Low cost manufacturing method capable of fast and massively preparing integrated miniature film thermal-electric device

Abstract

The invention discloses a low cost manufacturing method capable of fast and massively preparing integrated miniature film thermal-electric devices; the method comprises the following steps: using a low cost thick negative photoresist dry film to replace a SU-8 negative epoxy resin base photoresist and other hard-to-process and remove photoresists as the template; using a conductive material with asmooth surface as the substrate; using a low-energy low cost exposure light source to combine the photoresist dry film with the conductive material, and making a microcell of P type and N type thermoelectricity legs in order; electrochemically depositing P type and a N type thermoelectricity leg arrays in order in the thermoelectric material microcell; finally removing the photoresist template, and transferring the thermoelectricity leg arrays to the insulation substrate; assembling and integrating the thermoelectricity leg arrays, thus finally preparing a random shape integrated miniature film thermal-electric device in a coiling type, a radial type, and a multilayer stacking type. The method is low in cost, simple in an operation process, uses the photoresist dry film as the electroplate template, and combines with the electrochemically depositing method, thus fast and massively preparing integrated film thermal-electric devices with low cost.

Description

Technical field: [0001] The invention relates to a low-cost manufacturing method capable of rapidly and mass-preparing integrated micro-film thermoelectric devices, which belongs to the field of processing and integration of thermoelectric energy conversion materials and micro-energy devices. Background technique: [0002] In recent years, with the demand for energy supply of microelectronic equipment, and compared with other power generation and cooling devices, thermoelectric devices have no mechanical moving parts, conduct electrons in solids, have no vibration and noise, and have long service life, and have attracted widespread attention. Traditional thermoelectric refrigeration devices are bulky, and thermoelectric legs are often completed by traditional machining processes such as casting, cutting, and welding. With the application of small electronic devices such as wearable electronic devices and small sensors, existing mechanical processing Thermoelectric devices ca...

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is that the traditional mechanical processing method of thermoelectric devices is not suitable for the preparation of micro-thin-film thermoelectric devices, which cannot reach the micron level, and the existing photolithographic preparation process of thin-film thermoelectric devices is too complicated and expensive

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