Preparation method of high-thermal-conductivity low-specific-gravity flame-retardant organic silicon pouring sealant

Abstract

The invention provides a preparation method of a composite graphene high-thermal-conductivity low-specific-gravity flame-retardant organic silicon pouring sealant. A mixture is formed by mixing a component A and a component B in the weight ratio of 1:(1-2), the mixture is poured into equipment when the fluidity of the mixture remains, and then room-temperature curing molding or heating curing molding is conducted. The component A comprises, by weight, 47.4-61.6% of vinyl silicone oil, 3-12% of modified heat-conducting micro-powder, 0.4-0.6% of catalyst and 35-40% of flame-retardant agent. Thecomponent B comprises, by weight, 41.99-57.992% of vinyl silicone oil, 3-12% of graphene composite heat-conducting filler, 4-6% of hydrogen-containing silicone oil, 0.005-0.008% of inhibitor and 35-40% of flame-retardant agent. By means of surface treatment and compounding of different kinds of heat-conducting filler, the graphene composite heat-conducting filler is prepared, and the dispersion problem of the heat-conducting filler and organic silicon rubber is improved; the graphene composite heat-conducting filler can improve the heat-conducting performance of the organic pouring sealant; bysimulating different particle sizes and using compounds obtained according to different particle sizes, the organic silicon pouring sealant is high in thermal conductivity and low in specific gravity.

Description

technical field [0001] The invention belongs to the field of silicone potting glue production technology, and more specifically relates to a mixing technology of graphene and other thermally conductive fillers. Background technique [0002] Due to its excellent thermal conductivity, graphene has become a research hotspot in various industries. Silicone rubber is widely used in various fields due to its excellent electrical insulation, high and low temperature resistance, weather resistance and flame retardancy. As the density and integration of electronic components increase, resulting in greater power and more heat, the corresponding requirements for the thermal conductivity of potting adhesives are higher. Since silicone rubber does not have thermal conductivity, it is generally necessary to add a certain amount of thermal conductive filler, but the addition of pure thermal conductive filler is relatively large, and its compatibility with silicone rubber is poor. Such fi...

AI Technical Summary

Problems solved by technology

Since silicone rubber does not have thermal conductivity, it is generally necessary to add a certain amount of thermal conductivity filler, but the addition of pure thermal conductivity filler is relatively large, and the compatibility with silicone rubber is poor.

Such filling will affect the performance of silicone rubber after molding, reduce the mechanical properties of silicone rubber, reduce the adhesion, and increase the hardness.