High temperature resistant and low-modulus heat conducting organic silicon material and preparation method thereof

Abstract

The invention provides a high temperature resistant and low-modulus heat conducting organic silicon material which is prepared from the following raw materials: silicone oil, heat conducting powder filler, a low-modulus auxiliary, a high temperature resistant auxiliary, a crosslinking agent and a platinum catalyst, wherein the mass ratio of the silicone oil to the heat conducting powder filler is (90-110):(900-1,100); the mass ratio of the heat conducting powder filler to the low-modulus auxiliary is 100:(0.5-2); the mass ratio of the silicone oil, the high temperature resistant auxiliary, the crosslinking agent and the platinum catalyst is 100:(0.1-1):(5-15):(0.1-0.2) in turn. The invention belongs to the technical field of organic silicone. The heat conducting organic silicon material provided by the invention has the advantages of high long-term stability of heat dissipation in a high-temperature condition, low modulus, easy gap fitting, low thermal resistance and no oil leakage or volatilization; automatic adhesive dispensing construction can be realized; a better interface heat conducting material is provided between a heating component of an electronic appliance and a heat dissipation device or apparatus.

Description

technical field [0001] The invention belongs to the technical field of organic silicon, and in particular relates to a high-temperature-resistant low-modulus heat-conducting organic silicon material and a preparation method thereof. Background technique [0002] With the increasing development of the electronic and electrical industry, electronic products are constantly updated to high integration, high power and miniaturization to meet the needs of emerging markets. However, high integration, high power and miniaturization will cause a sharp increase in the heat generated per unit area of ​​electronic components. If it is not conducted in time, the performance and life of electronic and electrical products will be seriously affected. [0003] For this reason, in the design and production of electronic and electrical products, in order to dissipate the heat generated by chips and other heating components in time, a radiator is usually installed to accelerate heat dissipation...

AI Technical Summary

Problems solved by technology

Thermally conductive silicone grease is usually a never-curing material mixed with low-viscosity silicone oil and thermally conductive powder filler. It is easy to operate in a variety of ways, can be quickly produced by equipment, and can be scraped very thin, thereby reducing thermal resistance and saving costs. , but there is no chemical reaction and cross-linking between silicone oil and thermal conductive powder filler, so that after long-term use of silicone grease, especially at high temperature, the silicone oil will slowly free out, causing the silicone grease to dry and crack and enter the air, greatly increasing heat transfer Thermal resistance, heat dissipation stability is poor, which seriously affects the service life of electronic and electrical products and equipment

Chinese patent application CN 105400202 discloses a boron nitride / graphene composite heat-conducting silicone grease. 60-90 parts of filler, 3%-8% of thermal conductive filler as silane coupling agent, 0.1-1% of methyl phenyl silicone oil as cross-linking agent, 0.1-1 part of structure improving additive, 0.1-1% of antioxidant 1 part; although it has the advantage of high thermal conductivity, there is a problem of oil leakage, which will lead to a significant decrease in heat dissipation after long-term use

[0005] The emergence of thermal pads has better solved the problem of dry cracking and pulverization of thermal conductive silicone grease after long-term heating, but the thickness of thermal conductive pads is larger than that of silicone grease, and the thermal resistance is larger. At the same time, thermal conductive pads cannot be used for rapid production and construction of equipment. increase construction cost

Images