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Hard alloy extrusion molding agent as well as preparation and application thereof to superfine hard alloy rod material

A technology of cemented carbide and forming agent, applied in metal processing equipment, transportation and packaging, etc., to achieve stable and controllable performance, good shape-dimensional performance, and less defects

Active Publication Date: 2017-05-31
ZHUZHOU HARD ALLOY GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

None of the above forming agents are suitable for the preparation and production of small-diameter ultra-fine cemented carbide PCB rods

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Example 1: Extrusion molding agent, preparation and application thereof to ultrafine hard alloy PCB rods with a diameter of 1.5 mm.

[0027] Extrusion molding agent and its preparation:

[0028] ① 0.16Kg polymethyl methacrylate, 0.08Kg glyceryl stearate, and 0.76Kg methyl benzoate used as binder, surfactant, and solvent respectively are made into 1Kg material, and their mass percentages are respectively: 16% , 8%, 76%; wherein methyl benzoate and glyceryl stearate are liquid, and polymethyl methacrylate is solid (the following examples are the same);

[0029] ② Add the above ingredients into a water bath mixer for mixing and stirring, the heating temperature is 70°C, and the stirring time is 0.8h, and finally the cemented carbide extrusion molding agent is obtained.

[0030] Application of this extrusion molding agent in ultra-fine carbide PCB rods with a diameter of 1.5mm:

[0031] ① Mix 0.1Kg of PEG with 10Kg of cemented carbide raw materials (5% binder phase Co, 0....

Embodiment 2

[0039] Extrusion molding agent, preparation and its application in 2.1mm diameter ultra-fine cemented carbide PCB rods.

[0040] Extrusion molding agent and its preparation:

[0041] 1. 0.128Kg polymethyl methacrylate, 0.064Kg glyceryl stearate, and 1.408Kg methyl benzoate used as binder, surfactant, and solvent respectively are made into 1.6Kg material, and its mass percent is respectively: 8 %, 4%, 88%;

[0042] ②Add the above ingredients into a water bath mixer for mixing and stirring, the heating temperature is 75°C, and the stirring time is 3.0h, and finally the cemented carbide extrusion molding agent is obtained.

[0043] The application of this extrusion molding agent in ultra-fine cemented carbide PCB rods with a diameter of 2.1mm:

[0044] ① Mix 0.4Kg of PEG with 20Kg of cemented carbide raw materials (9% binder phase Co, 1.2% inhibitor Cr 3 C 2 +VC, the balance is 0.4μm superfine WC) into the ball mill containing grinding balls and wet grinding media for mixing ...

Embodiment 3

[0052] Extrusion molding agent, preparation and its application in 1.0mm diameter ultra-fine cemented carbide PCB rod.

[0053] Extrusion molding agent and its preparation:

[0054] ① 0.3Kg polymethyl methacrylate, 0.15Kg glyceryl stearate, and 1.05Kg methyl benzoate used as binder, surfactant, and solvent respectively are made into 1.5Kg material, and their mass percentages are respectively: 20 %, 10%, 70%;

[0055] ②Add the above ingredients into a water bath mixer for mixing and stirring, the heating temperature is 90°C, and the stirring time is 2.0h, and finally the cemented carbide extrusion molding agent is obtained.

[0056] Application of this extrusion molding agent in ultra-fine carbide PCB rods with a diameter of 1.0mm:

[0057] ① Mix 0.3Kg of PEG with 10Kg of cemented carbide raw materials (8% binder phase Co, 0.9% inhibitor Cr 3 C 2 +VC, the balance is 0.2μm superfine WC) into the ball mill containing grinding balls and wet grinding media for mixing and ball m...

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PUM

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Abstract

The invention discloses an extrusion molding agent applicable to a superfine hard alloy PCB (Printed circuit board) rod material. The extrusion molding agent is prepared from 8%-20% of a bonding agent, namely polymethylmethacrylate, 4%-10% of a surfactant, namely glyceryl stearate, and 70%-90% of a solvent, namely methyl benzoate. All the raw materials are added into a water bath stirrer and mixed and stirred to obtain the hard alloy extrusion molding agent. The application of the hard alloy extrusion molding agent to preparation of the superfine hard alloy PCB rod material comprises the following steps: directly adding the superfine hard alloy raw material and 0.8 percent to 3.0 percent of PEG (Polyethylene Glycol) into a ball grinding mill containing a grinding ball and a wet grinding medium, and mixing and carrying out ball grinding; drying and granulating ball grinding paste in vacuum or through atomizing, so as to obtain a hard alloy mixed material containing the PEG; adding the mixed material and 7%-15% of the hard alloy extrusion molding agent into a mixer and uniformly mixing; adding an extruded material into an extruding machine and extruding a superfine PCB rod material blank; drying to remove the solvent in the hard alloy extrusion molding agent; semi-machining the blank and cutting length to form a semi-finished product; and sintering to obtain the superfine hard alloy PCB rod material. The superfine hard alloy PCB rod material is small in bending deformation; the inner part of the product has no defects including pores, cracks and the like; and the performance of the product is stable and controllable.

Description

technical field [0001] The present invention relates to an extrusion molding agent and its preparation, and its application in ultrafine cemented carbide rods, in particular to an extrusion molding agent suitable for ultrafine cemented carbide PCB rods, its preparation, and its application . Background technique [0002] PCB (Printed circuit board) Chinese name is printed circuit board, also known as printed circuit board, printed circuit board, is an important electronic component. Tungsten carbide PCB rods are mainly used to make PCB drill bits, which have excellent characteristics such as high rigidity, high hole position accuracy, good hole wall quality, and long life. With the development of modern industry, the PCB industry requires circuit boards to be made smaller and more powerful, so the number of holes on the current PCB circuit board is increasing, and the aperture is getting smaller and smaller. For high-quality small-diameter Demand for ultra-fine carbide PCB...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/22B22F1/00C22C1/05C22C29/08
CPCC22C1/051C22C29/08B22F3/227B22F1/10
Inventor 龙宁华孟小卫
Owner ZHUZHOU HARD ALLOY GRP CO LTD
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