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Metal cavity-comprising three-dimensional ceramic substrate and preparation method thereof

A ceramic substrate and metal cavity technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of long process time, poor heat resistance and aging resistance, poor screen printing graphic accuracy, etc., and achieve material cost Low temperature, good heat resistance, and simple process

Active Publication Date: 2018-03-30
武汉利之达科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the poor accuracy of screen printing graphics and the high sintering temperature of ceramic paste (generally greater than 850 degrees), this technology is only suitable for preparing ceramic dams on thick-film ceramic substrates TFC; patent CN106783755 proposes to directly prepare metal-containing dams by electroplating and thickening Ceramic substrate methods for dams such as image 3 shown
Due to the use of multiple "lithography + electroplating" technologies, the process time is long (more than 10 hours) and the cost is high; in addition, some researchers have proposed to bond metal or ceramic dams on the ceramic substrate to prepare a three-dimensional packaging substrate
However, the heat resistance and aging resistance of viscose materials are poor (such as anti-ultraviolet rays, etc.), and the coefficient of thermal expansion (CTE) of ceramics, metals, and viscose materials is relatively large, which seriously affects the reliability of LED devices.
[0005] To sum up, the existing three-dimensional packaging substrates are either prepared by high-temperature processes, or by electroplating and low-temperature bonding processes, and there are some technical defects that limit their mass production and application.

Method used

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  • Metal cavity-comprising three-dimensional ceramic substrate and preparation method thereof
  • Metal cavity-comprising three-dimensional ceramic substrate and preparation method thereof
  • Metal cavity-comprising three-dimensional ceramic substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Figure 10 It is a schematic diagram of a three-dimensional ceramic substrate containing a metal cavity in Example 1. Such as Figure 10 As shown, Embodiment 1 provides a three-dimensional ceramic substrate containing a metal cavity, including a planar ceramic substrate 101 and a metallic copper cavity structure 105 . Wherein, the planar ceramic substrate is made up of ceramic substrate 102, independent circuit 103 and metal through-hole 104; mm).

[0053] Figure 9 For the preparation flow chart of the three-dimensional ceramic substrate containing the metal cavity of the embodiment of the present invention, such as Figure 9 As shown, the specific preparation process includes:

[0054] (1) The planar ceramic substrate (including electroplating seed layer) is prepared by DPC process, and the surface is arranged with independent lines and circular copper plating layer (according to the metal cavity structure design, the circular copper plating layer has an outer di...

Embodiment 2

[0063] Figure 12 It is a schematic diagram of a three-dimensional ceramic substrate containing a metal cavity in Example 2, such as Figure 12 As shown, the structure of the three-dimensional ceramic substrate is similar to Embodiment 1, the difference is that the DPC ceramic substrate has no metal through holes, such as Figure 12 shown. The structure of the annular copper plating layer on the surface is a square ring (the side length is 5mm, the ring width is 1mm, and the thickness is 50um, the material of the metal hole plate is metal aluminum, and the through holes on the corresponding metal aluminum plate and transparent plastic plate are square holes, and the side length 5mm), the obtained three-dimensional ceramic substrate containing square metal cavities is as follows Figure 13 shown.

Embodiment 3

[0065] The structure of this three-dimensional ceramic substrate is similar to embodiment 2, and the difference is that the annular copper layer structure on the surface of the DPC ceramic substrate is a rectangle (20mm long, 10mm wide, 2mm wide, and 30um thick), and the corresponding metal orifice plate and plastic orifice plate The structure and size of the through holes are also adjusted to elongated holes.

[0066] The preparation method of the three-dimensional ceramic substrate containing the metal cavity of the present invention uses an electroplating process to realize the direct bonding between the metal hole plate and the annular copper plating layer of the planar ceramic substrate (electroplating fills the gap between the two), and prepares the three-dimensional ceramic containing the metal cavity substrate. In addition, by processing metal orifice plates with different structures (shape, size, and thickness), three-dimensional ceramic substrates with different cavi...

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Abstract

The invention discloses a metal cavity-comprising three-dimensional ceramic substrate. The metal cavity-comprising three-dimensional ceramic substrate comprises a planar ceramic substrate; the three-dimensional ceramic substrate also comprises a metal cavity formed in the planar ceramic substrate; the planar ceramic substrate comprises a ceramic substrate; multiple independent circuits and annularcopper clad layers are arranged on the surface of the ceramic substrate in multi-row and multi-column arrangement; the metal cavity body comprises an electroplating bonding layer and a metal pore plate; the metal pore plate comprises metal sheets and hollow-out holes; the structures and dimensions of the hollow-out holes are matched with those of the annular copper clad layers; and the metal poreplate and the planar ceramic substrate are connected through the electroplating bonding layer. The invention also provides a preparation method of the three-dimensional ceramic substrate. The metal cavity-comprising three-dimensional ceramic substrate has high intensity, high heat resistance, corrosion resistance, a simple preparation process and low material cost.

Description

technical field [0001] The invention belongs to the technical field of electronic manufacturing, and more specifically relates to a three-dimensional ceramic substrate containing a metal cavity and a preparation method thereof. Background technique [0002] Compared with traditional lighting sources (incandescent lamps, fluorescent lamps, etc.), white LEDs (Light Emitting Diodes) have the advantages of high light efficiency, long service life, energy saving and environmental protection. At present, white LEDs generally use blue LED chips to excite yellow phosphors to obtain white light, such as figure 1 shown. Phosphor powder adhesive layer is generally prepared by coating process, due to phosphor precipitation (uneven concentration) or uneven thickness of the adhesive layer, there are problems such as spatial color uniformity of LED module light emission; in addition, in order to improve the light output efficiency of the module, usually Lenses were prepared by Molding pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/483H01L33/62H01L2933/0033H01L2933/0066
Inventor 陈明祥郝自亮程浩刘松坡
Owner 武汉利之达科技股份有限公司