Equipment cooling fan intelligent management device and method

A technology of intelligent management device and heat dissipation fan, which is applied in the direction of mechanical equipment, emergency protection circuit device, components of pumping device for elastic fluid, etc., can solve the problem of high air disturbance noise and electromagnetic signal interference, and unsuitable heat generation The whole machine equipment, low heat dissipation efficiency and other problems, achieve low noise index, improve long-term working reliability, and improve the effect of perception ability

Pending Publication Date: 2018-03-23
NANJING PANDA ELECTRONICS +2
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

Forced air cooling is to use the fan to force air convection to transfer the heat on the heat sink to the surrounding environment in time to achieve the purpose of heat dissipation. It has a simple structure, relatively low pric

Method used

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  • Equipment cooling fan intelligent management device and method
  • Equipment cooling fan intelligent management device and method
  • Equipment cooling fan intelligent management device and method

Examples

Experimental program
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Effect test

Embodiment 1

[0039] The fan power step-down and detection circuit in Example 1 is mainly composed of an input power filter capacitor, a power step-down chip and peripheral circuits, an output power filter capacitor, a power indicator light-emitting diode, two load current detection chips and peripheral circuits. like Figure 4 As shown, 1 is the system input power signal, and its voltage is not less than 15V; 2 is the input power signal filter capacitor group, which can suppress the interference signal between the fan power supply and the system power supply; 3 is the power step-down chip, which can be controlled by software Control it to enter the sleep state, and also set its output voltage value; 4 is the step-down output power signal filter capacitor group, which can effectively reduce the ripple of the output power and improve the quality of the power signal; 5 is to enable the control of the IO port, output power Step-down chip work enable control signal, through which the fan can be...

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PUM

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Abstract

The invention discloses a cooling fan intelligent management device. The cooling fan intelligent management device comprises a digital adjustable voltage reducing module, a microprocessor and a powersupply module, wherein the microprocessor controls the digital adjustable voltage reducing module in real time according to the sensed current running temperature of equipment; the digital adjustablevoltage reducing module performs voltage reducing and filtering treatment on a power source output by an equipment power source module under control of the microprocessor and outputs cooling fan working voltages which are different in magnitude; and the power supply module provides a stable working power source for the microprocessor. Furthermore, the equipment provided with the device and a cooling fan intelligent management method are further disclosed. By means of the cooling fan intelligent management device, intelligent management can be performed on cooling fans of the equipment, the interference of the fans on a system power source is inhibited, the service life of the fans is prolonged, the equipment output noise is lowered, and therefore the equipment cooling treatment which is highest in efficiency and lowest in noise is achieved.

Description

technical field [0001] The invention belongs to the technical field of low-noise air-cooling and heat dissipation of special communication electronic equipment, and in particular relates to an intelligent management device and method for equipment heat dissipation fans. Background technique [0002] At present, the power consumption of various complete equipment is getting higher and higher, and the heat dissipation of the equipment is very important to the reliability of the work. The heat generated by high-power active devices will cause the temperature of other chips in the board and other boards in the device to rise. If the heat is not exported in a timely and effective manner, it may cause long-term damage to the boards and chips in the device. Work in a higher temperature environment, resulting in deterioration or damage to device performance. Therefore, choosing a suitable heat dissipation method and carrying out an optimal design are the basic conditions to ensure ...

Claims

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Application Information

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IPC IPC(8): F04D27/00F04D29/66H02P29/20H02H7/085G05B19/042
CPCH02H7/085H02P29/20G05B19/042F04D27/00F04D27/001F04D29/663
Inventor 徐远清赵丽萍宗明
Owner NANJING PANDA ELECTRONICS
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