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Hole processing method of low-intermodulation high-frequency module circuit board

A technology of high-frequency modules and circuit boards, applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of damaged reverse copper foil surface structure, low intermodulation index, and reduce intermodulation interference, etc., to achieve excellent micro Etching rate, reducing interference, uniform effect of micro-etching layer on copper surface

Active Publication Date: 2017-09-15
TAIZHOU BOTAI ELECTRONICS
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AI Technical Summary

Problems solved by technology

For the high-frequency circuit substrate with low intermodulation index, the surface copper foil is a reverse copper foil with low intermodulation index, and if this reverse copper foil is conventionally holed according to the traditional PCB process, it will Will damage the structure of the reverse copper foil surface, affecting the ability to reduce intermodulation interference

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment example

[0024] A1. Use a high-speed sandblasting machine to perform physical treatment on the reverse copper foil on the surface of the board before hole formation, which is followed by water washing, high-pressure water washing, surface degreasing, hot water washing, diamond sandblasting, and high-pressure water washing. , hot air drying, cold air drying;

[0025] A2, use 4Kg of NaOH, 6.5Kg of KMnO 4 1. A mixed solution of 10L of decontamination agent and 100L of pure water to remove the stains in the drilled holes, and then undergo a second high-pressure water wash;

[0026] A3. Use 3-5% HCL to organically degrease the surface of the board, and then wash it with hot water at 60-80°C;

[0027] A4, using 8L H 2 SO 4 (98%), 6.5L of H 2 o 2 (30%), 4L microetch stabilizer and 100L pure water mixed solution to microetch the reverse copper foil surface and its inner hole;

[0028] A5. Put the micro-etched board into the mixed solution of 8L HCL, 24Kg pre-soak salt and 100L deionized ...

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Abstract

The invention discloses a hole processing method of a low-intermodulation high-frequency module circuit board. The hole processing method comprises the steps of: S1, carrying out hole processing pretreatment; S2, removing stains in a drilling hole; S3, carrying out surface oil removing; S4, carrying out micro-etching; S5, carrying out preimpregnation; S6, carrying out activation; S7, accelerating; S8, carrying out copper deposition in the hole; S9, and carrying out full board electroplating. The hole processing method of the low-intermodulation high-frequency module circuit board can effectively protect the structure of a reverse copper foil surface, is conductive to further reducing interference of transmission signals, and has lower intermodulation.

Description

technical field [0001] The invention relates to the technical field of circuit board hole making, in particular to a method for making holes in a low-intermodulation high-frequency module circuit board. Background technique [0002] Intermodulation interference is generated by the nonlinear circuit in the transmission channel. When two or more signals of different frequencies are input to the nonlinear circuit, due to the action of the nonlinear device, many harmonics and combined frequency components will be generated, among which The combined frequency components that are close to the desired signal frequency ω0 will pass through the receiver smoothly and form interference. [0003] Therefore, the smaller the intermodulation interference generated by the nonlinear circuit in the transmission channel during the application of the high-frequency circuit module, the better the transmission performance of the circuit signal. For the high-frequency circuit substrate with low i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
CPCH05K3/422H05K2203/0789H05K2203/0793
Inventor 刘兆贺永宁张友山褚华岳倪文波
Owner TAIZHOU BOTAI ELECTRONICS
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