Water-diluent phenolic resin adhesive and preparation method thereof

A technology of phenolic resin and adhesive, which is applied in the direction of aldehyde/ketone condensation polymer adhesive, adhesive type, polymer adhesive additive, etc., which can solve the problem of over-curing or under-curing of phenolic resin and the difficulty of phenolic resin Evenly mixed, poor solubility of phenolic resin, etc., to achieve excellent performance, unique rheological properties, and solve the effect of glue sagging

Active Publication Date: 2017-11-03
ANHUI UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, phenolic resins with a higher degree of polymerization have poor solubility and need to be dissolved in organic solvents such as ethanol, ethylene glycol or acetone to form a homogeneous solution before use.
For the convenience of sizing, it is often necessary to add a large amount of organic solvent to dilute, which increases the production cost and brings certain pressure to the environment and safety production.
In addition, the commonly used curing agent for phenolic resin, hexamethylenetetramine, is a solid powder at room temperature, and it is not easy to mix evenly with the phenolic resin; in actual production, if the stirring is uneven, it will cause local over-curing or under-curing of the phenolic resin, which will reduce the bonding strength. decline

Method used

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  • Water-diluent phenolic resin adhesive and preparation method thereof
  • Water-diluent phenolic resin adhesive and preparation method thereof
  • Water-diluent phenolic resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The parts by weight ratio of each component in the water-diluted phenolic resin binder is as follows:

[0021]

[0022] Follow the steps below to prepare a water-reducible phenolic resin adhesive:

[0023] (1) Weigh sodium lignosulfonate, n-hexyl glucoside, polyethylene glycol, triethanolamine, hexamethylenetetramine and water in sequence according to the formula requirements, stir to dissolve, and mix evenly to obtain a water phase mixture material.

[0024] (2) Add the water phase mixture material prepared by step (1) into the thermoplastic phenolic resin ethylene glycol solution with 70% solid content required by the formula metering, stir while adding, and get water-diluted phenolic resin after mixing evenly Resin binder.

Embodiment 2

[0026] The parts by weight ratio of each component in the water-diluted phenolic resin binder is as follows:

[0027]

[0028] Follow the steps below to prepare a water-reducible phenolic resin adhesive:

[0029] (1) Weigh sodium lignosulfonate, isooctyl glucoside, polyethylene glycol, hexamethylenetetramine and water sequentially according to the formula requirements, stir to dissolve and mix evenly to prepare a water phase mixture material.

[0030] (2) Add the water phase mixture material prepared by step (1) into the thermoplastic phenolic resin ethylene glycol solution with 70% solid content required by the formula metering, stir while adding, and get water-diluted phenolic resin after mixing evenly Resin binder.

Embodiment 3

[0032] The parts by weight ratio of each component in the water-diluted phenolic resin binder is as follows:

[0033]

[0034]

[0035] Follow the steps below to prepare a water-reducible phenolic resin adhesive:

[0036] (1) Weigh calcium lignosulfonate, isooctyl glucoside, polyethylene glycol, hexamethylenetetramine and water sequentially according to the formula requirements, stir to dissolve and mix evenly to obtain a water phase mixture material.

[0037] (2) Add the water phase mixture material prepared by step (1) into the thermoplastic phenolic resin ethylene glycol solution with 70% solid content required by the formula metering, stir while adding, and get water-diluted phenolic resin after mixing evenly Resin binder.

[0038] Two, the preparation of organic solvent type phenolic resin binder reference sample (comparative example)

[0039] The parts by weight ratio of each component in the organic solvent type phenolic resin binder is as follows:

[0040] 70%...

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PUM

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Abstract

The invention discloses a water-diluent phenolic resin adhesive and a preparation method thereof and belongs to the field of fine chemical engineering. The adhesive is prepared from the following component in parts by weight: 100 parts of thermoplastic phenolic resin ethylene glycol solution, 1 to 2 parts of dispersing agent, 1.2 to 2 parts of alkyl glucoside, 3 to 4 parts of polyethylene glycol, 0 to 0.1 part of triethanolamine, 5 to 8 parts of hexamethylenetetramine and 26 to 32 parts of water. The preparation method comprises the following specific steps: firstly, weighing the dispersing agent, the alkyl glucoside, the polyethylene glycol, the triethanolamine, the hexamethylenetetramine and the water, stirring, dissolving and uniformly mixing to obtain an aqueous phase mixed material; secondly, adding the prepared aqueous phase mixed material into the thermoplastic phenolic resin ethylene glycol solution, stirring while adding, and uniformly mixing to obtain the water-diluent phenolic resin adhesive. The adhesive prepared by the preparation method disclosed by the invention has the advantages of excellent performance, simple preparation process, low cost and environment friendliness; the adhesive has a broad application prospect.

Description

technical field [0001] The invention belongs to the field of fine chemicals, and in particular relates to a water-diluted phenolic resin adhesive and a preparation method thereof. Background technique [0002] Phenolic resin adhesive has the advantages of high bonding strength, high temperature resistance, water resistance, abundant raw materials, low cost, and simple synthesis process. It is the earliest synthetic adhesive with a large amount of use and a wide range of uses. [0003] In order to ensure the bonding strength and curing speed, phenolic resin prepolymers with a higher degree of polymerization are often used as adhesive base materials. However, the phenolic resin with a higher degree of polymerization has poor solubility and needs to be dissolved into a homogeneous solution with an organic solvent such as ethanol, ethylene glycol or acetone before it can be used. For the convenience of sizing, it is often necessary to add a large amount of organic solvent to di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/06C09J11/06C09J11/08C09J11/00
CPCC08L2205/03C09J11/00C09J11/06C09J11/08C09J161/06C08L97/005C08L71/02C08K5/17C08K5/1545C08K5/06
Inventor 杨建国董朝辉徐琰夏友谊章昌华
Owner ANHUI UNIVERSITY OF TECHNOLOGY
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