Heat-conducting pouring sealant and preparation method thereof

A heat-conducting potting and heat-conducting filler technology, applied in the direction of adhesives, adhesive types, polyether adhesives, etc., can solve the problems of large amount of heat-conducting fillers, high cost, unsuitable for large-scale production, etc. Good thermal conductivity, the effect of improving long-term stability

Inactive Publication Date: 2018-03-27
CSI SOLAR POWER GROUP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the potting compound prepared by the invention has a high thermal conductivity, the amount of thermally conductive filler used is too large, the compatibility between the ...

Method used

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  • Heat-conducting pouring sealant and preparation method thereof
  • Heat-conducting pouring sealant and preparation method thereof
  • Heat-conducting pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] In this embodiment, the thermally conductive potting compound is composed of agent A and agent B at a mass ratio of 5:1, and the agent A includes the following components by weight:

[0068]

[0069] The thermally conductive filler is alumina treated with titanate surface.

[0070] The B agent comprises the following components by weight:

[0071]

[0072] The preparation method is as follows:

[0073] (1) Stir and mix 107 glue with a viscosity of 1500mPa·s and methyl silicone oil at a vacuum degree of -0.1MPa at a stirring speed of 15r / min for 10min;

[0074] (2) Add thermally conductive fillers to the mixture obtained in step (1), and stir and mix for 40 minutes under a vacuum condition of -0.1 MPa, at a stirring speed of 45 r / min, and cooling with cooling water;

[0075] (3) Add aluminum hydroxide to the mixture obtained in step (2), and stir and mix for 20 min at a stirring speed of 15 r / min under a vacuum condition of -0.1 MPa in a vacuum;

[0076] (...

Embodiment 2

[0079] In this embodiment, the thermally conductive potting compound is composed of agent A and agent B at a mass ratio of 5.5:1, and the agent A includes the following components by weight:

[0080]

[0081]

[0082] The thermally conductive filler is alumina treated with titanate surface.

[0083] The B agent comprises the following components by weight:

[0084]

[0085] The preparation method is as follows:

[0086] (1) Stir and mix 107 glue with a viscosity of 1000mPa·s and ethyl silicone oil at a vacuum condition of -0.09MPa at a stirring speed of 20r / min for 15min;

[0087] (2) Add a thermally conductive filler to the mixture obtained in step (1), and stir and mix for 30 minutes under a vacuum condition of -0.09 MPa at a stirring speed of 50 r / min and cooling with cooling water;

[0088] (3) Add aluminum hydroxide to the mixture obtained in step (2), and stir and mix for 25min at a stirring speed of 10r / min under a vacuum condition of -0.1MPa in a vacuu...

Embodiment 3

[0092] In this embodiment, the thermally conductive potting compound is composed of agent A and agent B at a mass ratio of 6:1, and the agent A includes the following components by weight:

[0093]

[0094]

[0095] The thermally conductive filler is aluminum oxide treated with aminosilane.

[0096] The B agent comprises the following components by weight:

[0097]

[0098] The preparation method is as follows:

[0099] (1) Stir and mix 107 glue with a viscosity of 2000mPa·s and methyl silicone oil for 10min at a stirring speed of 10r / min under a vacuum condition of -0.1MPa;

[0100] (2) Add thermally conductive fillers to the mixture obtained in step (1), and stir and mix for 35 minutes under a vacuum condition of -0.09 MPa at a stirring speed of 40 r / min and cooling with cooling water;

[0101] (3) Add aluminum hydroxide to the mixture obtained in step (2), and stir and mix for 25min at a stirring speed of 20r / min under a vacuum condition of -0.09MPa in a va...

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Abstract

The invention provides a heat-conducting pouring sealant and a preparation method thereof. The heat-conducting pouring sealant is composed of an agent A and an agent B, wherein the agent A comprises,by weight, 100 parts of base glue, 10 to 20 parts of a heat-conducting filling material, 5 to 7 parts of a diluent, 50 to 60 parts of a filler and 1 to 2 parts of a brightening agent, and the heat-conducting filling material is alumina having undergone surface treatment by organosilane and/or titanate; and the agent B comprises, by weight, 7 to 23 parts of a cross-linking agent, 10 to 20 parts ofa diluent, 0.5 to 4 parts of a coupling agent and 0.05 to 0.06 part of a catalyst. According to the invention, since the alumina having undergone surface treatment by organosilane and/or titanate, thepouring sealant has good thermal conductivity; the heat-conducting filling material and the filler are cooperated with each other, and the synergism of the two substance can reinforce the heat conduction effect of the pouring sealant; and the pouring sealant provided by the invention is not prone to settlement and has good stability and mechanical properties.

Description

technical field [0001] The invention belongs to the technical field of potting materials, and relates to a heat-conducting potting glue and a preparation method thereof. Background technique [0002] The potting glue for photovoltaic modules is used for the packaging of the junction box on the back panel of the module. It is the main barrier to ensure the normal operation of the diode and avoid the influence of external factors. However, often during the experimental stage and the use stage of the component, the diode temperature is too high and damaged due to the insufficient thermal conductivity of the potting compound, and even the component cannot work normally, and the component temperature during the working process is much higher than the ambient temperature. , so the potting compound is required to have more excellent thermal conductivity. [0003] CN103834352A discloses a two-component high thermal conductivity potting compound with excellent mechanical properties ...

Claims

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Application Information

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IPC IPC(8): C09J183/06C09J171/00C09J11/08C09J11/04C09J11/06
CPCC08L2203/20C08L2205/02C08L2205/03C09J11/04C09J11/06C09J183/06C08L83/04C08L71/00C08K13/06C08K9/04C08K9/06C08K2003/2227C08K2003/2241C08K5/544
Inventor 何帅杨连丽许涛
Owner CSI SOLAR POWER GROUP CO LTD
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