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362 results about "Electron acceleration" patented technology

An electron has a constant acceleration of. An electron has a constant acceleration of +3.2 m/s^2. At a certain instant its velocity is 9.6 m/s.

Measuring system for nA/pA electronic beam current of impulse electron accelerator

InactiveCN101470208ASolve the collection efficiency problemSolve beam measurement problemsX/gamma/cosmic radiation measurmentHigh energyElectron radiation
The invention relates to a pulse electronic accelerator nano-pico ampere electron beam flow measuring system, relating to an electronic accelerator pulse electron beam flow measuring system, in particular to the nano-pico (10-10A/cm2) micro beam flow measurement of millisecond pulse, belonging to the electron radiation environment ground simulation and test field. The pulse electronic accelerator nano-pico ampere electron beam flow measuring system is composed of a novel inclined-bottom faraday cup, three coaxial cables and a nano-pico level current amplifier. The measurement result can be obtained by oscilloscope or data acquisition card. The inclined-bottom faraday cup electron collection system resolves the collection efficiency problem of high energy electrons (MeV), to improve collection efficiency. The adopted three coaxial cables can reduce the interference of electromagnetic field. The nano-pico ampere level current amplifier resolves the stable current linear amplification problem under electron radiation, and converts weak current signals to voltage signals, thus being convenient for data acquisition of oscilloscope or data acquisition card. The invention resolves the measurement problem of nano-pico ampere pulse electron beam flow, to confirm the accuracy, real-time property and easy use of measurement.
Owner:NO 510 INST THE FIFTH RES INST OFCHINA AEROSPAE SCI & TECH

Low-energy scanning electron microscope system, scanning electron microscope system and sample detection method

The present invention discloses a low-energy scanning electron microscope system. The low-energy scanning electron microscope system comprises an electronic source configured to generate an electron beam; an electronic acceleration structure configured to add the motion speed of the electron beam; a compound objective lens configured to perform collection of electronic beams accelerated through the electronic acceleration structure; a deflection device configured to change the movement direction of the electronic beams; a detection device comprising a first sub detection device configured to receive secondary electrons and backscattered electrons generated on the samples, a second sub detection device configured to receive the backscattered electrons and a control device configured to change the movement directions of the secondary electrons and the backscattered electrons; and an electric lens comprising the second sub detection device, a sample table and a control electrode and configured to reduce the movement speed of the electronic beams and change the movement directions of the secondary electrons and the backscattered electrons. The present invention further discloses a scanning electron microscope system and a sample detection method.
Owner:FOCUS E BEAM TECH BEIJING CO LTD

Device and method for controlling focussed electron beams

InactiveUS6943507B2Sacrificing controlWithout sacrificing controlDischarge tube luminescnet screensLamp detailsBeam sourceControl electronics
The invention provides a focussing electron beam device with a single or an array of field emitter beam sources to generate electron beams with field emitter beam sources, at least one anode capable of accelerating the electrons of the electron beams towards a specimen, focussing components capable of focussing the electron beams onto the specimen and a control circuit that a) senses for deviations of the actual current values of the electron beams from desired current values; b) controls first voltages V1 to adjust the actual current values of the electron beams to the desired current values and c) controls second voltages V2 to adjust the actual focus positions of the electron beams to the desired focus positions. The voltage control circuit adjusts the actual current values of the electron beams to the desired current values and makes it possible to adjust the current values of an array of electron beams to a single value. Furthermore, a focussing electron beam device is disclosed with an array of field emitter beam sources integrated onto a substrate, which makes it possible to have arrays of field emitter beam sources with thousands or even millions of field emitter beam sources. With the integration of the control circuits for each field emitter beam source it is possible to adjust the current values and focus positions of each electron beam individually. Furthermore, methods are disclosed describing the operation of a single field emitter beam source or an array of field emitter beam sources.
Owner:ICT INTEGRATED CIRCUIT TESTING GESELLSCHAFT FUER HALBLEITERPRUEFTECHNIK GMBH

Linear array micro-nano focus X-ray source for micro-nano CT (computer tomography) system

The linear array micro-nano focus X-ray source for a micro-nano CT system. The linear array micro-nano focus X-ray source for the micro-nano CT system comprises cathodes 2, grids 3, anodes 4, focusing electrodes 5, magnetic solenoids 7, deflecting electrodes 8 and a target 9; the cathodes are used for producing electrons, the anodes are used for electron acceleration, the grids are arranged between the anodes and the cathodes and used for adjusting beam intensity of electron emitted by the cathodes, the focusing electrodes are used for completing first-time focusing of accelerated electrons, the magnetic solenoids are used for completing second-time focusing of the electrons, and the deflecting electrodes are used for controlling the position that the electrons hit on the target. By means of the linear array micro-nano focus X-ray source for the micro-nano CT system, static CT scanning can be achieved, namely, a radiation source, an object to be detected and a detector are all in a static state, electron beam scanning substitutes for mechanical scanning, thus error caused by mechanical scanning can be avoided, small external disturbance, small size, light weight and fast detection speed can be obtained, and linear array micro-nano focus X-ray source for the micro-nano CT system can be applied to CT systems of different types.
Owner:CHONGQING UNIV

System and method for in-situ testing of internal electric charge and electric field distribution of dielectric material

InactiveCN102944763ADoes not affect high voltage pulse signalUndisturbedElectrostatic field measurementsSolenoid valveHigh energy
The invention relates to a system and method for in-situ testing of internal electric charge and electric field distribution of a dielectric material and belongs to the field of measurement. The system comprises a vacuum tank, a top electrode, a solenoid valve, a vacuum-pumping system, a direct-current high-voltage power supply, a testing signal line, an industrial personal computer, an oscilloscope, a shielding flange, a high-voltage nanosecond pulse generator, a space charge detector main machine and an electron accelerator. The method comprises the steps of enabling high-energy electrons to pass through electrode holes to be filled onto the surface of a sample through the electron accelerator, recording tested wave forms through the oscilloscope and the industrial personal computer, and performing data processing to calibrated wave forms recorded by the industrial personal computer and tested wave forms to obtain the electric charge distribution in the sample. The system and the method can perform in-situ monitoring to the internal electric charge and the electric field distribution produced by produced by a space high-energy electron jetting-in space material simulated on the ground. Errors caused by measurement of the sample subjected to irradiation are avoided, and a test signal is not interfered.
Owner:NO 510 INST THE FIFTH RES INST OFCHINA AEROSPAE SCI & TECH

Thin-wall crosslink low smoke cables for ships communication or control signal and preparation method thereof

The invention relates to a thin-wall crosslink low smoke cable for ships communication or control signal and a preparation method thereof. The cable structure is that the outer layer of a multi-strandconductor is an insulating layer, the outer layer of the insulating layer is a shielding layer, the outer layer of the shielding layer is a lapped covering, the outer layer of the lapped covering isarmor, and the outer layer of the armor is a sheathed layer. The preparation method is as follows: a line-cable stranding machine strands tin plated copper wire as a conductor; an extruder is utilizedto manufacture the insulating layer outside the conductor, the insulating layer is subjected to irradiation and crosslinking by an electron accelerator; a cable former is ustilized to strand insulated wires together; the shielding layer and the armor are braided by utilizing a braiding machine; and the sheathed layer is manufactured by the extruder, and the sheathed layer is subjected to irradiation and crosslinking by the electron accelerator. The thin-wall crosslink low smoke cable has the advantages of small outside diameter, light weight, ageing resistance, tear resistance, heat oil resistance, high flame retardancy, low smoke, no halogen, low toxicity and good ability of keeping excellent electrical performance and mechanical property in hostile environment, wherein the weight of thethin-wall crosslink low smoke cable is 30%-45% lighter than that of common cables.
Owner:NANJING QUANXIN CABLE TECH

Measuring equipment of electron accelerator output beam parameter

The invention provides measuring equipment of an electron accelerator output beam parameter. The measuring equipment comprises: an electron absorption board (8) and a plurality of electron absorption rods (7), wherein the each electron absorption rod is insulated with other components. The electron absorption rods possess a same rectangular section which is parallel to the electron absorption board. A length direction is parallel to the width direction of an accelerator scanning output window (11). Side surfaces with the same width of the electron absorption rods are vertical to an electron ray direction which is located in a position of the electron absorption rods. The electron absorption board and each electron absorption rod are connected to a current measurement device through leads respectively. Compared to the prior art, by using the measuring equipment of the invention, the electron beam energy measurement is integrated with the scanning uniformity measurement. Therefore, amounts of the accelerator output beam, a spectral distribution situation, the scanning uniformity can be simultaneously determined. The equipment and the apparatus needed by electron beam output parameter measurement can be simplified. In the prior art, the different apparatuses are needed by the electron beam energy measurement and the electron beam scanning uniformity measurement. By using the measuring equipment of the invention, the above problem can be solved.
Owner:广东雷大科技有限公司

Device for treating waste water by electron beam irradiation method

The invention discloses a device for treating waste water by an electron beam irradiation method, which comprises a waste water collecting pool, an irradiation preparing pool, an irradiation treating pool, and a clear water pool which are communicated by water conveying pipes orderly; an electron accelerator is disposed right above the irradiation treating pool; each water conveying pipe is equipped with a water pump; a sinking-mode irradiation flowing water trough is disposed in the center of a pool cover of the irradiation treating pool; uniformly-arranged flowing water trough water inlets are disposed at the bottom surface of the irradiation flowing water trough; waste water to be treated spews upwards and flows into the irradiation flowing water trough from the flowing water trough water inlets; water-distributing pipelines are disposed below the irradiation flowing water trough; flowing water trough water outlets are uniformly arranged at the trough bottom of the irradiation treating pool; the flowing water trough water outlets are communicated with the irradiation treating pool; switch valves are mounted on the flowing water trough water outlets; when the switch valves are open, water treated by the electron beam irradiation method flows into the irradiation treating pool. The invention has high treatment efficiency for industrial organic waste water, can effectively solve the problem of industrial water pollution, has a simple structure, is safe and reliable, and has low treatment cost.
Owner:SHANGHAI UNIV

Method for handling high current pulsed electron beams (HCPEB) on surface of hard alloy cutter

The invention discloses a method for handling high current pulsed electron beams (HCPEB) on the surface of a hard alloy cutter, belonging to the technical field of handling the surfaces of materials. The method is characterized by comprising the following steps: cleaning the surface of the hard alloy cutter, fixing the hard alloy cutter on a worktable, and vacuumizing to a pre-working value. According to modification requirements of a cutter to be handled, the working parameters of the HCPEB (High Current Pulsed Electron Beam) is selected and include electron accelerating voltage, pulse lasting time, energy density, pulse interval time, handling times and the like. Finally, the HCPEB is operated to carry out processing and handling on the parts needed to be handled on the surface of the hard alloy cutter. After handling is finished, the vacuum exhaust is carried out to take out the cutter. The method has the beneficial effects of improving the surface performance and the service life of the hard alloy cutter, overcoming the problems of complicated process, poor binding force of a coating and a substrate, high cost and the like existing in the prior art, and being simple in handling process and stable for quality control. The handled surface tissues of the cutter are uniform and refined, and the modified layer is deep.
Owner:DALIAN UNIV OF TECH
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