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Composition for forming release layer

A technology of peeling layer and composition, which is applied in the field of composition for peeling layer formation, can solve the problems of large laser, damage to the peeled layer, long time, etc., and achieve the effects of good reproducibility, simplified manufacturing process, and improved yield

Active Publication Date: 2017-10-13
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the methods disclosed in Patent Documents 1 to 4, especially the method disclosed in Patent Document 4, require the use of a substrate with high translucency, since it is necessary to give sufficient light to pass through the substrate and release hydrogen contained in amorphous silicon. energy, so relatively large laser irradiation is required, and there is a problem of damage to the peeled layer
In addition, since the laser treatment takes a long time, it is difficult to peel off the peeled layer with a large area, so there is also a problem that it is difficult to improve the productivity of device production.

Method used

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  • Composition for forming release layer
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Examples

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Embodiment

[0118] Hereinafter, the present invention will be described in more detail with reference to synthesis examples, comparative synthesis examples, examples, and comparative examples, but the present invention is not limited to these examples. In addition, the abbreviations of the compounds used in the following examples and the measuring methods of the number average molecular weight and weight average molecular weight are as follows.

[0119]

[0120] p-PDA: p-phenylenediamine

[0121] m-PDA: m-phenylenediamine

[0122] DATP: 4,4"'-Diamino-p-terphenyl

[0123] DBA: 3,5-diaminobenzoic acid

[0124] HAB: 3,3'-Dihydroxybenzidine

[0125] DDE: 4,4'-oxydianiline

[0126] BAPB: 4,4'-bis(4-aminophenoxy)biphenyl

[0127] FAPB: 4,4'-bis(4-amino-2-trifluoromethylphenoxy)biphenyl

[0128] APAB: 5-amino-2-(4-aminophenyl)-1H-benzimidazole

[0129] APAB-E: 4-aminophenyl-4'-aminobenzoate

[0130] 6FAP: 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane

[0131] TFMB: 2,2'-bis(triflu...

Synthetic example S1

[0148] [Synthesis Example S1] Synthesis of Polyamic Acid S1

[0149] 20.261 g (187 mmol) of p-PDA and 12.206 g (47 mmol) of DATP were dissolved in 17.4 g of NMP6. The obtained solution was cooled to 15 degreeC, PMDA50.112g (230mmol) was added there, it heated up to 50 degreeC under nitrogen atmosphere, it was made to react for 48 hours, and polyamic acid S1 was obtained. Mw of polyamic acid S1 was 82,100, and Mw / Mn was 2.7.

Synthetic example S2

[0150] [Synthesis Example S2] Synthesis of Polyamic Acid S2

[0151] 3.218 g (30 mmol) of p-PDA was dissolved in 88.2 g of NMP. BPDA8.581g (29mmol) was added to the obtained solution, and it was made to react at 23 degreeC under nitrogen atmosphere for 24 hours, and polyamic-acid S2 was obtained. Mw of polyamic acid S2 was 107,300, and Mw / Mn was 4.6.

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Abstract

Provided is a composition for forming a release layer, which comprises a polyamic acid produced by reacting an aromatic diamine with an aromatic tetracarboxylic dianhydride and an organic solvent, wherein the aromatic diamine comprises an aromatic diamine containing an ester bond and / or an ether bond and / or the aromatic tetracarboxylic dianhydride contains an ester bond and / or an ether bond.

Description

technical field [0001] The present invention relates to a composition for forming a release layer. Specifically, it relates to a composition for forming a release layer for forming a release layer provided on a substrate. Background technique [0002] In recent years, electronic devices have been required to provide functions such as bending and performances such as reduction in thickness and weight. Therefore, it is required to use a lightweight flexible plastic substrate instead of the conventional heavy, fragile and inflexible glass substrate. In addition, for next-generation displays, development of active full-color TFT display panels using lightweight flexible plastic substrates is required. For this reason, research has begun on various methods of manufacturing electronic devices using resin films as substrates. For next-generation displays, research has been conducted on manufacturing them using processes that can be transferred to existing TFT devices. [0003] Pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/00G09F9/00
CPCC08G73/1067C08G73/1042C08G73/1071C08G73/1039C08G73/1085C08L79/08G09F9/301C08L79/00G09F9/00C08G73/1032G02F1/13338G06F3/041G02F1/133305
Inventor 江原和也进藤和也
Owner NISSAN CHEM IND LTD
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