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Preparation method of organic silicon pouring sealant with high thermal conductivity

A technology of silicone potting glue and high thermal conductivity, which is applied in adhesives, semiconductor devices, polymer adhesive additives, etc., can solve problems that cannot meet the development needs of power LEDs, achieve good thermal conductivity, excellent mechanical properties, Avoid Aggregation Effects

Inactive Publication Date: 2017-10-24
DONGGUAN JIAQIAN NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional epoxy resin potting compound has exposed many shortcomings and cannot meet the development needs of power LEDs.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A preparation method of high thermal conductivity silicone potting compound, comprising the following steps:

[0024] (1) Mix and stir boron phosphide and concentrated nitric acid for 5 hours, filter, wash the solid with deionized water, and dry to obtain pretreated boron phosphide; wherein, the mass ratio of boron phosphide to concentrated nitric acid is 1:20; The mass ratio of boron and h-BN is 0.3:1;

[0025] (2) Mix and stir the boron phosphide and h-BN prepared above with isopropanol evenly, then sonicate for 1 hour at a power of 1000W, add hydroxyl silicone oil, and continue to sonicate for 2 hours. After sonication, filter and dry to obtain the modified Composite filler; wherein, the amount ratio of h-BN to isopropanol is 1g:30mL; the volume ratio of hydroxyl silicone oil to isopropanol is 10:1;

[0026] (3) Mix vinyl silicone oil, hydrogen-containing silicone oil, modified composite filler, dispersant, crosslinking agent, catalyst, inhibitor, and defoamer to pr...

Embodiment 2

[0028] A preparation method of high thermal conductivity silicone potting compound, comprising the following steps:

[0029] (1) Mix and stir boron phosphide and concentrated nitric acid for 5 hours, filter, wash the solid with deionized water, and dry to obtain pretreated boron phosphide; wherein, the mass ratio of boron phosphide to concentrated nitric acid is 1:40; The mass ratio of boron and h-BN is 0.6:1;

[0030] (2) Mix and stir the boron phosphide and h-BN prepared above with isopropanol evenly, then sonicate at 1000W for 1h, add hydroxyl silicone oil, and continue to sonicate for 5h. After sonication, filter and dry to obtain the modified Composite filler; wherein, the amount ratio of h-BN to isopropanol is 1g:50mL; the volume ratio of hydroxyl silicone oil to isopropanol is 10:1;

[0031] (3) Mix vinyl silicone oil, hydrogen-containing silicone oil, modified composite filler, dispersant, crosslinking agent, catalyst, inhibitor, and defoamer to prepare silicone potti...

Embodiment 3

[0033] A preparation method of high thermal conductivity silicone potting compound, comprising the following steps:

[0034] (1) Mix and stir boron phosphide and concentrated nitric acid for 5 hours, filter, wash the solid with deionized water, and dry to obtain pretreated boron phosphide; wherein, the mass ratio of boron phosphide to concentrated nitric acid is 1:24; The mass ratio of boron and h-BN is 0.4:1;

[0035] (2) Mix and stir the boron phosphide and h-BN prepared above with isopropanol evenly, then sonicate at 1000W for 1h, add hydroxyl silicone oil, and continue to sonicate for 3h. After sonication, filter and dry to obtain the modified Composite filler; wherein, the amount ratio of h-BN to isopropanol is 1g:35mL; the volume ratio of hydroxyl silicone oil to isopropanol is 10:1;

[0036] (3) Mix vinyl silicone oil, hydrogen-containing silicone oil, modified composite filler, dispersant, crosslinking agent, catalyst, inhibitor, and defoamer to prepare silicone potti...

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Abstract

The invention discloses a preparation method of an organic silicon pouring sealant with high thermal conductivity. The preparation method comprises steps as follows: boron phosphide and concentrated nitric acid are mixed and stirred for 5 h and are filtered, solids are washed with deionized water and dried, and pretreated boron phosphide is obtained; prepared boron phosphide, h-BN and isopropyl alcohol are mixed and stirred uniformly and are subjected to ultrasonic treatment for 1 h under 1000W powder, hydroxyl silicone oil is added, ultrasonic treatment is continued for 2-5 h, a product is filtered and dried after ultrasonic treatment, and modified composite filler is prepared; the organic silicon pouring sealant is prepared from vinyl silicone oil, hydrogen-containing silicone oil, the modified composite filler, a dispersing agent, a cross-linking agent, a catalyst, an inhibitor and an antifoaming agent through mixing, stirring and defoaming. The organic silicon pouring sealant prepared with the method is excellent in mechanical property and good in thermal conductivity.

Description

Technical field: [0001] The invention relates to the field of adhesives, in particular to a preparation method of high thermal conductivity silicone potting adhesive. Background technique: [0002] Since the 21st century, people are increasingly concerned about the global energy shortage, and the light-emitting diode (Light-Emitting Diode) LED, which is synonymous with low energy consumption and high-efficiency green light source, has attracted people's attention. LED is a semiconductor light-emitting device that can directly convert electrical energy into light energy. It has the advantages of simple structure, energy saving, long life, environmental protection, high luminous efficiency, and bright and rich colors. It is expected to become the fourth-generation lighting source. As a new type of lighting technology, LED is developing in the direction of high color, high luminous efficiency, high luminous uniformity, and high reliability in recent years. It has a very wide ra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06C09J11/08H01L33/56
CPCC08K2003/385C08L2201/08C08L2203/206C08L2205/025C08L2205/03C09J11/04C09J11/06C09J11/08C09J183/04H01L33/56C08L83/04C08K13/06C08K9/08C08K9/02C08K3/38
Inventor 王海燕
Owner DONGGUAN JIAQIAN NEW MATERIAL TECH CO LTD
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