Metallic copper particles, and production method therefor

A technology of copper particles and metal, which is applied in the field of metallic copper particles, can solve problems such as the inability to easily prepare metallic copper particles, and achieve the effect of low volume resistance

Inactive Publication Date: 2017-05-24
ISHIHARA SANGYO KAISHA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the methods disclosed in these patent documents, there is a problem that metallic copper particles cannot be easily prepared for some reasons, such as requiring a closed firing facility for firing in a reducing atmosphere.

Method used

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  • Metallic copper particles, and production method therefor
  • Metallic copper particles, and production method therefor
  • Metallic copper particles, and production method therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0216] To 150 ml of pure water, 24 g of industrial copper(II) oxide (N-120 manufactured by NC-Tech Co., Ltd.) and 9.55 g of gelatin (amine value of 23, acid value of 29) as a protective colloid were added. value, amine value-acid value=-6, and a mass average molecular weight of 200000) and mixed, and the temperature of the mixed solution was raised to 80°C. After the temperature was raised, a solution prepared by mixing 1.2 g of aminoethanol as a complexing agent and 99 g of 50% hypophosphorous acid in 150 ml of pure water was added to the mixed solution under stirring, and the resulting mixture was mixed with copper oxide The reaction was performed for one hour, and then the reaction solution was aged for two hours to prepare gelatin-coated copper particles. Thereafter, the copper particles were filtered and washed until the specific conductivity of the filtrate reached below 100 μS / cm, and dried at a temperature of 60° C. under a nitrogen atmosphere for 10 hours to obtain me...

Embodiment 2 to 5

[0218] Metallic copper particles (samples B to E) according to the present invention were obtained in the same manner as in Example 1 except that the amount of gelatin in Example 1 was changed to the amount described in Table 1.

Embodiment 6 to 7

[0220] Metallic copper particles (samples F to G) according to the present invention were obtained in the same manner as in Example 1, except that the reaction temperature set at 80°C in Example 1 was changed to 60°C or 70°C.

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Abstract

Provided are: metallic copper particles exhibiting excellent low-temperature sintering properties at temperatures equal to or lower than 300 DEG C; and a production method therefor. In these metallic copper particles, metallic copper fine particles are adhered to the surfaces of large-diameter metallic copper particles. With regard to the metallic copper particles to be produced, copper oxide and hypophosphoric acid and / or a salt thereof are mixed and reduced, preferably in the presence of 1-500 mass% of gelatin and / or collagen peptide. The reduction reaction temperature is preferably in the range of 20-100 DEG C. The produced metallic copper particles have a volume resistivity value when heated to a temperature of 300 DEG C under a nitrogen atmosphere of 1*10<-2> [omega]*cm or less.

Description

technical field [0001] The present invention relates to metallic copper particles and a method for preparing the metallic copper particles. The invention also relates to dispersions in which the metallic copper particles are blended and methods for preparing the dispersions. The present invention further relates to electrodes, wiring patterns and film coatings formed by using the metallic copper dispersion, and further relates to decorative articles having the film coating formed thereon, antibacterial articles having the film coating formed thereon , and methods for preparing metallic copper-containing films used therein. Background technique [0002] Metallic copper particles are inexpensive materials with good electrical conductivity, and have been widely used as materials for ensuring electrical continuity, such as parts for forming circuits of printed wiring boards, various electrical contact parts, external electrode parts for capacitors etc., and in recent years met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/20B22F1/00H01B1/00H01B1/22H01B5/00H01B13/00B22F1/052B22F1/06B22F1/068B22F1/102B22F1/105B22F1/17
CPCH01B5/00H01B13/00B22F9/24B22F1/068B22F1/105B22F1/052B22F1/102B22F1/17B22F1/06B22F1/09B22F9/20H01B1/22B22F2301/10B22F2009/245B22F2998/10
Inventor 井田清信渡边满友成雅则
Owner ISHIHARA SANGYO KAISHA LTD
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