A heat dissipation circuit board inlaid with ceramics and its preparation method

Abstract

The invention relates to the manufacturing field of a circuit board, and specifically relates to a heat dissipation circuit board embedded with ceramic and a preparation method of the circuit board. The preparation method of the heat dissipation circuit board embedded with ceramic at least comprises the following steps of a, processing of copper-clad plates: putting a prepreg between two one-sidedcopper-clad plates and then performing fixation by a rivet, and processing windows in the one-sided copper-clad plates; b, processing of a ceramic substrate: plating a titanium layer on the upper andlower surfaces of the ceramic substrate through a first sputtering process separately, then plating a first copper layer through a second sputtering process, next, plating a second copper layer by afirst electroplating process, and finally cutting into ceramic blocks, wherein the dimensions of the ceramic blocks are matched with those of the windows; and c, lamination: embedding the cut ceramicblocks into the widows and then performing lamination; d, hole drilling: processing conductive holes in the one-sided copper-clad plates; and e, copper plating: depositing a third copper layer in theconductive holes through a chemical copper plating way and then plating a fourth copper layer through a second electroplating process.

Description

technical field

[0001] The invention relates to the field of circuit board manufacturing, in particular to a heat dissipation circuit board inlaid with ceramics and a preparation method thereof. Background technique

[0002] With the rapid development of microelectronics integration technology, highly integrated circuit boards have become an inevitable trend, and the volume of electronic components and logic circuits on circuit boards has been greatly reduced. increase, leading to changes in the working environment of components to high pressure and high temperature. If you want to keep electronic components working stably for a long time, you must improve the heat dissipation capacity and high-voltage resistance of the circuit board to ensure its service life and accuracy.

[0003] At present, the heat dissipation of LED printed circuit boards mainly adopts metal substrates or ceramic substrates. Among them, the metal substrate and the copper foil are laminated with insul...