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Manufacturing method of LED (Light Emitting Diode) lamp bead

A technology of LED lamp beads and manufacturing methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor consistency, poor uniformity, and wide range of phosphor particle sizes of LED products, and reduce equipment cost. Requirements and operational difficulty, reduce production costs, and improve the effect of good rate

Inactive Publication Date: 2017-07-14
WUHU JUFEI PHOTOELECTRIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is that in the existing LED packaging process, the particle size range of the phosphor powder is wide, the uniformity after mixing with the packaging glue is poor, and the luminous effect of the packaged LED product is not consistent. Fluorescent powder air flow screening device for encapsulating phosphor powder after sieving into different particle sizes and method for manufacturing LED lamp beads using the device

Method used

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  • Manufacturing method of LED (Light Emitting Diode) lamp bead
  • Manufacturing method of LED (Light Emitting Diode) lamp bead
  • Manufacturing method of LED (Light Emitting Diode) lamp bead

Examples

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Embodiment 1

[0034] This embodiment provides a method for manufacturing LED lamp beads. Firstly, phosphor powder is screened by using a fluorescent powder air flow screening device. The structural schematic diagram of the air flow screening device is as follows figure 1 As shown, it includes a screening box 1, the top of the screening box 1 is provided with a feeding port 2 for putting in phosphor powder, and one side of the screening box 1 is provided with a blowing structure 3. The blower mechanism 3 is a conventional blower, and the blower mechanism 3 can be arranged inside the screening box 1 or communicated with the inside of the screening box 1 to blow the air flow into the screening box 1, which is arranged on the side close to the feeding port 2 , and can generate horizontal airflow.

[0035] This embodiment also provides a method for manufacturing an LED lamp bead, which includes the following steps:

[0036] S1. The first fluorescent powder with a particle size of 0.1-100 μm is ...

Embodiment 2

[0042] This embodiment provides a method for manufacturing an LED lamp bead, which includes the following steps:

[0043] S1. The first fluorescent powder with a particle size of 0.1-100 μm is screened by the airflow screening device according to the particle size, and the first fluorescent powder is put into the feeding port 2 of the screening box 1, and the wind speed of the blowing mechanism 3 is blown. 5.5m / s, and the flow direction of the formed airflow is perpendicular to the falling direction of the phosphor powder. After the first phosphor powder falls from the feeding port 2, the airflow formed by the blower mechanism on the side of the feeding port 2 will sieve the first phosphor powder , classify and collect the first fluorescent powder to obtain a pile of fluorescent powder in the range of 3-10 kinds of particle sizes. In this embodiment, the first fluorescent powder is a phosphate phosphor doped with rare earth elements, which emits light The wavelength is 520nm; ...

Embodiment 3

[0049] This embodiment provides a method for manufacturing an LED lamp bead, which includes the following steps:

[0050] S1. The first fluorescent powder with a particle size of 0.1-100 μm is screened by the airflow screening device according to the particle size, and the first fluorescent powder is put into the feeding port 2 of the screening box 1, and the wind speed of the blowing mechanism 3 is blown. is 0.001m / s, and the flow direction of the formed airflow is perpendicular to the falling direction of the fluorescent powder. After the first fluorescent powder falls from the feeding port 2, the airflow formed by the blower mechanism on the side of the feeding port 2 sieves the first fluorescent powder. , classify and collect the first fluorescent powder, and obtain a pile of fluorescent powder in the range of 3-10 particle sizes. In this embodiment, the first fluorescent powder is a nitride phosphor powder doped with rare earth elements, which emits light The wavelength i...

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Abstract

The invention discloses a manufacturing method of an LED lamp bead, which comprises the steps of: firstly, sieving first fluorescent powder and second fluorescent powder, which are large in particle size range, into 3 to 10 fluorescent powder piles different in particle size by adopting a gas flow sieving device; and after uniformly mixing the first fluorescent powder and the second fluorescent powder, which are in the same particle size range, mixing the mixture with packaging glue, after defoaming and uniformly stirring, preparing a fluorescent adhesive, dropwise adding the fluorescent adhesive into a bracket on which an LED chip is arranged, and baking and curing to obtain the LED lamp bead. After the fluorescent powder is sieved by adopting the gas flow sieving device, consistency of the particle sizes of fluorescent powder particles is obviously promoted, so that the mixed fluorescent powder is small in particle size range and is easier to uniformly mix with the packaging glue, requirements for equipment and the operation difficulty in the fluorescent adhesive stirring process are reduced, light intensity and light color consistency of the LED lamp bead are high, the concentration degree of the same batch of products is high, and a good rate of a packaged product is improved; and the fluorescent powder sieving device and a sieving mode are high in automation degree, simple in operation and suitable for large-batch industrial production.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, and in particular relates to a method for manufacturing an LED lamp bead. Background technique [0002] LED (Light Emitting Diode) is a light-emitting diode, which is a semiconductor solid light-emitting device. It uses a solid semiconductor chip as a light-emitting material. When a forward voltage is applied to both ends, the minority carriers and majority carriers inside the semiconductor Recombination occurs, excess energy is released to cause photon emission, and various colors of light are emitted directly. LED light source has the advantages of high efficiency, long life, no harmful substances such as Hg, shock resistance and vibration resistance, and real-time color control. With the rapid development of LED technology, the brightness and life of LED have been greatly improved. The application field of LED is more and more extensive. [0003] In the manufacturing process of LED dev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50
CPCH01L33/50H01L2933/0041
Inventor 邢其彬
Owner WUHU JUFEI PHOTOELECTRIC TECH CO LTD
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