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Copper-based composite material heat sink with graphite sheet oriented layered arrangement and preparation method thereof

A technology of copper-based composite materials and graphite flakes, which is applied in metal processing equipment, transportation and packaging, etc., can solve the problems of difficult electrical machining and cutting of materials, poor directional thermal conductivity, and low orientation ratio of graphite flakes, etc., and achieves simple and easy operation methods Easy to cut by electrical machining, and improve the effect of anisotropic thermal conductivity

Active Publication Date: 2018-11-27
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] According to the literature search in the past ten years, in the literature [1], polymer-based graphite flake composite materials were prepared by casting method, but this material is difficult to be cut by electric machining. In the literature [2], [3] , using diamond and graphite fibers to prepare a copper-based composite material, but the directional thermal conductivity of this composite material is poor; The alignment rate of graphite flakes in this kind of composite material is low, and it is difficult to achieve directional high thermal conductivity

Method used

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  • Copper-based composite material heat sink with graphite sheet oriented layered arrangement and preparation method thereof
  • Copper-based composite material heat sink with graphite sheet oriented layered arrangement and preparation method thereof

Examples

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Embodiment 1

[0028] A high thermal conductivity electronic packaging composite material substrate, the raw material mixed powder is composed of 5-10μm electrolytic copper powder and 1-2mm diameter, 20-50μm thick synthetic graphite sheet, the volume fraction of pure copper powder and graphite sheet is respectively 60% and 40%.

[0029] Mix the above-mentioned components in proportion, mix them in a micro mixer for 9 hours to form a uniform powder, add a binder with a mass ratio of polyvinyl butyral to ethanol of 1:9, and fully stir to form a uniform slurry. The slurry was poured into the casting device and cast into a film. After degumming at 400°C for 2 hours, the temperature was raised at 5°C / min to 1000°C during hot-pressing sintering, and the temperature was raised to 1000°C for bidirectional pressure sintering. Copper-based electronic packaging composites. The thermal conductivity along the direction parallel to the graphite sheet reaches 500w / m·k.

Embodiment 2

[0031] A high thermal conductivity electronic packaging composite material substrate, the raw material mixed powder is composed of 5-10μm electrolytic copper powder and 1-2mm diameter, 20-50μm thick synthetic graphite sheet, the volume fraction of pure copper powder and graphite sheet is respectively 50% and 50%.

[0032] Mix the above-mentioned components in proportion, mix them in a micro mixer for 9 hours to form a uniform powder, add a binder with a mass ratio of polyvinyl butyral to ethanol of 1:9, and fully stir to form a uniform slurry. The slurry was poured into a casting device and cast into a film. After degumming at 400°C for 2 hours, the temperature was raised at 5°C / min to 1000°C during hot pressing and sintering with bidirectional pressure and sintering, and the temperature was kept for 10 minutes. Copper-based electronic packaging composites. The thermal conductivity along the direction parallel to the graphite sheet reaches 550w / m·k.

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Abstract

The invention provides a composite heat dissipation material with copper as a matrix and graphite sheets arranged in an orientation as a heat conduction enhancement phase and a preparation method thereof, which are applied in the field of packaging materials for integrated electronic components. The composite material matrix is ​​made of pure copper powder, and the heat conduction enhancement phase is made of artificially synthesized graphite flakes with large lateral dimensions. The raw material powder needs to be mixed evenly by a mixer, and the binder prepared by polyvinyl butyral and ethanol solution is added, mixed evenly, and the mixed slurry is cast into shape, after drying, cutting, stacking and degumming, Two-way hot pressing sintering is used to obtain a copper-based composite material substrate in which graphite sheets are layered and arranged in parallel to the direction of heat dissipation in the matrix. The thermal conductivity of this composite material in the direction parallel to the arrangement of graphite sheets is higher than that in the direction perpendicular to the arrangement of graphite sheets. 4-8 times, the thermal conductivity parallel to the graphite sheet arrangement direction is 1.1-1.5 times higher than that of pure copper materials without graphite sheets, and the linear expansion coefficient matches silicon electronic components.

Description

technical field [0001] The present invention relates to a novel graphite-layered copper-based composite material and a preparation method thereof, and provides a method for preparing a heat-dissipating element material with a layered structure by using flake graphite with thermal conductivity anisotropy as a raw material and combining with a special preparation process The method belongs to the field of miniaturized integrated electronic packaging materials. technical background [0002] The heat dissipation performance of the integrated circuit board is one of the important indicators to ensure the normal operation of various instruments and household appliances and electronic equipment. The packaging substrate that is closely attached to the electronic components of the integrated circuit is the main part of the heat dissipation of the electronic components. The heat generated by the integrated circuit during operation is extremely high, and failure to dissipate it in time...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/00B22F3/22B22F3/14C22C9/00C22C1/05
CPCC22C1/05C22C9/00B22F3/14B22F3/22B22F2999/00B22F2998/10B22F2003/145B22F1/10B22F3/1021B22F2201/02
Inventor 郝俊杰崔倩月吴成义郭志猛王阳
Owner UNIV OF SCI & TECH BEIJING
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