues and external devices, and have broad application prospects in the auxiliary treatment of neurological diseases and cognitive behavior. The quality of nerve microelectrodes directly determines the ultimate performance that can be achieved by the nerve activity recording system or nerve function reconstruction system. An ideal implantable nerve electrode needs to meet the following characteristics: as small as possible implant damage, effective recording And irritation, good biocompatibility and long-term stability. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): A61B5/04A61B5/0478B81C1/00
CPCB81C1/00015B81C1/00166A61B5/24A61B5/291H05K3/0023H05K1/118H05K2201/09681H05K3/007H05K2201/0154H05K1/189A61B5/0031A61B2562/043A61B2562/028A61B2562/125A61B2562/0209A61B2562/164H05K1/028H05K1/09H05K3/14H05K3/28
Inventor 方英王晋芬杜明德管寿梁蔚文静
Owner BEIJING BCIFLEX MEDICAL TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com