Manufacturing process of composite electrode electronic ceramic element

Abstract

The present invention relates to the technical field of electronic components, in particular to a manufacturing process of composite electrode electronic ceramic components, which includes the following steps: preparing ceramic chips; surface treatment of ceramic chips, cleaning and drying; adopting traditional screen printing methods Coat the base metal slurry on the surface of the ceramic sheet, and use the traditional high-temperature reduction process to form the first layer of coating electrodes that are in close contact with the ceramic body; use arc spraying or arc vacuum magnetron sputtering on the above coating surface. The second layer of base metal coating aims to make electronic components have the function of welding with wires and meet the production requirements of finished electronic components. Since base metal paste is used for both layers of materials, the manufacturing cost is low.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a manufacturing process of composite electrode electronic ceramic components. Background technique [0002] The electronic properties of electronic ceramics can only be revealed through the metal electrodes closely attached to the ceramic body, which are generally called internal electrodes. At present, the traditional method in the industry is to use silver powder to make silver paste, then screen-print it on the surface of the porcelain body, and then reduce it at high temperature (usually above 500°C) to form the internal electrode. The main disadvantage of this method is: the cost of silver material is high. [0003] Some enterprises try to use base metals such as copper paste as conductive paste for screen printing, but they have to be sintered under reducing atmosphere conditions, the equipment is expensive, and because there are special requirements for cera...

AI Technical Summary

Problems solved by technology

The main disadvantage of this method is: the cost of silver material is high

[0003] Some enterprises try to use base metals such as copper paste as conductive paste for screen printing, but they have to be sintered under reducing atmosphere conditions, the equipment is expensive, and because there are special requirements for ceramic chips under high temperature reducing atmosphere conditions, the application is difficult to popularize

[0004] Some enterprises try to use the base metal arc vacuum magnetron sputtering method as the inner electrode. Since the vacuum sputtering can only cover a thin layer at a time, it takes many times to achieve the thickness requirement, which is inefficient, expensive equipment, and difficult to promote.