Organic waste gas plasma treatment device and method

A technology for organic waste gas and treatment equipment, which is applied in the direction of separation methods, gas treatment, chemical instruments and methods, etc., can solve the problems of low energy utilization rate, small processing capacity, and high energy consumption per unit treatment, and achieve the improvement of capacity utilization rate and increase The effect of processing capacity and improving removal rate

Inactive Publication Date: 2017-07-07
NANJING YONGYAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Therefore, it is necessary to develop a new plasma technology to solve the problems of low energy utilization rate, small processing capacity and high energy consumption per unit of treatment in the field of existing organic waste gas treatment.

Method used

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  • Organic waste gas plasma treatment device and method

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Experimental program
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Effect test

Embodiment 1

[0031] Start the high-voltage power supply, the power frequency is 25KHz, the voltage is 80KV, the fan is turned on, the content of benzene and toluene organic matter is 20000ppm, the gravure printing waste gas with a flow rate of 11112L / S and the air with a flow rate of 45L / S and a relative humidity of 2% are fed by the air intake The hole 2 enters the reactor 10, and the gas flow is ionized and broken down to form a discharge arc. The length and area of ​​the discharge arc increase with the energy utilization plate, and the exhaust gas rises sharply from normal temperature to a high temperature of several thousand degrees. Under the dual effects of high temperature and high voltage, the industrial waste gas is in a plasma state, benzene and toluene organic substances are ionized and completely cracked, and the treated waste gas is exported through the gas outlet 1. The content of organic matter in the exhaust gas treated by the plasma equipment is 45ppm, the removal rate of o...

Embodiment 2

[0033] Start the high-voltage power supply, the frequency of the power supply is 22KHz, the voltage is 70KV, and the fan is turned on. The content of acetone, isopropanol and ammonia is 15150ppm, the flow rate is 8556L / S. The air inlet 2 enters the reactor 10, and the gas flow is ionized and broken down to form a discharge arc. The length and area of ​​the discharge arc increase with the energy utilization plate, and the exhaust gas rises sharply from normal temperature to a high temperature of several thousand degrees. Under the dual effects of high temperature and high voltage, the industrial waste gas is in a plasma state, benzene and toluene organic substances are ionized and completely cracked, and the treated waste gas is exported through the gas outlet 1. The content of organic matter in the exhaust gas treated by the plasma equipment is 40ppm, the removal rate of organic matter is 99.7%, and the power of the plasma equipment and fan is only 38 kilowatts.

Embodiment 3

[0035] Start the high-voltage power supply, the power frequency is 10KHz, the voltage is 10KV, and the fan is turned on. The organic content of n-butane, n-pentane and other linear alkanes is 10000ppm, and the flow rate is 5530L / S. Air with a humidity of 5% enters the reactor 10 through the air inlet 2, and the air flow is ionized and broken down to form a discharge arc. The length and area of ​​the discharge arc increase with the energy utilization plate, and the exhaust gas rises sharply from normal temperature to a high temperature of several thousand degrees. Under the dual effects of high temperature and high voltage, the industrial waste gas is in a plasma state, benzene and toluene organic substances are ionized and completely cracked, and the treated waste gas is exported through the gas outlet 1. The content of organic matter in the exhaust gas treated by the plasma equipment is 10 mg / m3, the removal rate of organic matter is 99.9%, and the power of the plasma equipmen...

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Abstract

The invention belongs to the technical field of environment protection, and particularly relates to an organic waste gas plasma degradation treatment device. The organic waste gas plasma treatment device is a plasma reactor and comprises a reactor cylinder, a gas inlet located in the top end of the reactor cylinder, a gas outlet in the bottom end of the reactor, a discharging electrode located in the reactor cylinder and a power interface for supplying power to a plasma discharging device; an energy using device for increasing the area and length of a sliding electric arc is arranged on the reactor cylinder, and the energy using device is an arc expanding rod, an arc expanding plate or the combination of the arc expanding rod and the arc expanding plate. The organic waste gas plasma treatment device is capable of increasing the treatment amount of organic waste gas, and the removal rate of the organic waste gas is up to 99.9%, the problem of ozone emission is avoided, and the organic waste gas plasma degradation treatment device can be widely applied to the organic waste gas treatment field.

Description

[0001] Technical field: [0002] A method for treating organic waste gas belongs to the technical field of environmental protection, and specifically relates to a plasma degradation treatment device and method for organic waste gas. [0003] Background technique: [0004] Volatile Organic Compounds (Volatile Organic Compounds) referred to as VOCS refers to hydrocarbons and their derivatives, which are one of the main sources of air pollution. VOCS has brought serious harm to the ecological environment and human health, and posed a severe challenge to global economic development and even human survival. [0005] There are two types of organic waste gas treatment technologies, one is non-destructive methods, which purify and recycle organic waste gas. Such methods include absorption method, adsorption method, condensation method, membrane separation method and so on. This type of method has the disadvantages of high equipment cost and maintenance cost, complicated process flow,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01D53/32
CPCB01D53/32B01D2259/818B01D2257/708B01D2258/00
Inventor 龚联克
Owner NANJING YONGYAN ELECTRONICS
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