The invention discloses a glue liquid used for an aluminum base board of a high-heat-conductive
copper-clad board. The glue liquid includes, by weight, 100 + / - 2 parts of
epoxy resin, 12.5 + / - 0.1 parts of an amine curing agent, 0.2 + / - 0.001 parts of a curing accelerator, 75 + / - 1 parts of a
solvent, 5.4 + / - 0.1 parts of a
coupling agent, and 350 + / - 2 parts of
inorganic filler, wherein the
epoxy resin includes 70 + / - 2 parts of
phosphorus-containing
halogen-free
epoxy resin or
bisphenol A type low-
bromine epoxy resin and 30 + / - 2 parts of
zinc oxide modified
bisphenol A type epoxy resin. The preparation method includes the following steps: 1) uniformly mixing the amine curing agent and the curing accelerator, adding the mixture to the
solvent, continuously stirring the liquid for 2 h to dissolve the mixture completely; 2) adding the
coupling agent, in three times, into a glue blending tank, wherein when one batch of the
coupling agent is added, the coupling is stirred for 20 min, and then the next batch is added; 3) after the coupling agent is completely added, adding all of the
inorganic filler, and uniformly stirring the mixture for 30 min completely; and 4) adding the epoxy resin to the glue blending tank, and then high-speed-stirring the mixture for 4-6 h until the glue liquid is completely aged. The glue liquid has
high heat resistance and heat
conductivity.