Metallic copper particles, and production method therefor

Abstract

Provided are: metallic copper particles exhibiting excellent low-temperature sintering properties at temperatures equal to or lower than 300 DEG C; and a production method therefor. In these metallic copper particles, metallic copper fine particles are adhered to the surfaces of large-diameter metallic copper particles. With regard to the metallic copper particles to be produced, copper oxide and hypophosphoric acid and / or a salt thereof are mixed and reduced, preferably in the presence of 1-500 mass% of gelatin and / or collagen peptide. The reduction reaction temperature is preferably in the range of 20-100 DEG C. The produced metallic copper particles have a volume resistivity value when heated to a temperature of 300 DEG C under a nitrogen atmosphere of 1*10<-2> [omega]*cm or less.

Description

technical field

[0001] The present invention relates to metallic copper particles and a method for preparing the metallic copper particles. The invention also relates to dispersions in which the metallic copper particles are blended and methods for preparing the dispersions. The present invention further relates to electrodes, wiring patterns and film coatings formed by using the metallic copper dispersion, and further relates to decorative articles having the film coating formed thereon, antibacterial articles having the film coating formed thereon , and methods for preparing metallic copper-containing films used therein. Background technique

[0002] Metallic copper particles are inexpensive materials with good electrical conductivity, and have been widely used as materials for ensuring electrical continuity, such as parts for forming circuits of printed wiring boards, various electrical contact parts, external electrode parts for capacitors etc., and in recent years met...

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