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Epoxy resin composition, prepreg containing epoxy resin composition, laminated board and printed circuit board

A technology of epoxy resin and composition, which is applied in the direction of printed circuit, synthetic resin layered products, electronic equipment, etc., and can solve the problems of heat resistance or dielectric performance decline of board materials, heat resistance and heat and humidity resistance, etc. , to achieve low thermal expansion coefficient, increase glass transition temperature, and high heat resistance

Active Publication Date: 2017-06-27
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] CN 103304963A solves the problem that the heat resistance or dielectric properties of the plate are reduced after adding a large amount of reactive phosphorus-containing flame retardants and additive flame retardants in the above invention
[0006] However, in the above prior art, there is no mention of how to solve the contradiction between heat resistance and moisture resistance, and how to find a balance between them, which has become one of the technical problems

Method used

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  • Epoxy resin composition, prepreg containing epoxy resin composition, laminated board and printed circuit board
  • Epoxy resin composition, prepreg containing epoxy resin composition, laminated board and printed circuit board
  • Epoxy resin composition, prepreg containing epoxy resin composition, laminated board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Take a container, add 54 parts by weight of KES-7695, add an appropriate amount of MEK and stir until completely dissolved, then add 30 parts by weight of active ester curing agent HPC-8000-65T, 16 parts by weight of cyanate resin CE01PS, dissolve in advance Good curing accelerators DMAP and zinc isooctanoate continue to stir evenly, and finally adjust the liquid solid content to 60% to 80% with a solvent to make a glue. Use glass fiber cloth to impregnate the above glue solution, and control it to an appropriate thickness, then dry to remove the solvent to obtain a prepreg. The prepregs prepared by using several sheets are superimposed on each other, and a piece of copper foil is laminated on both sides of the prepreg, and put into a hot press machine to cure to form the epoxy resin copper-clad laminate. The physical data are shown in Table 1.

[0058] Implementation column 2-4

[0059] The manufacturing process is the same as in Example 1, and the formula compositio...

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PUM

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Abstract

The invention provides an epoxy resin composition, a prepreg containing the epoxy resin composition, a laminated board and a printed circuit board. The epoxy resin composition comprises the following components in parts by weight: (A) 38-54 parts of epoxy resin containing a DCPD (dicyclopentadiene) structure; (B) 30-36 parts of an active ester curing agent; and (C) 16-32 parts of cyanate ester resin. According to the epoxy resin composition disclosed by the invention, by utilizing mutual matching and mutual synergistic effects among three necessary components in a specific content, the epoxy resin composition is obtained. The prepreg, the laminated board and the printed circuit board, prepared from the epoxy resin composition, have low thermal expansion coefficients, low water absorption rates and excellent dielectric properties on premise of having high heat and humidity resistance and high heat resistance.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to an epoxy resin composition and prepregs, laminates and printed circuit boards containing it. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of information and communication equipment, in order to transmit and process large-capacity information at high speed, the operation signal tends to be high-frequency. At the same time, in order to meet the development trend requirements of various electronic products , the circuit board is developing towards the direction of high multi-layer and high wiring density, which requires the substrate material not only to have good dielectric constant and dielectric loss factor to meet the needs of high-frequency signal transmission, but also to have good heat resistance to Meet the needs of multilayer printed circuit board reliability. [0003] C...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/04C08G59/42C08G59/20B32B27/04B32B27/38
CPCB32B9/04C08G59/20C08G59/4223C08L63/00C08L2201/08C08L2203/20B32B2260/046B32B2457/08C08J5/249C08J5/244C08L79/04C08G59/3218C08G59/4014C08G59/4284B32B5/24C08G59/4028C08K3/36C08L75/00H05K1/0366C08K2201/006B32B2305/076H05K1/0373B32B2260/021B32B2262/101B32B2307/204C08J2363/00B32B5/022B32B15/14B32B15/20
Inventor 曾宪平何烈相徐浩晟
Owner GUANGDONG SHENGYI SCI TECH
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