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A high-toughness halogen-free cem-3 copper clad laminate

A high-toughness, copper-clad laminate technology, applied in the direction of chemical instruments and methods, layered products, metal layered products, etc., can solve the problems of low toughness, non-environmental protection, etc., and achieve low cost, low defect rate, and good thickness uniformity Effect

Active Publication Date: 2021-12-17
SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a high toughness halogen-free CEM-3 copper clad laminate glue, prepreg and copper clad laminate and its preparation method

Method used

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  • A high-toughness halogen-free cem-3 copper clad laminate
  • A high-toughness halogen-free cem-3 copper clad laminate
  • A high-toughness halogen-free cem-3 copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] 1. A preparation method of glue for high-toughness halogen-free CEM-3 copper-clad laminates:

[0046] Raw material formula:

[0047] Resin: 100 parts of phenolic epoxy resin, 400 parts of flame-retardant modified liquid halogen-free epoxy resin, 200 parts of flame-retardant modified solid halogen-free epoxy resin; the modified epoxy resin here is DOPO type halogen-free flame-retardant ring Oxygen resin, product name: DOPO type, epoxy value: 8.3-9.4 (Eq / kg), viscosity at 27°C (mPa s): 2000-5000; the flame-retardant modified solid epoxy resin here is DOPO type halogen-free Flame retardant epoxy resin, product name: DOPO type, epoxy value: 970-1070 (g / eg), viscosity 150°C (mPa s): 8000-11000;

[0048] Curing agent: 40 parts of dicyandiamide (DICY);

[0049] Curing accelerator: 0.20 parts of 2-phenylimidazole (C-2 substitution);

[0050] Solvent: 150 parts of organic solvent (acetone: butanone: DMF: propylene glycol methyl ether = 1:1:6:1).

[0051] Preparation method: ...

Embodiment 2

[0062] 1. A preparation method of glue for high-toughness halogen-free CEM-3 copper-clad laminates:

[0063] Raw material formula:

[0064] Resin: 80 parts of phenolic epoxy resin, 300 parts of flame-retardant modified liquid halogen-free epoxy resin, 150 parts of flame-retardant modified solid halogen-free epoxy resin; the flame-retardant modified epoxy resin here is DOPO type halogen-free epoxy resin Combustible epoxy resin, product name: DOPO type, epoxy value: 8.3-9.4 (Eq / kg), viscosity at 27°C (mPa s): 2000-5000; the flame-retardant modified solid epoxy resin here is DOPO type Halogen-free flame retardant epoxy resin, product name: DOPO type, epoxy value: 970-1070 (g / eg), viscosity 150°C (mPa s): 8000-11000;

[0065] Curing agent: 30 parts of dicyandiamide (DICY);

[0066] Curing accelerator: 0.20 parts of 2-phenylimidazole (C-2 substitution);

[0067] Solvent: 120 parts of organic solvent (acetone: butanone: dimethylformamide: propylene glycol methyl ether = 1:1:6:1)....

Embodiment 3

[0078] 1. A preparation method of glue for high-toughness halogen-free CEM-3 copper-clad laminates:

[0079] Raw material formula:

[0080] Resin: 120 parts of phenolic epoxy resin, 450 parts of flame-retardant modified liquid halogen-free epoxy resin, 250 parts of flame-retardant modified solid halogen-free epoxy resin; the flame-retardant modified epoxy resin here is DOPO type halogen-free epoxy resin Combustible epoxy resin, product name: DOPO type, epoxy value: 8.3-9.4 (Eq / kg), viscosity at 27°C (mPa s): 2000-5000; the flame-retardant modified solid epoxy resin here is DOPO type Halogen-free flame retardant epoxy resin, product name: DOPO type, epoxy value: 970-1070 (g / eg), viscosity 150°C (mPa s): 8000-11000;

[0081] Curing agent: 50 parts of dicyandiamide (DICY);

[0082] Curing accelerator: 0.30 parts of 2-phenylimidazole (C-2 substitution);

[0083] Solvent: 200 parts of organic solvent (acetone: butanone: dimethylformamide: propylene glycol methyl ether = 1:1:6:1)...

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Abstract

The invention discloses a high-toughness halogen-free CEM‑3 copper-clad laminate, which is prepared by the following method: (1) stacking several laminated prepregs on both sides of several sandwich prepregs to obtain a core material, and then Copper foil is covered on one or both sides of the material to obtain a semi-finished plate; (2) The semi-finished plate is subjected to hot pressing to obtain that; wherein the raw material for the high-toughness halogen-free CEM-3 copper-clad laminate used to prepare the prepreg It includes the following components by weight: 75-120 parts of novolac epoxy resin, 300-450 parts of flame-retardant modified liquid halogen-free epoxy resin, 150-250 parts of flame-retardant modified solid halogen-free epoxy resin, 25 parts ~50 parts of curing agent, 0.10~0.30 parts of curing accelerator and 100~200 parts of organic solvent. The high-toughness halogen-free CEM‑3 copper clad laminate not only has good heat resistance and chemical resistance, but also reduces environmental pollution.

Description

technical field [0001] The invention specifically relates to a high-toughness halogen-free CEM-3 copper-clad laminate. Background technique [0002] Copper Clad Laminate (CCL) is the main material for the manufacture of printed circuit boards (PCB), so it is also an indispensable basic electronic material for the complete machine and components of any electronic product. With the rapid development of the PCB industry, the market demand for high-performance copper clad laminates is increasing day by day. In the era of green environmental protection, it has developed in an all-round way and is becoming more and more mature. In addition to the heat resistance, TG value, and CTE value of the product, it has attracted much attention. In addition, the toughness, PCB processability, and adhesion of materials have also become a focus of everyone's attention. The balanced development of the performance of the CCL base material has become an important development trend for the develop...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B17/02B32B17/06B32B15/20C08L63/00C08L63/04
CPCA01B1/00C08G59/4021C08L63/00C08L2201/22C08L2203/20C08L2201/02C08L2205/03C08L2205/025
Inventor 李清亮吴兰中李子龙
Owner SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD