Conductive-particle-free electromagnetic shielding film and preparation method thereof

An electromagnetic shielding film, non-conductive technology, applied in the direction of magnetic/electric field shielding, electrical components, etc., can solve the problems of complex process operation and large thickness, and achieve the effect of simple process, thin thickness, and reduced overall thickness

Inactive Publication Date: 2018-04-27
TIANNUO PHOTOELECTRIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of large product thickness and complicated process operation in the prior art, the invention discloses an electromagnetic shielding film without conductive particles and a preparation method thereof

Method used

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  • Conductive-particle-free electromagnetic shielding film and preparation method thereof
  • Conductive-particle-free electromagnetic shielding film and preparation method thereof
  • Conductive-particle-free electromagnetic shielding film and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0040] Embodiment 1: A structure of electromagnetic shielding film without conductive particles

[0041] structured as figure 1 , figure 2 , image 3 As shown, from bottom to top are carrier film (1), insulating layer (2), shielding layer (3), covering layer (4), adhesive layer (5), protective film (6); the covering Holes of different sizes are distributed on the surface of the layer (4); the shielding layer (3) is composed of a plane metal (31) and a convex metal (32), wherein the plane metal (31) is compounded on the insulating layer (2), and the convex The shape metal (32) is distributed in the holes (4) of the covering layer and is in contact with the plane metal (31).

Embodiment 2

[0042] Embodiment 2: An electromagnetic shielding film without conductive particles

[0043] Structure is as described in embodiment 1;

[0044] The dimensions are: the thickness of the carrier film (1) is 25 μm; the thickness of the insulating layer (2) is 6 μm; the thickness of the cover layer (4) is 0.1 μm; the thickness of the bonding layer (5) is 1 μm; the thickness of the protective film (6) is 150 μm; The thickness of the flat metal (31) is 0.1 μm; the height of the convex metal (32) is 5 μm; the hole diameter is 1-10 μm;

[0045] The material is: the carrier film is a PET film;

[0046] The insulating layer is composed of polymer material and silicon dioxide in a mass ratio of 1:1, and the polymer material is composed of epoxy resin and rubber in a mass ratio of 1:1;

[0047] The plane metal is copper, nickel alloy; the convex metal is copper;

[0048] The covering layer is composed of high molecular polymer and silicon surfactant in a mass ratio of 1:0.001; the hig...

Embodiment 3

[0056] Embodiment 3: An electromagnetic shielding film without conductive particles

[0057] Structure is identical with embodiment 1;

[0058] The dimensions are: the thickness of the carrier film (1) is 150 μm; the thickness of the insulating layer (2) is 5 μm; the thickness of the cover layer (4) is 0.5 μm; the thickness of the adhesive layer (5) is 2 μm; the thickness of the protective film (6) is 50 μm; The thickness of the plane metal (31) is 0.5 μm; the height of the convex metal (32) is 5 μm; the hole diameter is 40-50 μm;

[0059] The material is: the carrier film is a PI film;

[0060] The insulating layer is composed of polymer material and functional filler in a mass ratio of 5:1; the polymer material is composed of polyimide resin and polyurethane resin in a mass ratio of 2:1, and the functional filler is composed of silicon dioxide and aluminum nitride in a mass ratio of 2:1. Composition with a mass ratio of 1:1;

[0061] The plane metal is copper; the convex ...

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Abstract

The invention belongs to the technical field of new materials, and discloses an electromagnetic shielding film without conductive particles and a preparation method thereof. The structure of the electromagnetic shielding film is a carrier film, an insulating layer, a shielding layer, a covering layer, an adhesive layer, and a protective film in sequence. Holes of different sizes are distributed on the surface of the covering layer; the shielding layer is composed of a plane metal and a convex metal, wherein the plane metal is compounded on the insulating layer, and the convex metal is distributed in the holes of the covering layer and is in contact with the plane metal The electromagnetic shielding film without conductive particles prepared by the method of the present invention has the characteristics of thin thickness, high shielding performance, low grounding resistance, strong cohesiveness, and low cost, and can meet the needs of the integration of electronic products while being lighter and lighter. The urgent need for thin development.

Description

technical field [0001] The invention belongs to the technical field of new materials, and in particular relates to an electromagnetic shielding film without conductive particles and a preparation method thereof. technical background [0002] In recent years, with the wide application of flexible copper clad laminates (FPC), the integration of electronic product functions has promoted its development in the direction of high frequency and high speed, and the electromagnetic interference inside and outside the components caused by high frequency and high speed drive The problem is becoming more and more serious, and the requirements for electromagnetic shielding of electronic products are also getting higher and higher. [0003] In the prior art, most electromagnetic shielding films include a carrier film, an insulating layer, a shielding layer, a conductive adhesive layer, and a protective film. Among them, the conductive adhesive layer is made conductive and adhesive by add...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00
CPCH05K9/0084
Inventor 朱焰焰孙诗良郑杰郭文勇
Owner TIANNUO PHOTOELECTRIC MATERIAL
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