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Method for efficiently and continuously preparing metal film by vertically and completely immersing negative pole in equipotential mode

A metal thin film, equipotential technology, applied in the direction of electrodes, electrolytic components, electrolytic process, etc., can solve the problems of scratching the cathode surface, hydrogen evolution accumulation, high production cost, etc., to improve efficiency, avoid adsorption accumulation, and increase area Effect

Active Publication Date: 2017-05-24
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the current electrodeposition method also has relatively large deficiencies, mainly manifested in that the hydrogen evolution in the plating solution is easy to accumulate at the cathode, which affects the overall quality of the product; the efficiency of the electrodeposition method to prepare metal thin films is low, and the production cost is high, which cannot meet large-scale industrial production.
[0004] Chinese patent CN100564606C introduces a method for preparing metal thin films by electrodeposition. However, there are many defects in this method, and the electrodeposition efficiency is low. At the same time, the bottom of the cathode belt is horizontal, and the hydrogen evolution of the cathode will gradually accumulate on the bottom surface, which is prone to hydrogen embrittlement, foaming and other problems, which will affect the quality of the coating; and the insulation treatment used on the inside of the cathode has been in the electroplating environment for a long time It is easy to break and fall off, which will affect the integrity of the peeling of the coating. The electrical connection method of the cathode is also easy to scratch the surface of the cathode, which seriously damages the quality of the coating.
U.S. Patent US20010042686A1 uses circular rolls to prepare thin films. This method also has a series of problems such as hydrogen evolution accumulation and low electrodeposition efficiency, which is not conducive to large-scale and efficient preparation of metal thin films.

Method used

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  • Method for efficiently and continuously preparing metal film by vertically and completely immersing negative pole in equipotential mode
  • Method for efficiently and continuously preparing metal film by vertically and completely immersing negative pole in equipotential mode
  • Method for efficiently and continuously preparing metal film by vertically and completely immersing negative pole in equipotential mode

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Embodiment

[0027] The technology for preparing metal thin films provided by this patent can efficiently and continuously prepare various metal or alloy thin films. The process flow for preparing iron-nickel alloy thin films and copper metal thin films is now taken as examples for further description.

example 1

[0028] Example 1: Preparation of Fe-Ni alloy film

[0029] Plating solution composition:

[0030] Nickel sulfate 85g / L, boric acid 40g / L, sodium chloride 30g / L, sodium citrate 13g / L, ferrous sulfate 15g / L, ascorbic acid 4g / L, sodium lauryl sulfate 0.2g / L, benzoate Sodium sulfonate 0.3g / L, butynediol 0.4g / L, saccharin 2g / L.

[0031] Process steps:

[0032] (1) Prepare the electroplating solution and stir it fully to adjust the pH to 2.6;

[0033] (2) Hang the titanium basket with iron and nickel particles on the porous separator to form an anode system; assemble the cathode annular belt, and adjust the tension of the annular belt to a suitable size, and adjust the position of the separator so that the distance between the cathode and the anode is 35mm;

[0034] (3) Add the plating solution into the liquid collection tank, and after the temperature is heated to 50°C, open the plating solution circulating filter system, and adjust the flow rate of the plating solution to 20L / m...

example 2

[0037] Example 2: Preparation of Copper Metal Film

[0038] Plating solution composition:

[0039] Copper sulfate 200g / L, sulfuric acid 55g / L, copper tetrahydrothiazole sulfur 0.001g / L, sodium phenyl polydithiopropane sulfonate 0.02g / L, polyethylene glycol 0.05g / L, sodium lauryl sulfate 0.2g / L.

[0040] Process steps:

[0041] (1) Prepare the electroplating solution and stir it well;

[0042] ⑵Put phosphorus copper particles containing 0.1%-0.3% phosphorus into the titanium basket and hang on the porous separator to form an anode system; assemble the cathode annular belt, and adjust the tension of the annular belt to a suitable size, and adjust the position of the separator so that The distance between cathode and anode is 30mm;

[0043] (3) Add the plating solution into the liquid collection tank, and after the temperature is heated to 25°C, open the plating solution circulating filter system, and adjust the flow rate of the plating solution to 15L / min;

[0044] ⑷Turn on t...

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Abstract

The invention discloses a method for efficiently and continuously preparing a metal film by vertically and completely immersing a negative pole in an equipotential mode, and belongs to the field of film material manufacturing. A closed hoop shaped metal strip serves as the negative pole, the negative pole is vertically installed, the side of the negative pole is perpendicular to the bottom face of a plating bath, film plating is conducted in a bidirectional electro-deposition mode, and the closed hoop shaped negative pole is completely immersed in a plating solution during film plating. By adoption of the method, the deposition problem of the inner side of the closed hoop shaped negative pole is effectively solved; and meanwhile, influence of hydrogen evolution accumulation on the quality of the metal film is avoided, and the metal film is efficiently and continuously prepared.

Description

technical field [0001] The invention belongs to the field of thin film material manufacturing, and in particular relates to a method for efficiently and continuously preparing metal thin films with equipotential vertical fully submerged cathodes. Background technique [0002] With the rapid development of the electronic information industry, metal thin films with special properties have been widely used in the fields of electronic engineering and micro devices. [0003] There are many methods for preparing metal thin films, such as rolling, spraying, twin-roll ultra-quick cooling, electrodeposition, etc. Compared with other methods, the preparation of metal thin films by electrodeposition has unique advantages. Its advantages are: the crystal grains are small and can reach the nanometer level; the thickness and composition are uniform and controllable; the equipment is simple and easy to operate; and the economic benefits are high. However, the current electrodeposition met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/12C25D17/00
CPCC25D17/00C25D17/12
Inventor 王群周东伟陈志强
Owner BEIJING UNIV OF TECH