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Low dielectric adhesive composition

A composition and adhesive technology, applied in the direction of adhesive types, adhesives, non-polymer adhesive additives, etc., can solve problems such as weak adhesion, low dielectric properties, and poor low dielectric properties , to achieve high solder heat resistance, high adhesion, excellent low dielectric properties

Active Publication Date: 2020-08-25
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the low polarity of the substrate film with low dielectric properties, when conventional epoxy-based adhesives or acrylic adhesives are used, the adhesive force is weak, and the adhesion of FPC components such as cover films and laminates making is difficult
In addition, epoxy-based adhesives or acrylic adhesives are not excellent in low dielectric properties, which will impair the dielectric properties of FPC
[0004] On the other hand, polyolefin resins are known to have low dielectric properties

Method used

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  • Low dielectric adhesive composition
  • Low dielectric adhesive composition
  • Low dielectric adhesive composition

Examples

Experimental program
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Effect test

preparation example Construction

[0041] The preparation method of crystalline acid-modified polyolefin (A) is not particularly limited, such as free radical grafting reaction (that is, generate a free radical species to the polymer as the main chain, and use this free radical species as the polymerization initiation point to make it Graft polymerization reaction with unsaturated carboxylic acid and acid anhydride), etc.

[0042]The radical initiator is not particularly limited, but an organic peroxide is preferably used. Organic peroxides are not particularly limited, such as di-tert-butyl peroxyphthalate, tert-butyl hydroperoxide, dicumyl peroxide, benzoyl peroxide, tert-butyl peroxybenzoate , tert-butyl peroxy-2-ethylhexanoate, tert-butyl peroxypivalate, methyl ethyl ketone peroxide, di-tert-butyl peroxide, lauroyl peroxide and other peroxides; azobisisobutyl Azonitriles such as nitrile and azobisisopropionitrile.

[0043] The content of the (A) component in the adhesive composition of the present inventi...

preparation example 1

[0152] In a 1L autoclave, 100 parts by mass of propylene-butene copolymer (manufactured by Mitsui Chemicals "Tafma (registered trademark) XM7080"), 150 parts by mass of toluene, 22 parts by mass of maleic anhydride, 6 parts by mass of 2-tert Butyl peroxide, after heating up to 140°C, stirred for another 3 hours. Then, the obtained reaction solution was cooled, poured into a container containing a large amount of methyl ethyl ketone, and the resin was precipitated. Then, the acid-modified propylene-butene copolymer obtained by graft polymerization of maleic anhydride is separated from (poly)maleic anhydride and low molecular weight substances by centrifuging the liquid containing the resin, and purified. Then, by drying under reduced pressure at 70°C for 5 hours, a maleic anhydride-modified propylene-butene copolymer (CO-1, acid value 570 equivalents / 10 6 g, weight average molecular weight 55000, Tm75°C, ΔH25J / g).

preparation example 2

[0154] By changing the addition of maleic anhydride to 19 parts by mass, it is the same as Preparation Example 1 except that the maleic anhydride modified propylene-butene copolymer (CO-2, acid value 410 equivalents / 10 6 g, weight average molecular weight 60000, Tm75°C, ΔH30J / g).

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Abstract

The present invention provides an adhesive composition which has high adhesiveness not only to conventional polyamide and polyester films but also to low-polarity resin substrates such as LCP and metal substrates, and can obtain high Solder heat resistance and has excellent low dielectric properties. The adhesive composition includes (A) component and (B) component described below, and at least one of (C) component and (D) component. (A) component: crystalline acid-modified polyolefin; (B) component: amorphous polyolefin; (C) component: carbodiimide resin; and (D) component: epoxy resin.

Description

technical field [0001] The present invention relates to an adhesive composition exhibiting a low dielectric constant and a low dielectric loss tangent. In more detail, it relates to an adhesive composition for bonding between a resin substrate and a resin substrate or a metal substrate. In particular, it relates to an adhesive composition for a flexible printed circuit board (hereinafter abbreviated as FPC), and a cover film, a laminate, a resin-coated copper foil, and an adhesive sheet containing the composition. Background technique [0002] In recent years, as the speed of transmission signals on printed circuit boards has increased, the frequency of signals has been increased. At the same time, in FPC, there is an increasing demand for low dielectric characteristics (low dielectric constant, low dielectric loss tangent) in a high frequency range. In response to such requirements, liquid crystal polymers (LCP) with low dielectric properties have been proposed as substra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J123/26B32B7/12B32B15/20B32B15/08B32B27/06B32B27/28B32B33/00B32B27/00C09J11/06C09J123/02C09J163/00C09J179/00H05K1/03C09J7/10
CPCB32B15/08B32B15/085B32B27/00C09J11/06C09J123/02C09J123/26C09J163/00C09J179/00H05K1/03C09J7/10B32B7/12B32B27/08B32B2457/08C09J2301/312
Inventor 三上忠彦伊藤武柏原健二坂田秀行
Owner TOYOBO CO LTD
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