Method for efficiently and continuously preparing metal film by vertically and completely immersing negative pole in equipotential mode
A metal thin film, equipotential technology, applied in the direction of electrodes, electrolytic components, electrolytic process, etc., can solve the problems of scratching the cathode surface, hydrogen evolution accumulation, high production cost, etc., to improve efficiency, avoid adsorption accumulation, and increase area Effect
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[0027] The technology for preparing metal thin films provided by this patent can efficiently and continuously prepare various metal or alloy thin films. The process flow for preparing iron-nickel alloy thin films and copper metal thin films is now taken as examples for further description.
example 1
[0028] Example 1: Preparation of Fe-Ni alloy film
[0029] Plating solution composition:
[0030] Nickel sulfate 85g / L, boric acid 40g / L, sodium chloride 30g / L, sodium citrate 13g / L, ferrous sulfate 15g / L, ascorbic acid 4g / L, sodium lauryl sulfate 0.2g / L, benzoate Sodium sulfonate 0.3g / L, butynediol 0.4g / L, saccharin 2g / L.
[0031] Process steps:
[0032] (1) Prepare the electroplating solution and stir it fully to adjust the pH to 2.6;
[0033] (2) Hang the titanium basket with iron and nickel particles on the porous separator to form an anode system; assemble the cathode annular belt, and adjust the tension of the annular belt to a suitable size, and adjust the position of the separator so that the distance between the cathode and the anode is 35mm;
[0034] (3) Add the plating solution into the liquid collection tank, and after the temperature is heated to 50°C, open the plating solution circulating filter system, and adjust the flow rate of the plating solution to 20L / m...
example 2
[0037] Example 2: Preparation of Copper Metal Film
[0038] Plating solution composition:
[0039] Copper sulfate 200g / L, sulfuric acid 55g / L, copper tetrahydrothiazole sulfur 0.001g / L, sodium phenyl polydithiopropane sulfonate 0.02g / L, polyethylene glycol 0.05g / L, sodium lauryl sulfate 0.2g / L.
[0040] Process steps:
[0041] (1) Prepare the electroplating solution and stir it well;
[0042] ⑵Put phosphorus copper particles containing 0.1%-0.3% phosphorus into the titanium basket and hang on the porous separator to form an anode system; assemble the cathode annular belt, and adjust the tension of the annular belt to a suitable size, and adjust the position of the separator so that The distance between cathode and anode is 30mm;
[0043] (3) Add the plating solution into the liquid collection tank, and after the temperature is heated to 25°C, open the plating solution circulating filter system, and adjust the flow rate of the plating solution to 15L / min;
[0044] ⑷Turn on t...
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