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CAF-resistant, high-Tg and high-heat-resistance resin composition for copper-clad plate of automobiles

A technology of resin composition and copper clad laminate, which is applied in the field of high heat-resistant resin composition, CAF resistance, and high Tg, and can solve the problems of slow development, limited promotion and application range, and low comprehensive performance of products.

Inactive Publication Date: 2017-10-10
无锡宏仁电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Domestic development is relatively slow, and there is basically no scale, and because the technology is not mature, the comprehensive performance of the product is not high, so its promotion and application range are limited

Method used

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  • CAF-resistant, high-Tg and high-heat-resistance resin composition for copper-clad plate of automobiles
  • CAF-resistant, high-Tg and high-heat-resistance resin composition for copper-clad plate of automobiles
  • CAF-resistant, high-Tg and high-heat-resistance resin composition for copper-clad plate of automobiles

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Experimental program
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Effect test

Embodiment 1

[0023] The CAF-resistant, high-Tg, and high-heat-resistant resin composition of this embodiment, based on solids weight, includes the following components: 10 parts of YX4000 biphenyl type epoxy resin, 20 parts of bisphenol A type epoxy resin, high 15 parts of bromine epoxy resin, 10 parts of MDI modified epoxy resin, 30 parts of bisphenol A phenolic resin, 15 parts of barite, 0.8 parts of 2-phenylimidazole.

Embodiment 2

[0025] The CAF-resistant, high-Tg, and high-heat-resistant resin composition of this embodiment, based on solids weight, includes the following components: No. YL612 biphenyl type epoxy resin 12 parts, bisphenol A type epoxy resin 18 parts, high 18 parts of bromine epoxy resin, 7 parts of MDI modified epoxy resin, 35 parts of phenolic phenolic resin, 10 parts of barite, 0.2 part of 2-ethyl-4-methylimidazole, 0.3 part of 2-methylimidazole.

Embodiment 3

[0027] The CAF-resistant, high-Tg, and high-heat-resistant resin composition of this embodiment, based on solids weight, includes the following components: No. NC3000 biphenyl type epoxy resin 8 parts, phenol-para-xylene type epoxy resin 20 parts , 20 parts of phenol type phenolic epoxy resin, 25 parts of phosphorus-containing phenolic resin, 15 parts of o-cresol type phenolic resin, 12 parts of barite, 0.5 parts of 2-phenylimidazole and 2-methylimidazole.

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Abstract

The invention discloses a CAF-resistant, high-Tg and high-heat-resistance resin composition for a copper-clad plate of automobiles. Based on solids, the composition is prepared from the following components in parts by weight: 5 to 35 parts of biphenyl epoxy resin, 5 to 40 parts of bisphenol A epoxy resin, 10 to 65 parts of low-bromine / high-bromine epoxy resin, 1 to 15 parts of MDI modified epoxy resin, 20 to 50 parts of phenolic resin, 10 to 40 parts of barite and 0.05 to 1 part of accelerant. The copper-clad plate has the excellent comprehensive performance of high Tg, high heat resistance, high toughness, low hygroscopicity and high CAF resistance, reaches the flame retardance requirement, has high machining performance, and has a wide application prospect in the field of new energy automobiles and the production industry of electronic products.

Description

Technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a CAF-resistant, high Tg, and high heat-resistant resin composition for copper clad laminates for automobiles. Background technique [0002] At present, copper clad laminates are widely used in the manufacture of printed circuit boards (PCBs for short) used in various household appliances, electronic information products and industrial electronic products. As the substrate material of the printed circuit board, it plays a role in carrying and mounting electronic components and forming The conductive circuit pattern and the three major functions of insulation between layers and circuits are an important electronic basic material. [0003] In the past two to three decades, with the rapid development of electronic information technology and continuous changes in the automotive manufacturing industry, the application and innovation of automotive electronics technology has grea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/30B32B7/10B32B7/12B32B15/20B32B15/14B32B17/02B32B27/04B32B17/06B32B37/10B32B37/06B32B37/12
CPCC08L63/00B32B5/02B32B7/10B32B7/12B32B15/14B32B15/20B32B17/061B32B37/06B32B37/1009B32B37/12B32B2260/021B32B2260/046B32B2307/306B32B2307/3065B32B2307/558B32B2307/728C08K2003/3045C08K2201/003C08L2201/02C08L2201/08C08L2205/025C08L2205/035C08K3/30
Inventor 丛姣姣方业纬方廷亮姜立勇周飞
Owner 无锡宏仁电子材料科技有限公司
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