Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method

一种金属表面处理、咪唑化合物的技术，应用在咪唑化合物、金属表面处理液、金属的表面处理、及层合体的制造领域，能够解决布线易发生短路等问题，达到氧化优异、氧化抑制的效果

Active Publication Date: 2017-05-17
TOKYO OHKA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case where the interval between wirings is narrow, there is a problem that the wirings tend to be short-circuited due to the generation of dendrites (which are generated by migration) of the metal compound

Method used

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  • Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method
  • Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method
  • Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-1

[0138] In Example 1-1, an imidazole compound having the following structure was synthesized as Additive 1.

[0139]

[0140]

[0141] 400 g of the raw material compound (1-(3-(4-methoxyphenyl)acryloyl)imidazole) having the structure of the above formula was put into a drier together with water, and heated at 60° C. for 1 month. This was repulped and washed with 4000 g of ethyl acetate at room temperature, and filtered and rinsed twice with 400 g of ethyl acetate to obtain a wet powder 1 . Wet powder 1 was reslurried and washed with 4000 g of ethyl acetate again, and filtered and rinsed twice with 400 g of ethyl acetate to obtain wet powder 2 . The wet powder 2 was dried at 40° C. under reduced pressure to obtain 300 g of the target additive 1 (3-imidazolyl-3-(4-methoxyphenyl)propionic acid). The purity of Additive 1 was determined to be above 99.9% by HPLC.

[0142] determination 1 The results of H-NMR are shown below.

[0143] 1 H-NMR (DMSO-d6): 7.82(1H), 7.31-7.40...

Embodiment 1-2

[0157] 380 g of Additive 1 was obtained in the same manner as in Example 1-1, except that 4 g of imidazole was added to 400 g of the raw material compound and the heating time was changed from 1 month to 2 weeks. The purity of the obtained Additive 1 was determined to be 99.9% or more by HPLC.

Embodiment 1-3

[0159] First, 30 g of the raw material compound used in Example 1-1 was dissolved in 200 g of methanol, and then 7 g of potassium hydroxide was added to the methanol. Next, the methanol solution was stirred at 40°C. Methanol was distilled off, and the residue was suspended in 200 g of water. To the obtained suspension, 200 g of tetrahydrofuran was mixed, stirred, and the aqueous phase was liquid-separated. Under ice cooling, 4 g of hydrochloric acid was added and stirred, and then 100 g of ethyl acetate was mixed and stirred. The mixture was allowed to stand, and the oily phase was separated. The target substance was crystallized from the oil phase, and the precipitate was recovered to obtain Additive 1.

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Abstract

This invention provides: a new imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and the oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. Metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.

Description

technical field [0001] The present invention relates to an imidazole compound, a metal surface treatment liquid containing the imidazole compound, a metal surface treatment method using the metal surface treatment liquid, and a method for producing a laminate having metal wiring using the metal surface treatment liquid. Background technique [0002] The miniaturization and high integration of printed wiring boards and various electrical and electronic components have been progressing in response to the demand for miniaturization and high performance of various electronic devices. Therefore, in printed wiring boards and electric / electronic components, thinning of metal wirings and narrowing of intervals between wirings are progressing. Among the printed wiring boards and various electric and electronic components, metals such as copper, silver, tin, lead, zinc, aluminum, nickel, gold, and alloys thereof are widely used in view of excellent electrical conductivity and processa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07D233/60C23C22/02C23C22/05C23F11/00G03F7/004G03F7/039H05K3/28
CPCC07D233/60C23C22/02C23C22/05C23F11/00G03F7/004G03F7/039H05K3/28C23F11/149C08K5/3445G03F7/031G03F7/038G03F7/162G03F7/168G03F7/20G03F7/322G03F7/40H05K1/09H05K3/4644H05K2201/032
Inventor 石川达郎野田国宏大内康秀千坂博树盐田大前田幸嗣井本隆文藤田浩平赤井泰之
Owner TOKYO OHKA KOGYO CO LTD
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