An implantable flexible neural microelectrode comb and its preparation method and implantation method
An implantable, micro-electrode technology, applied in the field of neurobiological materials and microelectronics science, can solve problems such as difficult implantation inside the brain, insufficient rigidity, etc.
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[0117] The specific embodiment part of the present invention provides the preparation method of the implantable flexible neural microelectrode comb, such as Figure 4 Shown, its preparation method comprises the following steps:
[0118] (1) Spin-coat positive photoresist on the carrier, pre-baking, photo-etching out the marking pattern, leaving the position of the pad to protect with photoresist, post-baking to harden the film, and removing the residual glue;
[0119] (2) Evaporating or sputtering a sacrificial layer on the carrier obtained after step (1), peeling off to form a sacrificial layer and a marking pattern;
[0120] (3) In step (2), the side of the carrier on which the aluminum sacrificial layer and the marking pattern are formed is spin-coated with a flexible substrate material, which is sequentially subjected to pre-baking, exposure, post-baking and development to form a flexible substrate layer. Hard film;
[0121] (4) Spin-coat positive photoresist on the flex...
Embodiment 1
[0133] This embodiment provides an implantable flexible neural microelectrode comb, which is mainly composed of a flexible substrate layer 1, a flexible insulating layer 2, and metal Au arranged between the flexible substrate layer 1 and the flexible insulating layer 2. The flexible substrate layer 1 and the flexible insulating layer 2 are made of SU-8 photoresist, the thickness of the flexible substrate layer 1 and the flexible insulating layer 2 are both 5 μm, and the metal Au connecting layer 3 The thickness is 100nm.
[0134] The flexible neural microelectrode comb includes a comb-like structure 4, a grid structure 5, a solid structure 6 and a pad 7 connected in sequence; the comb-like structure 4 is provided with electrode sites 8; the pad 7 There are welding points on it.
[0135] The metal Au connection line layer 3 is composed of a metal Au connection line, the line width of the metal Au connection line is 10 μm, and the metal Au connection line connects the electrode...
Embodiment 2
[0143] This embodiment provides a kind of flexible neural microelectrode comb, which mainly consists of a flexible substrate layer 1, a flexible insulating layer 2 and a metal platinum connecting wire arranged between the flexible substrate layer 1 and the flexible insulating layer 2 The material used for the flexible substrate layer 1 and the flexible insulating layer 2 is SU-8, the thickness of the flexible substrate layer 1 and the flexible insulating layer 2 are both 5 μm, and the thickness of the metal platinum connecting wire layer 3 is 100 nm.
[0144] The flexible neural microelectrode comb includes a comb-like structure 4, a grid structure 5, a solid structure 6 and a pad 7 connected in sequence; the comb-like structure 4 is provided with electrode sites 8; the pad 7 There are welding points on it.
[0145] The metal platinum connection line layer 3 is composed of metal platinum connection lines, the line width of the metal platinum connection line is 5 μm, and the me...
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