Miniature thermistor sensor packaging method
A technology of thermal probe and packaging method, applied in the field of thermal sensing, can solve the problems of prolonging the assembly cycle, reducing the production efficiency, affecting the insulation performance, etc., to achieve the effect of improving the electrical insulation performance, speeding up the filling speed, and improving the production efficiency
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[0019] The technical solutions of the present invention will be described below in conjunction with the accompanying drawings and embodiments.
[0020] Such as figure 1 As shown, a method for packaging a miniature thermal probe of the present invention includes a metal probe 1, a silicone head 11, a thermistor 2, a lead wire 22 and a positioning bracket 3,
[0021] The steps are as follows:
[0022] a, lead wire 22 is welded on the pin 21 of thermistor 2;
[0023] b. Assemble the silicone head 11 on the upper port of the metal probe 1, and inject a small amount of sealant into the metal probe 1 and the silicone head 11;
[0024] c. Assemble the thermistor 2 and the positioning bracket 3 into one body, wherein the pin 21 and the lead wire 22 of the thermistor 2 are installed in the bayonet of the positioning bracket 3, and the upper end of the positioning bracket 3 is set in conflict with the thermistor 2;
[0025] d. Grab the integrated structure of the thermistor 2 and the...
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