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Fiber-reinforced copper graphite heat dissipation film and preparation method

A graphite heat dissipation film and fiber-reinforced technology, which is applied in chemical instruments and methods, cooling/ventilation/heating modification, modification through conduction and heat transfer, etc., can solve the problem of high equipment process operation requirements, unsuitable promotion, poor mechanical properties, etc. problem, to achieve the effect of improving thermal conductivity, strong machinability, and improving mechanical strength

Inactive Publication Date: 2018-04-13
TIANNUO PHOTOELECTRIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The Chinese invention application with the publication number CN105101758A discloses a natural graphite / copper composite heat sink and its preparation method, including a copper foil layer and graphite layers located on the upper and lower sides of the copper foil layer; The roughened layer on the upper and lower sides of the material; the surface of the roughened layer is uniformly distributed with a nodular copper particle structure; the roughened layer interlocks with the graphite layer through the nodular copper particle structure, but the invention is in the process of occluding the graphite layer and the roughened layer It is prone to breakage, has poor mechanical properties, and has high requirements for equipment and process operations, so it is not suitable for widespread promotion.

Method used

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  • Fiber-reinforced copper graphite heat dissipation film and preparation method
  • Fiber-reinforced copper graphite heat dissipation film and preparation method
  • Fiber-reinforced copper graphite heat dissipation film and preparation method

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Effect test

Embodiment 1

[0043] The fiber-reinforced copper-graphite heat dissipation film includes a fiber-reinforced graphite layer, a metal transition layer and a metal copper layer, wherein the fiber-reinforced graphite layer is: carbon fiber and natural graphite substrate are mixed uniformly according to the mass ratio of 10:90, and the temperature is 1100 ° C Rolling is carried out below, and the rolled carbon fiber reinforced graphite layer that obtains; Described fiber is that carbon fiber length is 5mm; Metal transition layer is nickel metal, and single-layer thickness is 0.1 μ m; The thickness of the layer was 50 μm.

[0044] The preparation method is:

[0045] S1. Dry the fiber-reinforced graphite layer at a temperature of 60°C for 24 hours, and then perform surface treatment on both sides for 2 minutes;

[0046] S2. Using a physical vapor deposition method, the fiber-reinforced graphite layer treated in step S1 is double-sided coated with metal transition layer metal nickel;

[0047] S3....

Embodiment 2

[0049] The fiber-reinforced copper-graphite heat dissipation film includes a fiber-reinforced graphite layer, a metal transition layer and a metal copper layer, wherein the fiber-reinforced graphite layer is: graphite fibers and synthetic graphite substrates are mixed uniformly according to the mass ratio of 30:70, and at a temperature of 1000 Rolling under ℃, the obtained flaky carbon fiber reinforced graphite layer; the fiber is a graphite fiber with a length of 20mm; the metal transition layer is a combination of silver and copper metal, and the single-layer thickness is 0.5 μm; the single-layer thickness of the metal copper layer is 0.5 μm. is 4 μm; the thickness of the fiber reinforced graphite layer is 100 μm.

[0050] The preparation method is:

[0051] S1. Dry the fiber-reinforced graphite layer at a temperature of 80°C for 36 hours, and then perform plasma surface treatment on one side for 5 minutes;

[0052] S2. Using a vacuum evaporation method, one side of the fib...

Embodiment 3

[0055] The fiber-reinforced copper-graphite heat dissipation film includes a fiber-reinforced graphite layer, a metal transition layer and a metal copper layer, wherein the fiber-reinforced graphite layer is: carbon fiber and natural graphite substrate are mixed uniformly according to the mass ratio of 40:60, and the temperature is 900 ° C The carbon fiber reinforced graphite layer obtained by rolling is obtained; the fiber is a carbon fiber with a length of 10 mm; the metal transition layer is aluminum, and the single layer thickness is 0.3 μm; the single layer thickness of the metal copper layer is 10 μm; the fiber reinforced graphite The thickness of the layer is 200 μm.

[0056] The preparation method is:

[0057] S1. Dry the fiber-reinforced graphite layer at a temperature of 100°C for 36 hours, and then perform plasma surface treatment on one side for 10 minutes;

[0058] S2. Using a vacuum evaporation method, one side of the fiber-reinforced graphite layer treated in s...

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Abstract

The invention belongs to the technical field of new materials, and specifically relates to a fiber-reinforced copper-graphite heat dissipation film and a preparation method thereof. The fiber-reinforced copper-graphite heat dissipation film includes a fiber-reinforced graphite layer, a metal transition layer and a metal copper layer; the prepared by the present invention The fiber-reinforced copper-graphite heat dissipation film has good mechanical properties, good temperature resistance, low specific gravity, strong binding force, strong reworkability, good thermal conductivity in all directions, and the preparation method is simple, easy to operate, economical and environmentally friendly.

Description

technical field [0001] The invention belongs to the technical field of new materials, and in particular relates to a fiber-reinforced copper-graphite heat dissipation film and a preparation method thereof. Background technique [0002] When electronic products such as mobile phones, notebooks, and LED TVs are in use, their electronic components will continue to generate heat. If the heat cannot be exported or eliminated in time, it will lead to local high temperature of electronic components, which will seriously affect the operating efficiency and life of electronic equipment. It may even lead to fire or explosion accidents. With the development of electronic products with high power, thinner and larger screens, the high heat generated by them puts forward higher requirements for the heat dissipation of electronic components, and people pay more and more attention to the safety of electronic products. , a new type of heat dissipation material, lightweight copper graphite h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20B32B15/04B32B15/20B32B9/00B32B9/04C23C28/02
CPCH05K7/2039B32B9/007B32B9/04B32B15/04B32B15/20C23C28/021C23C28/023
Inventor 朱焰焰郑杰陈士冰杨亚宁
Owner TIANNUO PHOTOELECTRIC MATERIAL
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