Gold-silver alloy composite bonding wire and manufacturing method thereof

A technology of gold-silver alloy and composite bond, which is applied in the field of bonding wire, can solve the problems that hinder the application and development of gold bonding wire, the low tensile strength of gold bonding wire, and the tensile strength is less than 5 grams force, and achieve excellent anti-vulcanization performance, Excellent anti-oxidation performance, enhance the effect of anti-aging ability

Active Publication Date: 2020-04-14
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the international gold price continues to rise, the price of gold bonding wires has also been rising, resulting in high cost of end products, which is not conducive to the improvement of competitiveness of enterprises; in addition, the tensile strength of gold bonding wires is low (for example, 20 microns in diameter The gold bonding wire, after welding, its maximum tensile strength is less than 5 grams), and the elongation is not easy to control; the above two factors have become the bottleneck hindering the application and development of gold bonding wire

Method used

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  • Gold-silver alloy composite bonding wire and manufacturing method thereof

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Embodiment 1

[0040] The gold-silver alloy composite bonding wire of the present embodiment comprises a core wire, a palladium pre-coating coated on the outside of the core wire, and a gold coating coated on the outside of the palladium pre-coating; the core wire contains 70% gold by weight, silver 30%; the thickness of the palladium pre-plating layer is 3nm; the thickness of the gold plating layer is 120nm.

[0041] In this embodiment, the manufacturing method of gold-silver alloy composite bonding wire comprises the following steps:

[0042] (1) Melting and casting: Gold and silver are mixed in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 8 mm is obtained;

[0043] (2) Wire drawing: draw the core wire obtained in step (1) to obtain a core wire with a diameter of 15-40 um (such as 20 um);

[0044] During the wire drawing process, the wire is subjected to intermediate annealing several times, and N is used in the annealing ...

Embodiment 2

[0064] The gold-silver alloy composite bonding wire of the present embodiment comprises a core wire, a palladium pre-coating coated on the outside of the core wire, and a gold coating coated on the outside of the palladium pre-coating; the core wire contains 81% gold by weight, silver 19%; the thickness of the palladium pre-plating layer is 1nm; the thickness of the gold plating layer is 180nm.

[0065] In this embodiment, the manufacturing method of gold-silver alloy composite bonding wire comprises the following steps:

[0066] (1) Melting and casting: Gold and silver are mixed in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 7 mm is obtained;

[0067] (2) Wire drawing: draw the core wire obtained in step (1) to obtain a core wire with a diameter of 15-40 um (such as 20 um);

[0068] During the wire drawing process, the wire is subjected to intermediate annealing several times, and N is used in the annealing ...

Embodiment 3

[0088] The gold-silver alloy composite bonding wire of the present embodiment comprises a core wire, a palladium pre-coating coated on the outside of the core wire, and a gold coating coated on the outside of the palladium pre-coating; the core wire contains 52% gold by weight, silver 48%; the thickness of the palladium pre-plating layer is 6nm; the thickness of the gold plating layer is 20nm.

[0089] In this embodiment, the manufacturing method of gold-silver alloy composite bonding wire comprises the following steps:

[0090] (1) Melting and casting: Gold and silver are mixed in proportion, and after vacuum melting and directional continuous casting process, a core wire with a diameter of 6 mm is obtained;

[0091] (2) Wire drawing: draw the core wire obtained in step (1) to obtain a core wire with a diameter of 15-40 um (such as 20 um);

[0092] During the wire drawing process, the wire is subjected to intermediate annealing several times, and N is used in the annealing p...

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Abstract

Provided in the invention is a gold-silver alloy composite bond wire being characterized by comprising a core wire, a palladium pre-plating layer coating the outside of the core wire, and a gold plating layer coating the outside of the palladium pre-plating layer. The core wire includes, by weight, 51- 82% of gold and 18-49% of silver. And the thickness of the palladium pre-plating layer is 1 to 6nm; and the thickness of the gold plating layer is 20 to 200nm. In addition, the invention also provides a manufacturing method of the gold-silver alloy composite bond wire. The gold-silver alloy composite bond wire has advantages of excellent oxidation-resistant and vulcanization-resistant performances, high tensile strength, good solder joint adhesion, and low manufacturing cost.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a gold-silver alloy composite bonding wire and a manufacturing method thereof. Background technique [0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; in terms of chemical composition, there are mainly copper wires (including bare copper wires, palladium-coated copper wires) , flash gold palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Another important direction is the development of gold alloy wires to further reduce...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/49H01L21/48C22F1/14C25D3/48C25D3/50
CPCC22F1/14C25D3/48C25D3/50H01L21/4889H01L23/49
Inventor 周振基周博轩于锋波彭政展麦宏全
Owner NICHE TECH KAISER SHANTOU
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