Manufacturing method for high-purity aluminum rotating target

Abstract

The invention relates to a manufacturing method for a high-purity aluminum rotating target. The manufacturing method comprises the following steps of: selecting a high-purity aluminum circular ingot,and performing thermal perforating and extruding treatment on the high-purity aluminum circular ingot, thereby obtaining high-purity aluminum tube blank; straightening and performing annealing treatment; selecting an aluminum alloy as a target end head material, and performing surface hard oxidization treatment on the target end head material, thereby obtaining an aluminum alloy end head; and welding the aluminum alloy end head of the high-purity aluminum tube blank, thereby obtaining the high-purity aluminum rotating target. According to the high-purity aluminum rotating target manufactured by the manufacturing method, defects such as cracks, air holes, looseness, impurities and layering inside a microscopic structure are greatly reduced, the microscopic structure is fine and uniform, andthe grain size is not greater than 100 microns; a leakage rate value measured by a helium mass spectrum leakage detector is smaller than or equal to 5*10<-10> Pa.m<-3> / s; and dimensional tolerance and integral flatness form and location tolerance in the length direction, the width direction and the thickness direction are as low as 0.05 mm, surface roughness is smaller than Ra 0.4 micron, and processing precision meets user requirements.

Description

technical field [0001] The invention relates to the field of manufacturing TFT targets, in particular to a method for manufacturing high-purity aluminum rotating targets. Background technique [0002] High-purity aluminum usually refers to aluminum with a purity (aluminum content) greater than 99.8%. High-purity aluminum targets are indispensable coating materials for the thin-film transistor (TFT) industry, and are used for plating conductive layer films on glass substrates. At present, the high-purity aluminum target used by most magnetron sputtering coating manufacturers is a planar target, and its material utilization rate is very low, and only about 20% of the total mass is used; correspondingly, high-purity aluminum The utilization rate of the rotating target can reach about 75%. Moreover, if the life of the target is measured by KW*h, the life of the rotating target is about 5 times longer than that of the plane target. In recent years, with the continuous increase ...

AI Technical Summary

Problems solved by technology

This process can extrude high-purity aluminum tube blanks of the specifications mentioned by the inventor, but the maximum extrusion force of the extruder used is only 2500T, which significantly limits the production specifications and quality of the product.

First of all, this makes it impossible to produce tube blanks with an outer diameter of 172mm, an inner diameter of 125mm, and a length of 2850mm that are currently required by the domestic 8.5-generation magnetron sputtering production line; secondly, the low extrusion force leads to a small extrusion ratio of the material, and the tube blank The extrusion deformation is not easy to be uniform, and the grain size of the tube billet is not easy to be refined and uniform; third, the extrusion temperature is high, and it is naturally air-cooled after extrusion, and it is difficult to control the crystallization process of the material after extrusion deformation. grain growth

Therefore, according to this process, only high-purity aluminum rotating target blanks with a grain size of not less than 200 microns can be produced, but now domestic 8.5-generation line users generally require that the grain size of the tube blanks is not greater than 100 microns, and the grain size distribution It should be uniform on the whole; in addition, the two ends of the product of this process are made of high-purity aluminum material, the strength and hardness are too low and too soft, and it is easy to deform and wear during use; finally, the patent does not involve target production The necessary flaw detection, leak detection, vacuum and dust-free packaging and other processing processes in the follow-up process are not conducive to user use

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