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High-refraction LED packaging silicone with high gas barrier property

A technology of LED encapsulation and gas barrier, applied in the direction of adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problems of reduced thermal shock resistance and achieve excellent thermal shock resistance, Easy to operate, convenient operation effect

Active Publication Date: 2017-11-17
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But at the same time, the rigidity of phenyl makes the thermal shock resistance of high-fold LED packaging materials much lower than that of low-fold LED packaging materials.

Method used

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  • High-refraction LED packaging silicone with high gas barrier property
  • High-refraction LED packaging silicone with high gas barrier property
  • High-refraction LED packaging silicone with high gas barrier property

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Preparation of component A: Weigh 24 g of cyclohexane-containing vinyl resin (m=6, n=0 in the structural formula), 17 g of the crosslinking agent (x=0, y=3.5 in the structural formula), ethynyl ring inhibitor 0.10 g of hexanol and 0.5 g of lanthanum oxide surface-modified by phenyltrimethoxysilane and vinyltrimethoxysilane were sequentially added into the mixer, flushed with nitrogen, mixed and stirred evenly, and the A component was obtained.

[0041] Preparation of component B: Weigh 6g of vinyl silicone oil (a=8, b=5 in the structural formula), 0.10g of platinum-vinylsiloxane complex (platinum content is 5000ppm), adhesive (coupling agent A The mass ratio to the adhesion promoter B is 1, wherein, for the coupling agent A structural formula n 1 = 2, n 2 =0,n 3 =2) 4g, put into the blender in turn, flush with nitrogen, mix and stir evenly to obtain the B component.

[0042] When in use, mix the above-mentioned components A and B evenly in a weight ratio of 10:1, rem...

Embodiment 2

[0045] Preparation of component A: Weigh 60 g of cyclohexane-containing vinyl resin (m=3, n=2 in the structural formula), 55 g of the crosslinking agent (x=1, y=2 in the structural formula), 55 g of the inhibitor ethynyl ring 0.15 g of hexanol and 5 g of cerium-containing polymethylphenylsiloxane complex were sequentially added into the mixer, flushed with nitrogen gas, and mixed and stirred evenly to obtain the component A.

[0046] Preparation of component B: Weigh 15g of vinyl silicone oil (a=10, b=10 in the structural formula), 0.20g of platinum-vinylsiloxane complex (platinum content is 3000ppm), adhesive (coupling agent A The mass ratio to the adhesion promoter B is 0.5, wherein, for the coupling agent A structural formula n 1 = 2, n 2 =0,n 3 =2) 3g, put into the mixer in sequence, flush with nitrogen, mix and stir evenly, and obtain the B component.

[0047] When in use, mix the above-mentioned components A and B evenly in a weight ratio of 10:1, remove the air bubbl...

Embodiment 3

[0050] Preparation of component A: Weigh 38g of cyclohexane-containing vinyl resin (m=8, n=0 in the structural formula), 15g of the crosslinking agent (x=1.5, y=0.5 in the structural formula), ethynyl ring inhibitor 0.10 g of hexanol and 0.2 g of cerium oxide were sequentially added into the mixer, flushed with nitrogen, mixed and stirred evenly, and the A component was obtained.

[0051] Preparation of component B: Weigh 6g of vinyl silicone oil (a=20, b=15 in the structural formula), 0.10g of platinum-vinylsiloxane complex (platinum content is 5000ppm), adhesive (coupling agent A The mass ratio to the adhesion promoter B is 8, wherein, for the coupling agent A structural formula n 1 = 2, n 2 =0,n 3 =0) 2g, added into the mixer in turn, flushed with nitrogen, mixed and stirred evenly, to obtain the B component.

[0052] When in use, mix the above-mentioned components A and B evenly in a weight ratio of 10:1, remove the air bubbles in the glue in a vacuum, dispense or pour ...

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Abstract

The invention relates to high-refraction LED packaging silicone with a high gas barrier property and a preparation method thereof. The silicone is composed of a component A and a component B in the weight ratio of 10:1. The component A comprises, by weight, 40-80 parts of cyclohexyl-containing cyclohexyl vinylester resin, 25-55 parts of cross-linking agent, 0.08-0.20 part of inhibitor and 0-5 parts of rare-earth metal stabilizer. The component B comprises, by weight, 60-80 parts of vinyl silicone oil, 0.05-0.20 part of catalyst and 10-50 parts of adhesive. The refractive index of the high-refraction LED packaging silicone with the high gas barrier property is larger than 1.50; compared with traditional phenyl high-refraction LED packaging silicone, the high-refraction LED packaging silicone has the advantages of being better in vulcanization-resistant effect and more excellent in cold and hot impact resistance, and is convenient to operate and good in storage stability.

Description

technical field [0001] The invention relates to a high-fold LED packaging silica gel with high gas barrier properties, belonging to the technical field of adhesives. Background technique [0002] Semiconductor lighting based on LED technology has the characteristics of high efficiency, energy saving, environmental protection, long life, and easy maintenance, and is known as a new light source in the 21st century. However, with the development of high-power LED devices, new requirements are put forward for the refractive index and reliability of packaging materials. [0003] Especially with the development of LED application technology, LEDs are gradually applied to vehicle lighting systems, which put forward more stringent requirements for LED lighting sources: especially new challenges in terms of reliability. [0004] LED packaging silicone can resist pollutants in the environment, absorb the stress generated by shock and vibration, and maintain its physical and electrica...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J11/06C09J11/04C09J11/08
CPCC08K2003/221C08K2003/2213C08L2201/08C08L2201/14C08L2203/206C08L2205/025C08L2205/03C08L2205/035C09J11/04C09J11/06C09J11/08C09J183/04C08L83/04C08K13/06C08K9/06C08K3/22C08K5/05C08K5/5455
Inventor 姜云陈维
Owner YANTAI DARBOND TECH
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