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UV delay-cured conductive silver adhesive and preparation method thereof

A technology of conductive silver glue and epoxy resin, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of high price, slow curing speed, and few types of oligomers and reactive diluents, and achieve Excellent performance and the effect of overcoming poor adhesion

Inactive Publication Date: 2018-06-08
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it also has the disadvantages of slow curing speed, few types of oligomers and reactive diluents, high price, and difficult adjustment of cured product properties, which limits its practical application.

Method used

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  • UV delay-cured conductive silver adhesive and preparation method thereof
  • UV delay-cured conductive silver adhesive and preparation method thereof
  • UV delay-cured conductive silver adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0043] (1) Preparation of semi-finished base material:

[0044] 20 parts of alicyclic epoxy resin containing 40% nano-silica, 10 parts of urethane acrylate CN-8004, 110 parts of flake silver powder, 20 parts of nano-rod silver powder, after stirring and dispersing the above materials at 1500 rpm Carry out three-roller grinding until the fineness is below 10um to make a semi-finished base material.

[0045] (2) Preparation of conductive silver glue:

[0046] 160 parts of semi-finished base material in (1), 5 parts of ethyl 2-(oxetan-3-yl) acetate, 4.5 parts of iodonium hexafluorophosphate, 20 parts of self-made photosensitizer, KH-560 coupling 1 part of the agent, after stirring the above materials at 1000 rpm to disperse evenly, defoam at -0.1MPa for 5 to 10 minutes to obtain the delayed curing conductive silver glue.

no. 2 Embodiment

[0048] (1) Preparation of semi-finished base material:

[0049] 20 parts of cycloaliphatic epoxy resin containing 40% nano-silica, 10 parts of acrylate epoxy resin CN-151, 110 parts of flaky silver powder, 20 parts of nano-rod silver powder, stir and disperse the above materials at 1500 rpm After uniformity, carry out three-roll machine grinding, and finally until the fineness is below 10um, it is made into a semi-finished base material.

[0050] (2) Preparation of conductive silver glue:

[0051]160 parts of semi-finished base material in (1), 5 parts of 3-hydroxymethyl-1-oxetane, 4.5 parts of triaryl hexafluorosulfonium antimonate, 20 parts of self-made photosensitizer, titanate coupling 1 part of the agent, after stirring the above materials at 1000 rpm to disperse evenly, defoam at -0.1MPa for 5 to 10 minutes to obtain the delayed curing conductive silver glue.

no. 3 Embodiment

[0053] (1) Preparation of semi-finished base material:

[0054] 20 parts of cycloaliphatic epoxy resin containing 40% nano-silica, 10 parts of acrylate oligomer CN-307, 110 parts of flaky silver powder, 10 parts of nano-rod silver powder, and stir the above materials at 1500 rpm After the dispersion is uniform, it is ground by a three-roll machine until the fineness is below 10um to make a semi-finished base material.

[0055] (2) Preparation of conductive silver glue:

[0056] 160 parts of semi-finished base material in (1), 4.5 parts of ethyl 2-(oxetan-3-yl) acetate, 5 parts of triaryl hexafluorosulfonium antimonate salt, 20 parts of self-made photosensitizer, KH- 1.5 parts of 570 coupling agent, after stirring the above materials at 1000 rpm to disperse evenly, defoaming at -0.1MPa for 5 to 10 minutes to obtain delayed curing conductive silver glue.

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Abstract

The invention relates to UV delay-cured conductive silver adhesive and a preparation method thereof. Assembly of components can be performed after irradiation of UV light is conducted, and the conductive silver adhesive can be self-cured after assembly is conducted. The UV delay-cured conductive silver adhesive mainly comprises cycloaliphatic epoxy resin, a toughening agent, epoxy reactive diluent, cationic photoinitiator, self-made photosensitizer, a coupling agent, dispersant and conductive particles, and the preparation method comprises the steps of: mixing the materials, and performing stirring, grinding and dispersing so as to obtain the UV delay-cured conductive silver adhesive. Compared with an existing technology, the curing rate of the conductive adhesive can be delayed by 40-50 minutes, and the obtain conductive adhesive after curing has good adhesion, solvent resistance, low electrical resistivity and good adhesion to metal materials; the conduction adhesive is mainly applied to flexible solar thin film, and is a new electronic connection material.

Description

technical field [0001] The invention relates to a UV delayed curing conductive silver glue and a preparation method thereof. Background technique [0002] At present, the conductive silver glue that appears on the market is basically made by filling conductive powder into the provided adhesive. It is an adhesive that can not only bond, but also have electrical and thermal conductivity. [0003] UV curing conductive silver glue is generally divided into two types, one is UV acrylic system, and the other is UV cationic epoxy system. In the free radical polymerization initiated by UV, the free radical photocuring system has the advantages of fast curing speed and easy performance adjustment, but it also has problems such as serious shrinkage, low precision, poor adhesion, etc., especially for free radical chain deactivation or termination. There are more opportunities, and when the light stops, the possibility of continuing polymerization and curing is less. At the same time, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/06C09J11/04C09J9/02
CPCC08K2003/0806C08K2201/001C08K2201/011C08K2201/014C09J9/02C09J11/04C09J11/06C09J11/08C09J163/00C08L75/14C08K13/02C08K3/36C08K3/08C08K5/1525
Inventor 王守立王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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