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Photoelectric coupler element sealing silica gel

An optocoupler, silica gel technology, applied in electrical components, electrical solid devices, semiconductor devices, etc., can solve problems such as large glue stress, damage to components, metal wire breakage, etc., to improve aging resistance and improve overall strength. , The effect of convenient sizing process

Inactive Publication Date: 2018-03-20
YANTAI DEBANG ADVANCED SILICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are the following problems in the packaging glue of the light emitter and photosensor chip: the stress of the glue is too large, which will easily break the internal metal welding wire and damage the components; the absorption rate of the infrared light after the colloid is cured is too high, which reduces the The transmission of optical signals leads to the decline in the performance of the optocoupler; yellowing and cracking of the colloid after aging lead to product failure

Method used

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  • Photoelectric coupler element sealing silica gel
  • Photoelectric coupler element sealing silica gel
  • Photoelectric coupler element sealing silica gel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] At 25°C, weigh 46 g of methyl vinyl polysiloxane resin of structural formula (1), wherein a=0, b=1.2, a+b=1.2; methyl vinyl polysiloxane resin of structural formula (2) 4.6g of oxane resin, wherein c=0, d=1.0, a+b=1.0; 27g of methyl vinyl silicone oil such as structural formula (3), wherein e=300; such as methyl vinyl silicone oil of structural formula (4) 16.2g, wherein f=800; 2.12g of methyl hydrogen-containing polysiloxane such as structural formula (5), wherein g=20; 1g of substrate adhesion enhancer such as structural formula (6); 3,5-dimethyl - 0.03g of 1-hexyn-3-ol, mixed evenly in a stirring tank; then add 0.05g of platinum-vinylsiloxane complex with a platinum content of 10000ppm, and mix evenly; then add 3g of hydrophobic white carbon black TS- 530, mix well to get organic silica gel. The basic raw materials used are methyl vinyl polysiloxane resin, methyl vinyl silicone oil, and methyl hydrogen-containing silicone oil. mbar) → obtain purified raw material. ...

Embodiment 2

[0043] At 25°C, weigh 53 g of methyl vinyl polysiloxane resin of structural formula (1), wherein a=1.0, b=0.5, a+b=1.5; methyl vinyl polysiloxane resin of structural formula (2) 5.3g of oxane resin, wherein c=0.8, d=0.5, c+d=1.3; 22.5g of methyl vinyl silicone oil such as structural formula (3), wherein e=500; such as methyl vinyl of structural formula (4) 13.5g of silicone oil, wherein f=1000; 2.5g of methyl hydrogen-containing polysiloxane such as structural formula (5), wherein g=50; 2g of substrate adhesion enhancer such as structural formula (6); 3-methyl-1 -Butyn-3-alcohol 0.1g, mix well in a stirring tank; then add 0.1g platinum-vinylsiloxane complex with a platinum content of 3000ppm, mix well; then add 1g hydrophobic white carbon black R-106, Mix evenly to obtain organic silica gel. The basic raw materials used are methyl vinyl polysiloxane resin, methyl vinyl silicone oil, and methyl hydrogen-containing silicone oil. mbar) → obtain purified raw material.

Embodiment 3

[0045]At 25°C, weigh 50 g of methyl vinyl polysiloxane resin of structural formula (1), wherein a=1.0, b=0.5, a+b=1.5; methyl vinyl polysiloxane resin of structural formula (2) 5g of oxane resin, wherein c=0.8, d=0.5, c+d=1.3; 20g of methyl vinyl silicone oil such as structural formula (3), wherein e=500; 15g of methyl vinyl silicone oil of structural formula (4) , wherein f=1000; such as structural formula (5) methyl hydrogen polysiloxane 3.85g, wherein g=50; such as structural formula (6) substrate adhesion enhancer 3g; 1-acetylene-1-cyclohexanol 0.05g, mixed evenly in a stirring tank; then add 0.1g of platinum-vinylsiloxane complex with a platinum content of 5000ppm, mix evenly; then add 3g hydrophobic white carbon black R974, mix evenly to obtain organic silica gel. The basic raw materials used are methyl vinyl polysiloxane resin, methyl vinyl silicone oil, and methyl hydrogen-containing silicone oil. mbar) → obtain purified raw material.

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Abstract

The invention relates to a photoelectric coupler element sealing silica gel which comprises the following raw materials in parts by weight: 50-59 parts of a methyl vinyl silicon resin, 35.5-43.5 partsof methyl vinyl silicon oil, 2-4 parts of methyl hydrogen-containing silicon oil, 1-3 parts of an adhesive, 0.05-0.1 part of a catalyst, 0.03-0.1 part of an inhibitor and 1-3 parts of a thixotropic agent. The methyl vinyl silicon resin used in the silica gel is a mixture of a high-viscosity resin and a low-viscosity resin, the basic viscosity is balanced, and a low-stress frame structure is provided; by virtue of the methyl vinyl silicon oil and hydrogen-containing polysiloxane, chain extension is provided, the connection of basic frames is enhanced, the overall strength is improved, and in addition, the product viscosity is reduced; and due to adoption of the adhesive of a special structure, the adhesion property of an element with a photoelectric coupler support and a base material is effectively improved.

Description

technical field [0001] The invention relates to a packaging silica gel, in particular to a low-infrared-absorption, low-stress, and aging-resistant photocoupler element packaging silica gel, which belongs to the field of silicone adhesive packaging. Background technique [0002] Optocouplers are also called optoisolators or optocouplers, sometimes simply optocouplers. This is a device that uses light as a coupling medium to achieve electrical isolation between input and output through the transmission of optical signals. It can transmit electrical signals between circuits or systems while ensuring electrical isolation between these circuits or systems. [0003] The basic structure of the optocoupler is to package the chips of the light emitter (infrared light-emitting diode, infrared LED) and the photosensor (silicon photoelectric detection sensitive device) in the same housing, and fill it with transparent glue as the light transmission medium. At present, there are the fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J11/08C09J11/06C09J11/04H01L23/29
CPCC08L2201/08C08L2203/206C08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08C09J183/04H01L23/296C08L83/04C08K5/05C08K3/36C08K5/5425
Inventor 孙刚陈维
Owner YANTAI DEBANG ADVANCED SILICON MATERIALS
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