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Modified polyimide film and preparation method thereof

A polyimide film and modification technology, applied in the field of transparent flexible display, can solve problems such as restricting applications, and achieve the effects of controllable reaction degree, enhanced high temperature resistance, and less solvent residue

Inactive Publication Date: 2017-06-27
WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Polyimide has excellent heat resistance, radiation resistance, chemical resistance, electrical insulation, mechanical properties and other properties, but the traditional commercial PI film is brownish yellow, which is mainly due to the alternating two The strong intramolecular and intermolecular charge transfer complex (Charge Transfer Complex, CTC) spectral absorption caused by the electron-withdrawing effect of anhydride residues and the electron-donating effect of diamine residues greatly limits its application in transparent and flexible display technology. Aspects of application

Method used

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  • Modified polyimide film and preparation method thereof
  • Modified polyimide film and preparation method thereof
  • Modified polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] A kind of preparation method of colorless transparent flexible polyimide film, comprises the following steps:

[0046] 1) At room temperature, mix 0.01mol of 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA) with 0.01mol of 2,2'-bistrifluoromethyl-4,4'-diamino Dissolve diphenyl ether (TFODA) in 250mL of N-methyl-2-pyrrolidone (NMP), add it to the reaction kettle, stir fully under the protection of nitrogen atmosphere, control the temperature at 30°C, and react for 6 hours to obtain polyamide acid solution.

[0047] 2) After the polyamic acid solution is vacuumed and degassed, it is coated on a clean and smooth glass substrate under a nitrogen atmosphere, and the coating thickness is controlled to be 150 μm.

[0048] 3) In a vacuum environment, the above-mentioned glass substrate was baked at 50° C. for 10 minutes to volatilize and extract the solvent NMP.

[0049] 4) In a nitrogen atmosphere, heat at 120°C for 30 minutes, then raise the temperature from 120°C to 4...

Embodiment 2

[0053] A kind of preparation method of modified polyimide film, comprises the following steps:

[0054] 1) At room temperature, mix 0.01mol of 2,3,5,6-bicyclo[2.2.1]heptanetetracarboxylic dianhydride with 0.01mol of 2,2'-bistrifluoromethyl-4,4'- Dissolve diaminodiphenyl ether in 250mL of N-methyl-2-pyrrolidone (NMP), add it to the reaction kettle, stir fully under the protection of nitrogen atmosphere, control the temperature at 20°C, and react for 6 hours to obtain polyamic acid solution.

[0055] 2) After the polyamic acid solution is vacuumed and defoamed, it is coated on a clean and smooth glass substrate under a nitrogen atmosphere, and the coating thickness is controlled to be 100 μm.

[0056] 3) Under a vacuum environment, the above-mentioned glass substrate was baked at 60° C. for 8 minutes to volatilize and extract the solvent NMP.

[0057] 4) In a nitrogen atmosphere, heat at 120°C for 20 minutes, then raise the temperature from 120°C to 450°C at a rate of 20°C / min...

Embodiment 3

[0061] A kind of preparation method of modified polyimide film, comprises the following steps:

[0062] 1) At room temperature, mix 0.01mol of 2,3,5,6-bicyclo[2.2.1]heptanetetracarboxylic dianhydride with 0.0095mol of 1,4-bis(4-amino-2-trifluoromethyl Dissolve phenoxy)benzene in 250mL of N-methyl-2-pyrrolidone (NMP), add it to the reaction kettle, stir fully under the protection of nitrogen atmosphere, control the temperature at 30°C, and react for 6 hours to obtain a polyamic acid solution (PAA).

[0063] 2) After the polyamic acid solution is vacuumed and defoamed, it is coated on a clean and smooth glass substrate under a nitrogen atmosphere, and the coating thickness is controlled to be 50 μm.

[0064] 3) In a vacuum environment, the above-mentioned glass substrate was baked at 70° C. for 4 minutes to volatilize and extract the solvent NMP.

[0065] 4) In a nitrogen atmosphere, heat at 120°C for 15 minutes, then raise the temperature from 120°C to 380°C at a rate of 15°C...

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Abstract

The invention provides a modified polyimide film for a colorless transparent flexible display technique and a preparation method of the modified polyimide film. The modified polyimide film has a structural formula as shown in the specification, in the structural formula, the element R1 as shown in the specification is selected from formulae as shown in the specification; -R2- is selected from one of formulae as shown in the specification; n is a polymerization degree; n is a natural number. Due to addition of two monomers for synthesizing the film, the film is good in thermal resistance and excellent in colorless transparency and flexibility.

Description

technical field [0001] The invention relates to the technical field of transparent flexible display, in particular to a modified polyimide film and a preparation method thereof. Background technique [0002] With the rapid development of modern optoelectronic technology, the field of display technology is developing in the direction of lighter, thinner, softer and more transparent. Thin film substrates made of polymer materials have the characteristics of light weight, flexibility, transparency, and excellent comprehensive performance, which can well meet the requirements of display technology. [0003] The most promising polymer material reported so far for flexible substrates is polyimide (PI). Polyimide has excellent heat resistance, radiation resistance, chemical resistance, electrical insulation, mechanical properties and other properties, but the traditional commercial PI film is brownish yellow, which is mainly due to the alternating two The strong intramolecular an...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08C08G73/10
CPCC08G73/1078C08J5/18C08J2379/08
Inventor 柯霖波
Owner WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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