Radar assembly packaging body

Abstract

The invention relates to a radar assembly packaging body. The radar assembly packaging body comprises a box cover and a box body, wherein the box cover has a metal layer arranged on the inner surfaceof the box cover, wherein a cavity is formed between the box cover and the box body; the box body comprises a first insulator, one or more chips, a second insulator, a third insulator, antennas and conductive circuits, wherein the first insulator is connected with the box cover; hole channels are formed in the first insulator; one ends of the hole channels are corresponding to the positions of thecorresponding antennas while the other ends are connected with the cavity; the one or more chips are arranged on the second insulator in an inversion manner and covered by the first insulator; and the antennas and the conductive circuits are arranged in the third insulator and pass through the second insulator to be connected with bonding pads of the corresponding chips, wherein the conductive circuits are exposed from the third insulator for realizing electric contact.

Description

Technical field [0001] The present invention generally relates to the field of semiconductor manufacturing, and specifically relates to a radar component package. Background technique [0002] With the increasingly diversified functions of consumer products, there is a demand for wireless detection (such as the detection of moving objects and their speed) in many fields such as automobiles, robots, and smart phones. Therefore, the application of radar components is increasing. However, applications in many fields, such as smartphones, balloons, and airships, place stringent requirements on the size and weight of radar components. Therefore, technicians have been constantly trying to improve the integration of the radar component package to reduce its weight and weight. size. [0003] From the Chinese patent application 201510149446.5 entitled "A device for a four-sided flat leadless encapsulated radar transceiver component", a packaged radar transceiver component is disclosed, whi...

AI Technical Summary

Problems solved by technology

However, the disadvantage of this packaged radar transceiver assembly is that it uses wire bonding to arrange the chips, which not only causes the length of the line to be too long and thus causes a large loss, but also needs to reserve a certain height in the box for wire bonding. bonded wires, resulting in a larger thickness of the component

In addition, the manufacture of the packaged radar transceiver component adopts the traditional packaging process including patching, wire bonding, and substrate manufacturing steps, so that the thickness of the substrate and chip limits the further reduction of the thickness of the component

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