Glue liquid used for aluminum base board of high-heat-conductive copper-clad board and preparation method of same

Abstract

The invention discloses a glue liquid used for an aluminum base board of a high-heat-conductive copper-clad board. The glue liquid includes, by weight, 100 +/- 2 parts of epoxy resin, 12.5 +/- 0.1 parts of an amine curing agent, 0.2 +/- 0.001 parts of a curing accelerator, 75 +/- 1 parts of a solvent, 5.4 +/- 0.1 parts of a coupling agent, and 350 +/- 2 parts of inorganic filler, wherein the epoxy resin includes 70 +/- 2 parts of phosphorus-containing halogen-free epoxy resin or bisphenol A type low-bromine epoxy resin and 30 +/- 2 parts of zinc oxide modified bisphenol A type epoxy resin. The preparation method includes the following steps: 1) uniformly mixing the amine curing agent and the curing accelerator, adding the mixture to the solvent, continuously stirring the liquid for 2 h to dissolve the mixture completely; 2) adding the coupling agent, in three times, into a glue blending tank, wherein when one batch of the coupling agent is added, the coupling is stirred for 20 min, and then the next batch is added; 3) after the coupling agent is completely added, adding all of the inorganic filler, and uniformly stirring the mixture for 30 min completely; and 4) adding the epoxy resin to the glue blending tank, and then high-speed-stirring the mixture for 4-6 h until the glue liquid is completely aged. The glue liquid has high heat resistance and heat conductivity.

Description

technical field [0001] The invention relates to a glue solution for a high thermal conductivity copper-clad aluminum substrate and a preparation method thereof. Background technique [0002] With the development of the economy, the quality of life of people in various countries has been significantly improved, and the safety requirements for various products are becoming more and more stringent. Under such conditions, high thermal conductivity copper-clad laminates and aluminum substrates have emerged in due course, and have gradually become the trend of market development. Due to the different process formulas and production conditions of the heat conduction plates currently on the market, the quality of heat conduction copper clad laminates is uneven, which affects some customers' trust in this type of product to a certain extent, and thus has a negative impact on the development of this type of product. It has a certain degree of negative impact, which is mainly reflecte...

AI Technical Summary

Problems solved by technology

Due to the different process formulas and production conditions of the heat conduction plates currently on the market, the quality of heat conduction copper clad laminates is uneven, which affects some customers' trust in this type of product to a certain extent, and thus has a negative impact on the development of this type of product. It has a certain degree of negative impact, which is mainly reflected in the following aspects: 1. The formula of the product is unreasonable, resulting in a short shelf life and poor processing performance in the later stage; Stable; 3. Unreasonable selection of fillers leads to unstable thermal conductivity and potential safety hazards