Organosilicon hybrid solid-crystal adhesive for light-emitting diodes (LEDs)

A technology of crystal-bonding glue and silicone, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of reduced service life, inability to apply, poor yellowing resistance of epoxy groups, etc., to achieve Improve yellowing resistance and weather resistance, avoid cracking in later use, and improve yellowing resistance

Inactive Publication Date: 2018-06-08
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silicone crystal-bonding adhesive has excellent yellowing resistance, good weather resistance, non-corrosiveness, and high light transmittance, but the adhesion is much worse than epoxy, and the price is high; epoxy crystal-bonding adhesive has good adhesion Relay, can meet the bonding requirements of all sizes of chips, the price is excellent and cheap, but the epoxy group has poor yellowing resistance, and after a period of use, the brightness will be greatly reduced, affecting the light extraction efficiency of the final product and reducing the service life. It cannot be applied to high-end LED products

Method used

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  • Organosilicon hybrid solid-crystal adhesive for light-emitting diodes (LEDs)
  • Organosilicon hybrid solid-crystal adhesive for light-emitting diodes (LEDs)
  • Organosilicon hybrid solid-crystal adhesive for light-emitting diodes (LEDs)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Take by weighing 63g of epoxy-modified phenyl silicone resin as structural formula (1); 17g of toughening agent as structural formula (2), wherein m=2, n=2; 2-hydroxyl-4-n-octyloxydiphenyl Methanone 0.5g; β-(3,5-di-tert-butyl-4-hydroxyphenyl) octadecyl propionate 0.7g; DBU-quaternary phosphonium salt 0.4g; methyl hexahydrophthalic anhydride 1g 2 g of polyhydrogenated-variety-substituted isobenzofuran carboxylic acid, 2 g of R974 white carbon black; add in sequence and mix evenly to obtain silicone crystal-bonding glue.

Embodiment 2

[0036] Weigh 60 g of epoxy-modified phenyl silicone resin such as structural formula (1); 20 g of toughening agent such as structural formula (2), wherein m=3, n=3; 2-(2`-hydroxyl-5'-methanol 0.8g of phenyl)benzotriazole; 0.5g of three (2,4-di-tert-butylphenyl) phosphite; 0.3g of DBU-quaternary phosphonium salt; 0.8g of methyl hexahydrophthalic anhydride; 7g of polyhydrogenated-variety-substituted isobenzofuran carboxylic acid; 1.5g of R974 white carbon black; add in sequence and mix evenly to obtain silicone crystal-bonding glue.

Embodiment 3

[0038] Weigh 58g of epoxy-modified phenyl silicone resin such as structural formula (1); 20g of toughening agent such as structural formula (2), wherein m=4, n=4; 2-(2`-hydroxyl-5'-methanol phenyl) benzotriazole 1g; N,N'-1,6-hexylidene-di-[3,5-di-tert-butyl-4-hydroxyphenylpropanamide 1g; DBU-quaternary phosphonium salt 0.2g; 0.5 g of methylhexahydrophthalic anhydride; 6 g of polyhydro-diversified isobenzofuran carboxylic acid; 1 g of R974 white carbon black; add in sequence and mix evenly to obtain silicone crystal-bonding glue.

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Abstract

The invention relates to organosilicon hybrid solid-crystal adhesive for light-emitting diodes (LEDs). The organosilicon hybrid solid-crystal adhesive is prepared from the following raw materials in parts by weight: 58-63 parts of epoxy modified phenyl organosilicon resin, 17-22 parts of a toughening agent, 0.5-1 part of an ultraviolet (UV)-resistant agent, 0.5-1 part of an antioxidant, 0.2-0.4 part of an accelerator, 0.5-1 part of a curing agent A, 6-8 parts of a curing agent B and 1-2 parts of a thixotropic agent. All the reactive groups in the phenyl organosilicon resin are replaced with epoxy groups, and a cross-linking reaction is completed in a way of epoxy ring-opening addition curing, so that the adhesiveness of the solid-crystal adhesive is improved; furthermore, a main body stillhas an Si-O-Si structure and contains a certain amount of phenyl, so that the yellowing resistance of the product is guaranteed; the UV-resistant agent and the antioxidant are added, so that the yellowing resistance and weather resistance of the product are further improved; by controlling the proportions of the accelerator and the curing agents, the operating time is enabled to be longer at theroom temperature.

Description

technical field [0001] The invention relates to an epoxy-modified silicone LED crystal-bonding glue, which belongs to the field of modified silicone adhesives. technical background [0002] With the gradual prosperity of the LED market, the demand and requirements for LED die-bonding adhesives are also gradually increasing. There are two main types of die-bonding adhesives currently used in the market: silicone die-bonding adhesives and epoxy die-bonding adhesives. Silicone crystal-bonding adhesive has excellent yellowing resistance, good weather resistance, non-corrosiveness, and high light transmittance, but the adhesion is much worse than epoxy, and the price is high; epoxy crystal-bonding adhesive has good adhesion Relay, can meet the bonding requirements of all sizes of chips, the price is excellent and cheap, but the epoxy group has poor yellowing resistance, and after a period of use, the brightness will be greatly reduced, affecting the light extraction efficiency o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/06C09J11/04C09J11/06C09J11/08
CPCC08L2205/025C09J11/04C09J11/06C09J11/08C09J183/06C08L83/06C08K13/02C08K5/132C08K5/1345C08K3/36C08K5/3475C08K5/526C08K5/20
Inventor 孙刚陈维
Owner YANTAI DARBOND TECH
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