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Laminate with low dielectric adhesive layer

A technology of adhesive layers and laminates, applied in the direction of adhesive types, hydrocarbon copolymer adhesives, film/sheet adhesives, etc., can solve the problems of weak adhesion, low dielectric properties, Achieves high solder heat resistance and excellent low dielectric properties due to difficulties in making coverlay films and FPC components such as laminates

Active Publication Date: 2019-06-07
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, base films with low dielectric properties have low polarity, so when conventional epoxy-based adhesives or acrylic-based adhesives are used, the adhesive force is weak and it is difficult to make coverlay films and laminates, etc. Components for FPC
In addition, epoxy-based adhesives or acrylic-based adhesives do not have excellent low dielectric properties, which will damage the dielectric properties of FPC
[0004] On the other hand, polyolefin resins are known to have low dielectric properties

Method used

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Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0159]In a 1 L autoclave, 100 parts by mass of a propylene-butene copolymer (manufactured by Mitsui Chemicals "Tafuma (registered trademark) XM7080"), 150 parts by mass of toluene, 19 parts by mass of maleic anhydride, and di-tert-butyl peroxide were charged. 6 mass parts, after heating to 140 degreeC, it stirred for 3 more hours. Then, after cooling the obtained reaction liquid, it poured into the container which contained a large amount of methyl ethyl ketone, and resin was precipitated. Then, the solution containing the resin was centrifuged to separate and purify the acid-modified propylene-butene copolymer after graft polymerization of maleic anhydride, (poly) maleic anhydride and low molecular weight substances. Then, by drying under reduced pressure at 70°C for 5 hours, a maleic anhydride-modified propylene-butene copolymer (CO-1, acid value 410 equivalents / 10 6 g, weight average molecular weight 60000, Tm 80°C, ΔH 35J / g).

manufacture example 2

[0161] In addition to changing the amount of maleic anhydride added to 11 parts by mass, others were the same as in Manufacturing Example 1 to obtain maleic anhydride-modified propylene-butene copolymers (CO-2, acid value 220 equivalents / 10 6 g, weight average molecular weight 65000, Tm 78°C, ΔH25J / g).

Embodiment 1

[0163] In a 500mL four-necked flask equipped with a water-cooled reflux condenser and a stirrer, 80 parts by mass of the maleic anhydride-modified propylene-butene copolymer (CO-1) obtained in Production Example 1, carboxyl-containing styrene 20 parts by mass of resin (Taftec (registered trademark) M1943) and 500 parts by mass of toluene were heated to 80° C. while stirring, and dissolved by continuing stirring for 1 hour. In the solution obtained by cooling, 5 parts by mass of carbodiimide resin V-05 and 10 parts by mass of epoxy resin HP-7200 were mixed to obtain an adhesive composition. The mixing amount, adhesive strength, solder heat resistance and electrical characteristics are shown in Table 1.

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Abstract

The present invention provides a laminate that has high adhesion to not only conventional polyimide and polyester films but also low-polarity resin substrates such as LCP and metal substrates, and can achieve high solder heat resistance properties, and excellent low dielectric properties. The laminate (Z) of the present invention is a laminate (Z) formed by laminating a resin substrate and a metal substrate through an adhesive layer, the adhesive layer comprising: a carboxyl group-containing polyolefin resin (A); It is characterized in that: (1) the relative dielectric constant (ε) under the frequency 1MHz of the adhesive layer c ) is 3.0 or less, (2) the dielectric loss tangent (tan δ) of the adhesive layer at a frequency of 1 MHz is 0.02 or less, and (3) the peel strength between the resin substrate and the metal substrate is 0.5 N / mm or more , (4) The wet solder heat resistance of the laminate (Z) is 240° C. or higher.

Description

technical field [0001] The present invention relates to a laminate comprising an adhesive layer exhibiting a low dielectric constant and a low dielectric loss tangent. More specifically, the present invention relates to a laminate in which a resin base material and a metal base material are laminated through an adhesive layer exhibiting a low dielectric constant and a low dielectric loss tangent. In particular, the present invention relates to a laminate for a flexible printed circuit board (hereinafter abbreviated as FPC), a coverlay film, a laminate, a resin-coated copper foil, and an adhesive sheet including the laminate. Background technique [0002] In recent years, along with the increase in speed of transmission signals in printed circuit boards, the increase in frequency of signals has been promoted. Along with this, the demand for low dielectric properties (low dielectric constant, low dielectric loss tangent) in the high frequency region has also increased accordi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J201/00B32B15/08B32B27/00C09J123/26C09J125/08C09J163/00C09J179/00
CPCB32B15/08B32B27/00C09J123/26C09J125/08C09J163/00C09J179/00C09J201/00C09J7/28C09J7/22B32B7/12B32B2457/08C09J2301/312
Inventor 三上忠彦伊藤武薗田辽坂田秀行
Owner TOYOBO CO LTD
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