Full color OLED micro-display device manufacturing method

Abstract

The invention discloses a full color OLED micro-display device manufacturing method, and the method comprises the following steps: a wafer substrate comprising a drive circuit is provided, anodic pixel points are manufactured on the wafer substrate, and an anode layer is formed; thermal evaporation is performed on an OLED display device on the anode layer; thin-film packaging is performed on the OLED display device, and a thin-film packaging layer; an RGB color filter is manufactured on the thin-film packaging layer, and a filter layer is formed; a glass cover plate fits the filter layer; the wafer substrate integrated with the drive circuit, the OLED display device, the thin-film packaging layer, the filter layer and the glass cover plate is cut, and a single micro-display chip within one inch is formed. According to the invention, the resolution ratio is improved, the manufacture cost of the device is reduced, and the productivity and the yield of the device are improved.

Description

technical field [0001] The invention relates to the production field of OLED microdisplay devices, in particular to a production method of full-color OLED microdisplay devices. Background technique [0002] Organic electroluminescent devices (OLEDs) have a series of advantages such as full solid state, self-luminescence, fast response speed, wide viewing angle, and wide operating temperature range, and have attracted more and more attention from academia and industry. After years of continuous active exploration, further optimization of the structure and process of the device and related materials, organic electroluminescence has made great progress, and has now achieved industrialization. According to the forecast of relevant research institutions, the output value of OLED panels will exceed 60 billion US dollars in 2020. OLED microdisplay refers to an organic light-emitting device driven by silicon-based CMOS with a display size of less than 1 inch. The pixel size is as h...

AI Technical Summary

Problems solved by technology

The resolution of OLED microdisplay devices is high, the pixels are only a few microns in size, and the positioning accuracy of CCD is also about 1 μm, so the alignment is difficult, the accuracy is poor, and the problem of cross-color is prone to occur, which limits the improvement of device resolution

[0004] In addition, in the traditional manufacturing process of OLED microdisplay devices, the technology of first mechanical scribing and then bonding of small pieces of glass is adopted, and the process is complicated.

Mechanical scribing is the direct action of mechanical force on the wafer surface, causing stress damage inside the wafer. The heat-affected range and residual stress are large, easy to chip and break, and the product yield is low, which is not conducive to mass production.

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