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Method for preparing polyimide film using particles with pores and polyimide film with low dielectric constant

A technology of polyimide film and polyimide precursor is applied in the field of preparation of polyimide film using particles with pores and polyimide film with low dielectric constant, which can solve the problem of insufficient reduction of Dielectric constant, fluorine particles are not easily dispersed, low porosity, etc.

Active Publication Date: 2021-05-07
SKCKOLON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, like this, in the case of performing porous treatment by removing the hydrophilic polymer, it is preferable that the shape of the finely divided structure of the hydrophilic polymer dispersed in the polyimide resin precursor remains as it is. In some cases, pores are formed, but if the imidization treatment is performed directly after removing the hydrophilic polymer by plastic processing or solvent extraction, the porosity will be lower than the ideal value due to the flattening or clogging of the pores, resulting in The problem of not being able to sufficiently lower the dielectric constant
[0006] Korean Patent No. 1299652 has disclosed the structure of using fluorine particles in the preparation of flexible metal laminates. However, this method is for the application of single molecules of fluorine particles, and there are disadvantages that the above-mentioned fluorine particles are not easy to disperse.

Method used

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  • Method for preparing polyimide film using particles with pores and polyimide film with low dielectric constant
  • Method for preparing polyimide film using particles with pores and polyimide film with low dielectric constant
  • Method for preparing polyimide film using particles with pores and polyimide film with low dielectric constant

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preparation example Construction

[0021]The present invention provides a method of preparing a polyimide film, characterized by comprising: step 1) for preparing a polyimide precursor; step 2), mixing the above polyimide precursor and particles containing a pore The imidized conversion solutions come to prepare gel film; and step 3), by performing imidization treatment by heat treatment of the gel film, the above particles having the pores have a average particle diameter of 10 μm or less, relative to The particle density of the natural substance having a pore particles has a particle density of 95% or less.

[0022]The preparation method of the polyimide film of the present invention comprises the step of preparing a polyimide precursor.

[0023]For the polyimide precursor used in the present invention, any substance can be used when it is possible to satisfy the conditions for preparing the polyimide resin by imidization treatment. For example, a polyamic acid can be obtained by copolymerizing acid dihydride ingredoxide...

Embodiment approach

[0052]Hereinafter, the present invention will be described in more detail with the following examples. However, the following examples are for illustrative purposes only, and the scope of the invention is not limited thereto.

preparation example 1

[0054]Preparation 1: Preparation of a polyamic acid solution

[0055]After the 0.5 L reactor was added 320 g of dimethylformamide (DMF, DIMETHYLFORMAMIDE), the temperature was set at 20 ° C, then the 27.59 g of diaminiphenyl ether (ODA, Diaminophenyl ether) was dissolved, followed by 20.03 g of the unit was dissolved after two phenylene methane dialthrhydrides (PMDA, PyRomellitic DianhyDride). After the dissolution, 3.97 g of phenylenediamine was investrated in this, and the solution was measured as a sample as a sample after 30 minutes. After the reaction, the temperature of the reactor was raised to 30 ° C, and 1.00 g of phenylenediamine was investrated, and the molar ratio of the diamine / acid dianhydride was 1: 1. After the start of the raw material, after 2 hours at 40 ° C, the polyamic acid solution was obtained.

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Abstract

The present invention relates to a method for preparing a polyimide film using particles with pores, and a polyimide film with a low dielectric constant prepared according to the above method. The polyimide film according to the present invention has the following characteristics: Particles, that is, particles with an average particle diameter of 10 μm or less and pores with a particle density of 95% or less of the particle density of the inherent substance of the particles can exhibit a lower dielectric constant than conventional polyimide films. Therefore, it can be effectively used in the manufacturing of electrical / electronic equipment and components such as printed circuit boards that require low dielectric constants.

Description

Technical field [0001] The present invention relates to a method for preparing a polyimide film using particles with pores, and a low dielectric constant polyimide film prepared according to the above method. Background technique [0002] Generally, polyimide (PI, Polyimide) resin refers to a polyamic acid derivative prepared by polymerizing aromatic dianhydride and aromatic diamine, or aromatic diisocyanate, and then undergoes a ring-closing dehydration process under high temperature conditions. , a high-temperature resistant resin prepared by imidization treatment. [0003] Polyimide resin is an insoluble, infusible, ultra-high heat-resistant resin that has excellent properties such as thermal oxidation resistance, heat resistance, radiation resistance, low-temperature properties, and chemical resistance, and is widely used in automotive materials. , heat-resistant cutting-edge materials such as aerospace materials and spacecraft materials, and insulating coating agents, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/18C08L79/08C08K7/24C08K7/26C08K7/22C08G73/10
CPCC08G73/10C08G73/1071C08J5/18C08J2379/08C08K7/22C08K7/24C08K7/26C08K2201/003C08L2203/16C08L79/08C08G73/1003C08G2261/65
Inventor 赵成一李吉男金圣原
Owner SKCKOLON
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